JP2019079923A5 - - Google Patents

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Publication number
JP2019079923A5
JP2019079923A5 JP2017205400A JP2017205400A JP2019079923A5 JP 2019079923 A5 JP2019079923 A5 JP 2019079923A5 JP 2017205400 A JP2017205400 A JP 2017205400A JP 2017205400 A JP2017205400 A JP 2017205400A JP 2019079923 A5 JP2019079923 A5 JP 2019079923A5
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JP
Japan
Prior art keywords
polishing
substrate
film thickness
sensor
detection sensor
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JP2017205400A
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English (en)
Japanese (ja)
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JP2019079923A (ja
JP6847811B2 (ja
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Priority claimed from JP2017205400A external-priority patent/JP6847811B2/ja
Priority to JP2017205400A priority Critical patent/JP6847811B2/ja
Priority to SG10201809265VA priority patent/SG10201809265VA/en
Priority to KR1020180125837A priority patent/KR102312551B1/ko
Priority to TW107137221A priority patent/TWI748133B/zh
Priority to US16/166,946 priority patent/US11260496B2/en
Priority to CN201811234579.2A priority patent/CN109702560B/zh
Publication of JP2019079923A publication Critical patent/JP2019079923A/ja
Publication of JP2019079923A5 publication Critical patent/JP2019079923A5/ja
Publication of JP6847811B2 publication Critical patent/JP6847811B2/ja
Application granted granted Critical
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JP2017205400A 2017-10-24 2017-10-24 研磨方法および研磨装置 Active JP6847811B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017205400A JP6847811B2 (ja) 2017-10-24 2017-10-24 研磨方法および研磨装置
SG10201809265VA SG10201809265VA (en) 2017-10-24 2018-10-19 Polishing method and polishing apparatus
US16/166,946 US11260496B2 (en) 2017-10-24 2018-10-22 Polishing method and polishing apparatus
TW107137221A TWI748133B (zh) 2017-10-24 2018-10-22 研磨方法及研磨裝置
KR1020180125837A KR102312551B1 (ko) 2017-10-24 2018-10-22 연마 방법 및 연마 장치
CN201811234579.2A CN109702560B (zh) 2017-10-24 2018-10-23 研磨方法及研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017205400A JP6847811B2 (ja) 2017-10-24 2017-10-24 研磨方法および研磨装置

Publications (3)

Publication Number Publication Date
JP2019079923A JP2019079923A (ja) 2019-05-23
JP2019079923A5 true JP2019079923A5 (enExample) 2020-05-14
JP6847811B2 JP6847811B2 (ja) 2021-03-24

Family

ID=66170416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017205400A Active JP6847811B2 (ja) 2017-10-24 2017-10-24 研磨方法および研磨装置

Country Status (6)

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US (1) US11260496B2 (enExample)
JP (1) JP6847811B2 (enExample)
KR (1) KR102312551B1 (enExample)
CN (1) CN109702560B (enExample)
SG (1) SG10201809265VA (enExample)
TW (1) TWI748133B (enExample)

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US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN110587472B (zh) * 2019-08-30 2020-09-01 重庆智能机器人研究院 一种打磨调试系统
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
CN111702653B (zh) * 2020-05-15 2021-11-19 西安交通大学 一种平面光学元件行星式研磨装置及研磨方法
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
US11931853B2 (en) 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
CN113161268A (zh) * 2021-05-11 2021-07-23 杭州众硅电子科技有限公司 标定抛光头和装卸台位置的装置、抛光设备及标定方法

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US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
JPH1076464A (ja) 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
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