TWI572445B - 監控扣環厚度及壓力控制 - Google Patents
監控扣環厚度及壓力控制 Download PDFInfo
- Publication number
- TWI572445B TWI572445B TW102124228A TW102124228A TWI572445B TW I572445 B TWI572445 B TW I572445B TW 102124228 A TW102124228 A TW 102124228A TW 102124228 A TW102124228 A TW 102124228A TW I572445 B TWI572445 B TW I572445B
- Authority
- TW
- Taiwan
- Prior art keywords
- buckle
- monitoring system
- controller
- signal
- polishing pad
- Prior art date
Links
- 238000012544 monitoring process Methods 0.000 title claims description 44
- 239000000758 substrate Substances 0.000 claims description 72
- 238000005498 polishing Methods 0.000 claims description 59
- 238000005259 measurement Methods 0.000 claims description 46
- 238000000227 grinding Methods 0.000 claims description 29
- 239000004033 plastic Substances 0.000 claims description 29
- 229920003023 plastic Polymers 0.000 claims description 29
- 238000011065 in-situ storage Methods 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000001419 dependent effect Effects 0.000 claims 3
- 238000000034 method Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 230000015654 memory Effects 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- 239000012528 membrane Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000012625 in-situ measurement Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261675507P | 2012-07-25 | 2012-07-25 | |
| US13/791,761 US9067295B2 (en) | 2012-07-25 | 2013-03-08 | Monitoring retaining ring thickness and pressure control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201408435A TW201408435A (zh) | 2014-03-01 |
| TWI572445B true TWI572445B (zh) | 2017-03-01 |
Family
ID=49993852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102124228A TWI572445B (zh) | 2012-07-25 | 2013-07-05 | 監控扣環厚度及壓力控制 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9067295B2 (enExample) |
| JP (1) | JP2015526303A (enExample) |
| KR (1) | KR101965475B1 (enExample) |
| CN (1) | CN104471685B (enExample) |
| TW (1) | TWI572445B (enExample) |
| WO (1) | WO2014018238A1 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9067295B2 (en) * | 2012-07-25 | 2015-06-30 | Applied Materials, Inc. | Monitoring retaining ring thickness and pressure control |
| US9242341B2 (en) * | 2013-10-22 | 2016-01-26 | Globalfoundries Singapore Pte. Ltd. | CMP head structure |
| US10328549B2 (en) * | 2013-12-11 | 2019-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing head, chemical-mechanical polishing system and method for polishing substrate |
| US10252397B2 (en) | 2014-10-30 | 2019-04-09 | Applied Materials, Inc. | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes |
| US10441881B2 (en) * | 2015-01-09 | 2019-10-15 | Ironburg Inventions Limited | Controller for a games console |
| US10478937B2 (en) * | 2015-03-05 | 2019-11-19 | Applied Materials, Inc. | Acoustic emission monitoring and endpoint for chemical mechanical polishing |
| DE102015114893A1 (de) | 2015-09-04 | 2017-03-09 | Leica Biosystems Nussloch Gmbh | Verfahren und Automat zum Einbetten einer Gewebeprobe in ein Einbettmedium |
| CN105345652A (zh) * | 2015-10-14 | 2016-02-24 | 上海华力微电子有限公司 | 一种可实时检测磨损剩余厚度的固定环 |
| KR101684842B1 (ko) * | 2015-10-27 | 2016-12-20 | 주식회사 케이씨텍 | 화학 기계적 연마 장치 |
| KR101712920B1 (ko) * | 2015-12-07 | 2017-03-08 | 주식회사 케이씨텍 | 화학 기계적 연마 장치 |
| KR101870701B1 (ko) | 2016-08-01 | 2018-06-25 | 에스케이실트론 주식회사 | 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템 |
| KR102564376B1 (ko) * | 2016-09-15 | 2023-08-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학 기계적 폴리싱 스마트 링 |
