TWI748133B - 研磨方法及研磨裝置 - Google Patents

研磨方法及研磨裝置 Download PDF

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Publication number
TWI748133B
TWI748133B TW107137221A TW107137221A TWI748133B TW I748133 B TWI748133 B TW I748133B TW 107137221 A TW107137221 A TW 107137221A TW 107137221 A TW107137221 A TW 107137221A TW I748133 B TWI748133 B TW I748133B
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TW
Taiwan
Prior art keywords
polishing
film thickness
substrate
sensor
wafer
Prior art date
Application number
TW107137221A
Other languages
English (en)
Chinese (zh)
Other versions
TW201922410A (zh
Inventor
八木圭太
渡邉夕貴
佐佐木俊光
Original Assignee
日商荏原製作所股份有限公司
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Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201922410A publication Critical patent/TW201922410A/zh
Application granted granted Critical
Publication of TWI748133B publication Critical patent/TWI748133B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW107137221A 2017-10-24 2018-10-22 研磨方法及研磨裝置 TWI748133B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017205400A JP6847811B2 (ja) 2017-10-24 2017-10-24 研磨方法および研磨装置
JP2017-205400 2017-10-24

Publications (2)

Publication Number Publication Date
TW201922410A TW201922410A (zh) 2019-06-16
TWI748133B true TWI748133B (zh) 2021-12-01

Family

ID=66170416

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137221A TWI748133B (zh) 2017-10-24 2018-10-22 研磨方法及研磨裝置

Country Status (6)

Country Link
US (1) US11260496B2 (enExample)
JP (1) JP6847811B2 (enExample)
KR (1) KR102312551B1 (enExample)
CN (1) CN109702560B (enExample)
SG (1) SG10201809265VA (enExample)
TW (1) TWI748133B (enExample)

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* Cited by examiner, † Cited by third party
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US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN110587472B (zh) * 2019-08-30 2020-09-01 重庆智能机器人研究院 一种打磨调试系统
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
CN111702653B (zh) * 2020-05-15 2021-11-19 西安交通大学 一种平面光学元件行星式研磨装置及研磨方法
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
US11931853B2 (en) 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
CN113161268A (zh) * 2021-05-11 2021-07-23 杭州众硅电子科技有限公司 标定抛光头和装卸台位置的装置、抛光设备及标定方法

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JP2004154928A (ja) * 2002-10-17 2004-06-03 Ebara Corp 研磨状態監視装置、ポリッシング装置、及び研磨方法
JP2005081518A (ja) * 2003-09-10 2005-03-31 Ebara Corp 研磨状態監視装置及び該装置を用いた研磨装置
JP2009255184A (ja) * 2008-04-11 2009-11-05 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2012138442A (ja) * 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
JP2016078155A (ja) * 2014-10-15 2016-05-16 株式会社荏原製作所 研磨装置、及び、基板処理装置
TWI576202B (zh) * 2013-10-07 2017-04-01 荏原製作所股份有限公司 研磨方法
JP2017064801A (ja) * 2015-09-28 2017-04-06 株式会社荏原製作所 研磨方法および研磨装置

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US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
JPH1076464A (ja) 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
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Publication number Priority date Publication date Assignee Title
JP2004154928A (ja) * 2002-10-17 2004-06-03 Ebara Corp 研磨状態監視装置、ポリッシング装置、及び研磨方法
JP2005081518A (ja) * 2003-09-10 2005-03-31 Ebara Corp 研磨状態監視装置及び該装置を用いた研磨装置
JP2009255184A (ja) * 2008-04-11 2009-11-05 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2012138442A (ja) * 2010-12-27 2012-07-19 Ebara Corp ポリッシング装置およびポリッシング方法
JP2016184770A (ja) * 2010-12-27 2016-10-20 株式会社荏原製作所 ポリッシング装置
TWI576202B (zh) * 2013-10-07 2017-04-01 荏原製作所股份有限公司 研磨方法
JP2016078155A (ja) * 2014-10-15 2016-05-16 株式会社荏原製作所 研磨装置、及び、基板処理装置
JP2017064801A (ja) * 2015-09-28 2017-04-06 株式会社荏原製作所 研磨方法および研磨装置

Also Published As

Publication number Publication date
CN109702560A (zh) 2019-05-03
KR102312551B1 (ko) 2021-10-14
SG10201809265VA (en) 2019-05-30
CN109702560B (zh) 2021-11-02
JP2019079923A (ja) 2019-05-23
KR20190045856A (ko) 2019-05-03
JP6847811B2 (ja) 2021-03-24
US20190118333A1 (en) 2019-04-25
US11260496B2 (en) 2022-03-01
TW201922410A (zh) 2019-06-16

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