KR101965475B1 - 리테이닝 링 두께 모니터링 및 압력 제어 - Google Patents

리테이닝 링 두께 모니터링 및 압력 제어 Download PDF

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Publication number
KR101965475B1
KR101965475B1 KR1020157001586A KR20157001586A KR101965475B1 KR 101965475 B1 KR101965475 B1 KR 101965475B1 KR 1020157001586 A KR1020157001586 A KR 1020157001586A KR 20157001586 A KR20157001586 A KR 20157001586A KR 101965475 B1 KR101965475 B1 KR 101965475B1
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South Korea
Prior art keywords
retaining ring
measurements
sensor
signal
polishing
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KR20150037859A (ko
Inventor
사미어 데쉬판데
지홍 왕
사무엘 추-치앙 흐
가우탐 샤샹크 단다바테
헝 치흐 첸
웬-치앙 투
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020157001586A 2012-07-25 2013-07-03 리테이닝 링 두께 모니터링 및 압력 제어 Active KR101965475B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261675507P 2012-07-25 2012-07-25
US61/675,507 2012-07-25
US13/791,761 US9067295B2 (en) 2012-07-25 2013-03-08 Monitoring retaining ring thickness and pressure control
US13/791,761 2013-03-08
PCT/US2013/049269 WO2014018238A1 (en) 2012-07-25 2013-07-03 Monitoring retaining ring thickness and pressure control

Publications (2)

Publication Number Publication Date
KR20150037859A KR20150037859A (ko) 2015-04-08
KR101965475B1 true KR101965475B1 (ko) 2019-04-03

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KR1020157001586A Active KR101965475B1 (ko) 2012-07-25 2013-07-03 리테이닝 링 두께 모니터링 및 압력 제어

Country Status (6)

Country Link
US (1) US9067295B2 (enExample)
JP (1) JP2015526303A (enExample)
KR (1) KR101965475B1 (enExample)
CN (1) CN104471685B (enExample)
TW (1) TWI572445B (enExample)
WO (1) WO2014018238A1 (enExample)

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KR101684842B1 (ko) * 2015-10-27 2016-12-20 주식회사 케이씨텍 화학 기계적 연마 장치
KR101712920B1 (ko) * 2015-12-07 2017-03-08 주식회사 케이씨텍 화학 기계적 연마 장치
KR101870701B1 (ko) 2016-08-01 2018-06-25 에스케이실트론 주식회사 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템
JP7312103B2 (ja) * 2016-09-15 2023-07-20 アプライド マテリアルズ インコーポレイテッド 化学機械研磨スマートリング
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US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
US11571786B2 (en) 2018-03-13 2023-02-07 Applied Materials, Inc. Consumable part monitoring in chemical mechanical polisher
CN111263682A (zh) 2018-03-13 2020-06-09 应用材料公司 化学机械抛光期间的振动的监测
KR102706476B1 (ko) * 2018-03-14 2024-09-13 어플라이드 머티어리얼스, 인코포레이티드 패드 컨디셔너 절삭률 모니터링
KR102512133B1 (ko) * 2018-05-10 2023-03-22 주식회사 케이씨텍 기판 캐리어 및 그 제어방법
TWI828706B (zh) 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
KR20200068785A (ko) * 2018-12-05 2020-06-16 삼성디스플레이 주식회사 연마 모니터링 시스템 및 연마 모니터링 방법
JP7305178B2 (ja) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
JP7436684B2 (ja) * 2020-06-26 2024-02-22 アプライド マテリアルズ インコーポレイテッド 変形可能な基板チャック
CN113927472B (zh) * 2020-07-13 2022-07-19 济南晶正电子科技有限公司 一种用于改善晶圆抛光厚度均匀性的装置
WO2022187105A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
US20220281052A1 (en) * 2021-03-05 2022-09-08 Applied Materials, Inc. Machine learning for classifying retaining rings
KR20240021291A (ko) * 2021-06-15 2024-02-16 액서스 테크놀로지, 엘엘씨 화학적 기계적 평탄화 (cmp) 공정의 현장 모니터링을 위한 방법 및 장치
CN116652813A (zh) * 2022-02-17 2023-08-29 中国科学院微电子研究所 一种化学机械平坦化设备、终点检测方法、装置及系统
US20230390883A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Acoustic monitoring of cmp retaining ring
KR20250092244A (ko) * 2022-10-27 2025-06-23 어플라이드 머티어리얼스, 인코포레이티드 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링
US20240308019A1 (en) * 2023-03-17 2024-09-19 Applied Materials, Inc. Method for detection of wafer slippage

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Also Published As

Publication number Publication date
TW201408435A (zh) 2014-03-01
US9067295B2 (en) 2015-06-30
CN104471685A (zh) 2015-03-25
JP2015526303A (ja) 2015-09-10
WO2014018238A1 (en) 2014-01-30
TWI572445B (zh) 2017-03-01
CN104471685B (zh) 2018-02-13
KR20150037859A (ko) 2015-04-08
US20140027407A1 (en) 2014-01-30

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