| CN106346333A (zh) * | 2016-11-29 | 2017-01-25 | 延康汽车零部件如皋有限公司 | 一种汽车电镀件实验用自动磨片系统 |
| US10875149B2 (en) * | 2017-03-30 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for timed dispensing various slurry components |
| JP7354131B2 (ja) | 2018-03-13 | 2023-10-02 | アプライド マテリアルズ インコーポレイテッド | 化学機械研磨中の振動のモニタリング |
| CN116872088A (zh) * | 2018-03-13 | 2023-10-13 | 应用材料公司 | 化学机械研磨机中的耗材部件监控 |
| CN111263683B (zh) * | 2018-03-14 | 2024-03-15 | 应用材料公司 | 垫调节器的切割速率监控 |
| KR102512133B1 (ko) * | 2018-05-10 | 2023-03-22 | 주식회사 케이씨텍 | 기판 캐리어 및 그 제어방법 |
| TWI828706B (zh) * | 2018-06-20 | 2024-01-11 | 美商應用材料股份有限公司 | 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統 |
| US12017322B2 (en) * | 2018-08-14 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
| KR20200068785A (ko) * | 2018-12-05 | 2020-06-16 | 삼성디스플레이 주식회사 | 연마 모니터링 시스템 및 연마 모니터링 방법 |
| JP7305178B2 (ja) * | 2019-09-19 | 2023-07-10 | 株式会社ブイ・テクノロジー | 研磨装置 |
| WO2021262521A1 (en) * | 2020-06-26 | 2021-12-30 | Applied Materials, Inc. | Deformable substrate chuck |
| CN113927472B (zh) * | 2020-07-13 | 2022-07-19 | 济南晶正电子科技有限公司 | 一种用于改善晶圆抛光厚度均匀性的装置 |
| WO2022187105A1 (en) * | 2021-03-05 | 2022-09-09 | Applied Materials, Inc. | Control of processing parameters for substrate polishing with substrate precession |
| KR20230150383A (ko) * | 2021-03-05 | 2023-10-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 리테이닝 링들을 분류하기 위한 기계 학습 |
| WO2022265967A2 (en) * | 2021-06-15 | 2022-12-22 | Axus Technology, Llc | Method and apparatus for in-situ monitoring of chemical mechanical planarization (cmp) processes |
| CN116652813A (zh) * | 2022-02-17 | 2023-08-29 | 中国科学院微电子研究所 | 一种化学机械平坦化设备、终点检测方法、装置及系统 |
| JP2025518293A (ja) * | 2022-06-03 | 2025-06-12 | アプライド マテリアルズ インコーポレイテッド | Ｃｍｐ保持リングの音響モニタリング |
| KR20250092244A (ko) * | 2022-10-27 | 2025-06-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링 |
| US20240308019A1 (en) * | 2023-03-17 | 2024-09-19 | Applied Materials, Inc. | Method for detection of wafer slippage |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6602724B2 (en) * | 2000-07-27 | 2003-08-05 | Applied Materials, Inc. | Chemical mechanical polishing of a metal layer with polishing rate monitoring |
| TW200936316A (en) * | 2007-11-28 | 2009-09-01 | Ebara Corp | Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method |
| US20100297916A1 (en) * | 2008-11-26 | 2010-11-25 | Applied Materials, Inc. | Methods of using optical metrology for feed back and feed forward process control |
| US7967665B2 (en) * | 2006-03-31 | 2011-06-28 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
| US20110195639A1 (en) * | 2003-11-13 | 2011-08-11 | Hung Chih Chen | Retaining ring with shaped surface |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6251215B1 (en) * | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| US6159073A (en) | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
| US6390908B1 (en) | 1999-07-01 | 2002-05-21 | Applied Materials, Inc. | Determining when to replace a retaining ring used in substrate polishing operations |
| JP3573197B2 (ja) | 1999-07-08 | 2004-10-06 | 聯華電子股▲分▼有限公司 | 完了点観測デバイスを備えた化学機械研磨ステーション |
| US6924641B1 (en) | 2000-05-19 | 2005-08-02 | Applied Materials, Inc. | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
| DE60116757T4 (de) * | 2000-05-19 | 2007-01-18 | Applied Materials, Inc., Santa Clara | Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges |
| US20040005842A1 (en) | 2000-07-25 | 2004-01-08 | Chen Hung Chih | Carrier head with flexible membrane |
