JP2015526303A5 - - Google Patents

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Publication number
JP2015526303A5
JP2015526303A5 JP2015524297A JP2015524297A JP2015526303A5 JP 2015526303 A5 JP2015526303 A5 JP 2015526303A5 JP 2015524297 A JP2015524297 A JP 2015524297A JP 2015524297 A JP2015524297 A JP 2015524297A JP 2015526303 A5 JP2015526303 A5 JP 2015526303A5
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JP
Japan
Prior art keywords
substrate
measurements
platen
retaining ring
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015524297A
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English (en)
Japanese (ja)
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JP2015526303A (ja
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Publication date
Priority claimed from US13/791,761 external-priority patent/US9067295B2/en
Application filed filed Critical
Publication of JP2015526303A publication Critical patent/JP2015526303A/ja
Publication of JP2015526303A5 publication Critical patent/JP2015526303A5/ja
Pending legal-status Critical Current

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JP2015524297A 2012-07-25 2013-07-03 保持リングの厚さをモニタすること及び圧力制御 Pending JP2015526303A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261675507P 2012-07-25 2012-07-25
US61/675,507 2012-07-25
US13/791,761 US9067295B2 (en) 2012-07-25 2013-03-08 Monitoring retaining ring thickness and pressure control
US13/791,761 2013-03-08
PCT/US2013/049269 WO2014018238A1 (en) 2012-07-25 2013-07-03 Monitoring retaining ring thickness and pressure control

Publications (2)

Publication Number Publication Date
JP2015526303A JP2015526303A (ja) 2015-09-10
JP2015526303A5 true JP2015526303A5 (enExample) 2016-08-18

Family

ID=49993852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015524297A Pending JP2015526303A (ja) 2012-07-25 2013-07-03 保持リングの厚さをモニタすること及び圧力制御

Country Status (6)

Country Link
US (1) US9067295B2 (enExample)
JP (1) JP2015526303A (enExample)
KR (1) KR101965475B1 (enExample)
CN (1) CN104471685B (enExample)
TW (1) TWI572445B (enExample)
WO (1) WO2014018238A1 (enExample)

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JP7305178B2 (ja) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
JP7436684B2 (ja) * 2020-06-26 2024-02-22 アプライド マテリアルズ インコーポレイテッド 変形可能な基板チャック
CN113927472B (zh) * 2020-07-13 2022-07-19 济南晶正电子科技有限公司 一种用于改善晶圆抛光厚度均匀性的装置
WO2022187105A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
US20220281052A1 (en) * 2021-03-05 2022-09-08 Applied Materials, Inc. Machine learning for classifying retaining rings
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