JP5807653B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5807653B2 JP5807653B2 JP2013063793A JP2013063793A JP5807653B2 JP 5807653 B2 JP5807653 B2 JP 5807653B2 JP 2013063793 A JP2013063793 A JP 2013063793A JP 2013063793 A JP2013063793 A JP 2013063793A JP 5807653 B2 JP5807653 B2 JP 5807653B2
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- 239000004065 semiconductor Substances 0.000 title claims description 57
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000012535 impurity Substances 0.000 claims description 27
- 150000002500 ions Chemical class 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 238000005468 ion implantation Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- -1 boron ions Chemical class 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
- H01L21/046—Making n or p doped regions or layers, e.g. using diffusion using ion implantation
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
- H01L29/0623—Buried supplementary region, e.g. buried guard ring
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
Description
第1工程では、半導体ウェハ900に、その短手方向の端部が中央部よりも深い底部を有するトレンチ971を形成する。図2に示す半導体ウェハ900に、ドライエッチングを行い、図3に示すように、トレンチ971を形成する。プロセスガスとしては塩素成分を含有するガスを好適に用いることができる。これによって、図3に示すように、トレンチ971を形成することができる。トレンチ971の底部は、短手方向(x方向)に中央部972および端部974を有している。端部974は、中央部972よりも半導体ウェハ900の深い位置(z軸の負方向となる位置)まで伸びている。中央部972は、ほぼ平坦であり、端部974は、その最も深い部分から中央部972に向かって傾斜している。トレンチ971を形成する際の条件の一例を挙げると、プロセスガスとしてCl2/O2/Ar=50/50/100の混合ガスを用いて、ガス圧力を30mTorr〜200mTorrとし、RF周波数を380kHz〜13.56MHzとする条件を挙げることができる。
第2工程では、フローティング層105を形成するために、トレンチの底部に、p型の不純物イオンを注入する。まず、図4に示すように、トレンチ971の底部にp型の不純物イオンを注入する。注入した不純物イオンは、底部970の形状に合わせて拡散し、図5に示すように、端部974および中央部972の周りにp型イオンが拡散する領域981が形成される。トレンチ971の端部974の周りにp型イオンが拡散するため、領域981は、x方向に広く拡散する。その結果、隣接するトレンチ971の底部に設けられる領域981の間隔は、従来と比較して狭くなる。
第3工程では、トレンチ971の短手方向の中央部972を深くする。まず、図5に示す半導体ウェハ900に、ドライエッチングを行う。これによって、図6に示すように、トレンチ971の中央部972を選択的にエッチングして、その底部922が端から中央に向かって緩やかに深くなっているトレンチ921を形成する。プロセスガスとしてはSF6を含有するガスを好適に用いることができる。トレンチ921を形成する際の条件の一例を挙げると、プロセスガスとしてSF6/O2=50/50の混合ガスを用いて、ガス圧力を30mTorr〜200mTorrとし、RF周波数を380kHz〜13.56MHzとする条件を挙げることができる。
第4工程では、トレンチ921の底部に、第2導電型の不純物イオンを注入する。次に、図7に示すように、トレンチ921の底部にp型の不純物イオンを注入する。不純物イオンは、底部922の形状に合わせて拡散し、図8に示すように、p型イオンが拡散する領域985が形成される。領域985は、トレンチ921のx方向の端側から中央側に向けて緩やかに深くなっている。トレンチ921の底部922は、短手方向の中央位置付近において最も深くなっているため、底部922の短手方向の中央位置において半導体ウェハ900のより深い位置まで伸びる。
100 :半導体基板
101 :ドレイン層
102 :ドリフト層
103 :ボディ層
104 :ソース層
105 :フローティング層
120 :トレンチゲート
121,971,921 :トレンチ
122 :ゲート絶縁膜
123 :ゲート電極
131 :裏面電極
132 :表面電極
135 :絶縁膜
900 :半導体ウェハ
922,970 :底部
972 :中央部
974 :端部
Claims (1)
- 第1導電型のドレイン層と、
ドレイン層の表面に接する第1導電型のドリフト層と、
ドリフト層の表面に接する第2導電型のボディ層と、
ボディ層の表面の一部に設けられた第1導電型のソース層と、
ドリフト層に周囲を囲まれている第2導電型のフローティング層と、を備え、炭化ケイ素を材料とする半導体基板と、
トレンチの内壁に形成されたゲート絶縁膜と、ゲート絶縁膜の内側に配置されたゲート電極とを備え、底部がフローティング層に接するトレンチゲートと、
を備えた半導体装置の製造方法であって、
半導体ウェハに、その長手方向に垂直な短手方向の端部が中央部よりも深い底部を有するトレンチを形成する第1工程と、
第1工程の後で、トレンチの底部に、第2導電型の不純物イオンを注入する第2工程と、
第2工程の後で、トレンチの短手方向の中央部を深くする第3工程と、
第3工程の後で、トレンチの底部に、第2導電型の不純物イオンを注入し、中央部が端部よりも深い底部を有するフローティング層を形成する第4工程と、を含む、半導体装置の製造方法。
Priority Applications (2)
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JP2013063793A JP5807653B2 (ja) | 2013-03-26 | 2013-03-26 | 半導体装置の製造方法 |
US14/201,096 US9178033B2 (en) | 2013-03-26 | 2014-03-07 | Manufacturing method of semiconductor device |
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JP2013063793A JP5807653B2 (ja) | 2013-03-26 | 2013-03-26 | 半導体装置の製造方法 |
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JP2014192200A JP2014192200A (ja) | 2014-10-06 |
JP5807653B2 true JP5807653B2 (ja) | 2015-11-10 |
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JP (1) | JP5807653B2 (ja) |
Families Citing this family (4)
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JP6280057B2 (ja) * | 2015-01-15 | 2018-02-14 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP2019046991A (ja) * | 2017-09-04 | 2019-03-22 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN107845581A (zh) * | 2017-11-02 | 2018-03-27 | 中电科技集团重庆声光电有限公司 | 一种低漏源通态电阻的umos器件结构及制备方法 |
US11233125B2 (en) | 2018-08-09 | 2022-01-25 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device |
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JP3692063B2 (ja) | 2001-03-28 | 2005-09-07 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP4538211B2 (ja) | 2003-10-08 | 2010-09-08 | トヨタ自動車株式会社 | 絶縁ゲート型半導体装置およびその製造方法 |
US7470953B2 (en) * | 2003-10-08 | 2008-12-30 | Toyota Jidosha Kabushiki Kaisha | Insulated gate type semiconductor device and manufacturing method thereof |
JP4453671B2 (ja) * | 2006-03-08 | 2010-04-21 | トヨタ自動車株式会社 | 絶縁ゲート型半導体装置およびその製造方法 |
JP5135885B2 (ja) * | 2007-05-24 | 2013-02-06 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
JP2009164558A (ja) * | 2007-12-10 | 2009-07-23 | Toyota Central R&D Labs Inc | 半導体装置とその製造方法、並びにトレンチゲートの製造方法 |
JP4577355B2 (ja) * | 2007-12-26 | 2010-11-10 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
WO2011039888A1 (ja) * | 2009-10-01 | 2011-04-07 | トヨタ自動車株式会社 | 半導体装置 |
JP5510309B2 (ja) * | 2010-12-22 | 2014-06-04 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
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US20140295633A1 (en) | 2014-10-02 |
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