| US7160739B2 (en) * | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7112960B2 (en) | 2003-07-31 | 2006-09-26 | Applied Materials, Inc. | Eddy current system for in-situ profile measurement |
| US7097537B1 (en) | 2003-08-18 | 2006-08-29 | Applied Materials, Inc. | Determination of position of sensor measurements during polishing |
| US7115017B1 (en) * | 2006-03-31 | 2006-10-03 | Novellus Systems, Inc. | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization |
| KR20080109119A (ko) | 2007-06-12 | 2008-12-17 | (주)맥섭기술 | 화학기계적 연마를 위한 리테이닝링 및 그의 금속링 재사용방법 |
| KR20090039123A (ko) | 2007-10-17 | 2009-04-22 | 주식회사 윌비에스엔티 | 화학적기계 연마장치의 리테이너 링 |
| KR101482064B1 (ko) | 2008-10-16 | 2015-01-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 와전류 이득 보상 |
| TW201201957A (en) | 2010-01-29 | 2012-01-16 | Applied Materials Inc | High sensitivity real time profile control eddy current monitoring system |
| US20120021671A1 (en) * | 2010-07-26 | 2012-01-26 | Applied Materials, Inc. | Real-time monitoring of retaining ring thickness and lifetime |
| US9057146B2 (en) | 2010-08-24 | 2015-06-16 | Varian Semiconductor Equipment Associates, Inc. | Eddy current thickness measurement apparatus |
| KR101902049B1 (ko) * | 2012-01-25 | 2018-09-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 리테이닝 링 모니터링 및 압력 제어 |
| US9067295B2 (en) * | 2012-07-25 | 2015-06-30 | Applied Materials, Inc. | Monitoring retaining ring thickness and pressure control |
-
2013
- 2013-03-08 US US13/791,761 patent/US9067295B2/en active Active
- 2013-07-03 CN CN201380037623.XA patent/CN104471685B/zh active Active
- 2013-07-03 JP JP2015524297A patent/JP2015526303A/ja active Pending
- 2013-07-03 WO PCT/US2013/049269 patent/WO2014018238A1/en not_active Ceased
- 2013-07-03 KR KR1020157001586A patent/KR101965475B1/ko active Active
- 2013-07-05 TW TW102124228A patent/TWI572445B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6602724B2 (en) * | 2000-07-27 | 2003-08-05 | Applied Materials, Inc. | Chemical mechanical polishing of a metal layer with polishing rate monitoring |
| US20110195639A1 (en) * | 2003-11-13 | 2011-08-11 | Hung Chih Chen | Retaining ring with shaped surface |
| US7967665B2 (en) * | 2006-03-31 | 2011-06-28 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
| TW200936316A (en) * | 2007-11-28 | 2009-09-01 | Ebara Corp | Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method |
| US20100297916A1 (en) * | 2008-11-26 | 2010-11-25 | Applied Materials, Inc. | Methods of using optical metrology for feed back and feed forward process control |
Also Published As
| Publication number | Publication date |
|---|---|
| US9067295B2 (en) | 2015-06-30 |
| WO2014018238A1 (en) | 2014-01-30 |
| TW201408435A (zh) | 2014-03-01 |
| US20140027407A1 (en) | 2014-01-30 |
| JP2015526303A (ja) | 2015-09-10 |
| CN104471685B (zh) | 2018-02-13 |
| CN104471685A (zh) | 2015-03-25 |
| KR20150037859A (ko) | 2015-04-08 |
| KR101965475B1 (ko) | 2019-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI572445B (zh) | 監控扣環厚度及壓力控制 | |
| TWI806925B (zh) | 用於拋光墊磨損率監測的裝置、方法、和電腦程式產品 | |
| JP7748984B2 (ja) | パッドコンディショナカット速度監視 | |
| JP6297301B2 (ja) | 細長い領域のモニタリングを用いるインシトゥモニタシステム | |
| US20180056476A1 (en) | Monitoring of polishing pad thickness for chemical mechanical polishing | |
| JP2020518131A (ja) | モニタリング用のニューラルネットワークを用いた研磨装置 | |
| TWI828706B (zh) | 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統 | |
| US10898986B2 (en) | Chattering correction for accurate sensor position determination on wafer |