KR102312551B1 - 연마 방법 및 연마 장치 - Google Patents

연마 방법 및 연마 장치 Download PDF

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Publication number
KR102312551B1
KR102312551B1 KR1020180125837A KR20180125837A KR102312551B1 KR 102312551 B1 KR102312551 B1 KR 102312551B1 KR 1020180125837 A KR1020180125837 A KR 1020180125837A KR 20180125837 A KR20180125837 A KR 20180125837A KR 102312551 B1 KR102312551 B1 KR 102312551B1
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South Korea
Prior art keywords
polishing
film thickness
substrate
sensor
wafer
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KR1020180125837A
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English (en)
Korean (ko)
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KR20190045856A (ko
Inventor
게이타 야기
유키 와타나베
도시미츠 사사키
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20190045856A publication Critical patent/KR20190045856A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020180125837A 2017-10-24 2018-10-22 연마 방법 및 연마 장치 Active KR102312551B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-205400 2017-10-24
JP2017205400A JP6847811B2 (ja) 2017-10-24 2017-10-24 研磨方法および研磨装置

Publications (2)

Publication Number Publication Date
KR20190045856A KR20190045856A (ko) 2019-05-03
KR102312551B1 true KR102312551B1 (ko) 2021-10-14

Family

ID=66170416

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180125837A Active KR102312551B1 (ko) 2017-10-24 2018-10-22 연마 방법 및 연마 장치

Country Status (6)

Country Link
US (1) US11260496B2 (enExample)
JP (1) JP6847811B2 (enExample)
KR (1) KR102312551B1 (enExample)
CN (1) CN109702560B (enExample)
SG (1) SG10201809265VA (enExample)
TW (1) TWI748133B (enExample)

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* Cited by examiner, † Cited by third party
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MX2021011834A (es) 2019-03-29 2022-02-22 Saint Gobain Abrasives Inc Soluciones de rectificación de rendimiento.
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN110587472B (zh) * 2019-08-30 2020-09-01 重庆智能机器人研究院 一种打磨调试系统
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
CN111702653B (zh) * 2020-05-15 2021-11-19 西安交通大学 一种平面光学元件行星式研磨装置及研磨方法
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
WO2022187105A1 (en) * 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
CN113161268A (zh) * 2021-05-11 2021-07-23 杭州众硅电子科技有限公司 标定抛光头和装卸台位置的装置、抛光设备及标定方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2009255184A (ja) 2008-04-11 2009-11-05 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2012138442A (ja) 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
JP2015100911A (ja) 2013-11-28 2015-06-04 株式会社荏原製作所 研磨装置
JP2017064801A (ja) 2015-09-28 2017-04-06 株式会社荏原製作所 研磨方法および研磨装置

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US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
JPH1076464A (ja) 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
US6159073A (en) 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP4464642B2 (ja) * 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
KR100578133B1 (ko) 2003-11-04 2006-05-10 삼성전자주식회사 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드
WO2008032753A1 (fr) 2006-09-12 2008-03-20 Ebara Corporation Appareil de polissage et procédé de polissage
JP5094320B2 (ja) 2007-10-11 2012-12-12 株式会社荏原製作所 研磨監視方法、研磨装置、およびモニタリング装置
JP2009129970A (ja) 2007-11-20 2009-06-11 Ebara Corp 研磨装置及び研磨方法
CN101302404A (zh) 2008-07-01 2008-11-12 上海大学 纳米氧化铈复合磨粒抛光液的制备方法
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JP2012148376A (ja) 2011-01-20 2012-08-09 Ebara Corp 研磨方法及び研磨装置
CN102179771B (zh) 2011-03-10 2016-03-09 上海华虹宏力半导体制造有限公司 抛光台间清洗晶圆的方法
JP5943201B2 (ja) * 2012-12-26 2016-06-29 信越半導体株式会社 偏芯評価方法及びエピタキシャルウェーハの製造方法
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JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
JP6399873B2 (ja) 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
JP2016078155A (ja) * 2014-10-15 2016-05-16 株式会社荏原製作所 研磨装置、及び、基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009255184A (ja) 2008-04-11 2009-11-05 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2012138442A (ja) 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
JP2015100911A (ja) 2013-11-28 2015-06-04 株式会社荏原製作所 研磨装置
JP2017064801A (ja) 2015-09-28 2017-04-06 株式会社荏原製作所 研磨方法および研磨装置

Also Published As

Publication number Publication date
JP6847811B2 (ja) 2021-03-24
TWI748133B (zh) 2021-12-01
JP2019079923A (ja) 2019-05-23
CN109702560A (zh) 2019-05-03
TW201922410A (zh) 2019-06-16
CN109702560B (zh) 2021-11-02
SG10201809265VA (en) 2019-05-30
KR20190045856A (ko) 2019-05-03
US20190118333A1 (en) 2019-04-25
US11260496B2 (en) 2022-03-01

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