SG10201809265VA - Polishing method and polishing apparatus - Google Patents

Polishing method and polishing apparatus

Info

Publication number
SG10201809265VA
SG10201809265VA SG10201809265VA SG10201809265VA SG10201809265VA SG 10201809265V A SG10201809265V A SG 10201809265VA SG 10201809265V A SG10201809265V A SG 10201809265VA SG 10201809265V A SG10201809265V A SG 10201809265VA SG 10201809265V A SG10201809265V A SG 10201809265VA
Authority
SG
Singapore
Prior art keywords
polishing
ffiatk
vrouir
vcliffiri
trtoraliqt
Prior art date
Application number
SG10201809265VA
Other languages
English (en)
Inventor
Yagi Keita
Watanabe Yuki
sasaki Toshimitsu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201809265VA publication Critical patent/SG10201809265VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201809265VA 2017-10-24 2018-10-19 Polishing method and polishing apparatus SG10201809265VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017205400A JP6847811B2 (ja) 2017-10-24 2017-10-24 研磨方法および研磨装置

Publications (1)

Publication Number Publication Date
SG10201809265VA true SG10201809265VA (en) 2019-05-30

Family

ID=66170416

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201809265VA SG10201809265VA (en) 2017-10-24 2018-10-19 Polishing method and polishing apparatus

Country Status (6)

Country Link
US (1) US11260496B2 (enExample)
JP (1) JP6847811B2 (enExample)
KR (1) KR102312551B1 (enExample)
CN (1) CN109702560B (enExample)
SG (1) SG10201809265VA (enExample)
TW (1) TWI748133B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN110587472B (zh) * 2019-08-30 2020-09-01 重庆智能机器人研究院 一种打磨调试系统
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
CN111702653B (zh) * 2020-05-15 2021-11-19 西安交通大学 一种平面光学元件行星式研磨装置及研磨方法
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
US11931853B2 (en) 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
CN113161268A (zh) * 2021-05-11 2021-07-23 杭州众硅电子科技有限公司 标定抛光头和装卸台位置的装置、抛光设备及标定方法

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JPH07285069A (ja) * 1994-04-18 1995-10-31 Shin Etsu Handotai Co Ltd 枚葉式研磨におけるウェーハのテーパ自動除去研磨方法と装置
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
JPH1076464A (ja) 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
US6159073A (en) 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP4464642B2 (ja) * 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
KR100578133B1 (ko) 2003-11-04 2006-05-10 삼성전자주식회사 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드
KR101278236B1 (ko) 2006-09-12 2013-06-24 가부시키가이샤 에바라 세이사꾸쇼 연마장치 및 연마방법
JP5094320B2 (ja) 2007-10-11 2012-12-12 株式会社荏原製作所 研磨監視方法、研磨装置、およびモニタリング装置
JP2009129970A (ja) 2007-11-20 2009-06-11 Ebara Corp 研磨装置及び研磨方法
JP2009255184A (ja) * 2008-04-11 2009-11-05 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
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JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
JP2012148376A (ja) 2011-01-20 2012-08-09 Ebara Corp 研磨方法及び研磨装置
CN102179771B (zh) 2011-03-10 2016-03-09 上海华虹宏力半导体制造有限公司 抛光台间清洗晶圆的方法
JP5943201B2 (ja) * 2012-12-26 2016-06-29 信越半導体株式会社 偏芯評価方法及びエピタキシャルウェーハの製造方法
TWI635929B (zh) 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
JP6113624B2 (ja) * 2013-10-11 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
JP6101621B2 (ja) 2013-11-28 2017-03-22 株式会社荏原製作所 研磨装置
JP6399873B2 (ja) 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
JP2016078155A (ja) * 2014-10-15 2016-05-16 株式会社荏原製作所 研磨装置、及び、基板処理装置
JP6585445B2 (ja) * 2015-09-28 2019-10-02 株式会社荏原製作所 研磨方法

Also Published As

Publication number Publication date
CN109702560A (zh) 2019-05-03
TWI748133B (zh) 2021-12-01
KR102312551B1 (ko) 2021-10-14
CN109702560B (zh) 2021-11-02
JP2019079923A (ja) 2019-05-23
KR20190045856A (ko) 2019-05-03
JP6847811B2 (ja) 2021-03-24
US20190118333A1 (en) 2019-04-25
US11260496B2 (en) 2022-03-01
TW201922410A (zh) 2019-06-16

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