JP2022170684A5 - - Google Patents

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Publication number
JP2022170684A5
JP2022170684A5 JP2022046364A JP2022046364A JP2022170684A5 JP 2022170684 A5 JP2022170684 A5 JP 2022170684A5 JP 2022046364 A JP2022046364 A JP 2022046364A JP 2022046364 A JP2022046364 A JP 2022046364A JP 2022170684 A5 JP2022170684 A5 JP 2022170684A5
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JP
Japan
Prior art keywords
film thickness
thickness value
substrate
polishing
pressure chamber
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JP2022046364A
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English (en)
Japanese (ja)
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JP7783104B2 (ja
JP2022170684A (ja
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Priority to US18/557,069 priority Critical patent/US20240238934A1/en
Priority to PCT/JP2022/017484 priority patent/WO2022230646A1/ja
Priority to CN202280031299.XA priority patent/CN117222497A/zh
Priority to KR1020237039560A priority patent/KR20230175244A/ko
Priority to TW111114758A priority patent/TW202310975A/zh
Publication of JP2022170684A publication Critical patent/JP2022170684A/ja
Publication of JP2022170684A5 publication Critical patent/JP2022170684A5/ja
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Publication of JP7783104B2 publication Critical patent/JP7783104B2/ja
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JP2022046364A 2021-04-28 2022-03-23 研磨装置および研磨方法 Active JP7783104B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US18/557,069 US20240238934A1 (en) 2021-04-28 2022-04-11 Polishing apparatus and polishing method
PCT/JP2022/017484 WO2022230646A1 (ja) 2021-04-28 2022-04-11 研磨装置および研磨方法
CN202280031299.XA CN117222497A (zh) 2021-04-28 2022-04-11 研磨装置及研磨方法
KR1020237039560A KR20230175244A (ko) 2021-04-28 2022-04-11 연마 장치 및 연마 방법
TW111114758A TW202310975A (zh) 2021-04-28 2022-04-19 研磨裝置及研磨方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021076022 2021-04-28
JP2021076022 2021-04-28

Publications (3)

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JP2022170684A JP2022170684A (ja) 2022-11-10
JP2022170684A5 true JP2022170684A5 (enExample) 2025-01-08
JP7783104B2 JP7783104B2 (ja) 2025-12-09

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JP2022046364A Active JP7783104B2 (ja) 2021-04-28 2022-03-23 研磨装置および研磨方法

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JP (1) JP7783104B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024092647A (ja) * 2022-12-26 2024-07-08 株式会社荏原製作所 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115017B1 (en) * 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
JP6475604B2 (ja) 2015-11-24 2019-02-27 株式会社荏原製作所 研磨方法
JP6985107B2 (ja) 2017-11-06 2021-12-22 株式会社荏原製作所 研磨方法および研磨装置
JP7117171B2 (ja) 2018-06-20 2022-08-12 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム

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