JP2015526303A - 保持リングの厚さをモニタすること及び圧力制御 - Google Patents

保持リングの厚さをモニタすること及び圧力制御 Download PDF

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Publication number
JP2015526303A
JP2015526303A JP2015524297A JP2015524297A JP2015526303A JP 2015526303 A JP2015526303 A JP 2015526303A JP 2015524297 A JP2015524297 A JP 2015524297A JP 2015524297 A JP2015524297 A JP 2015524297A JP 2015526303 A JP2015526303 A JP 2015526303A
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JP
Japan
Prior art keywords
retaining ring
controller
polishing
signal
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2015524297A
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English (en)
Japanese (ja)
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JP2015526303A5 (enExample
Inventor
サメール デシュパンデ，
サメール デシュパンデ，
ジーホン ワン，
ジーホン ワン，
サミュエル チュ−チャン スウ，
サミュエル チュ−チャン スウ，
ゴータム シャシャンク ダンダヴェート，
ゴータム シャシャンク ダンダヴェート，
ハン チー チェン，
ハン チー チェン，
ウェン−チャン トゥー，
ウェン−チャン トゥー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
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Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2015526303A publication Critical patent/JP2015526303A/ja
Publication of JP2015526303A5 publication Critical patent/JP2015526303A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2015524297A 2012-07-25 2013-07-03 保持リングの厚さをモニタすること及び圧力制御 Pending JP2015526303A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261675507P 2012-07-25 2012-07-25
US61/675,507 2012-07-25
US13/791,761 US9067295B2 (en) 2012-07-25 2013-03-08 Monitoring retaining ring thickness and pressure control
US13/791,761 2013-03-08
PCT/US2013/049269 WO2014018238A1 (en) 2012-07-25 2013-07-03 Monitoring retaining ring thickness and pressure control

Publications (2)

Publication Number Publication Date
JP2015526303A true JP2015526303A (ja) 2015-09-10
JP2015526303A5 JP2015526303A5 (enExample) 2016-08-18

Family

ID=49993852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015524297A Pending JP2015526303A (ja) 2012-07-25 2013-07-03 保持リングの厚さをモニタすること及び圧力制御

Country Status (6)

Country Link
US (1) US9067295B2 (enExample)
JP (1) JP2015526303A (enExample)
KR (1) KR101965475B1 (enExample)
CN (1) CN104471685B (enExample)
TW (1) TWI572445B (enExample)
WO (1) WO2014018238A1 (enExample)

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JP2025518293A (ja) * 2022-06-03 2025-06-12 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ保持リングの音響モニタリング

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US10328549B2 (en) * 2013-12-11 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing head, chemical-mechanical polishing system and method for polishing substrate
US10252397B2 (en) 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
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CN105345652A (zh) * 2015-10-14 2016-02-24 上海华力微电子有限公司 一种可实时检测磨损剩余厚度的固定环
KR101684842B1 (ko) * 2015-10-27 2016-12-20 주식회사 케이씨텍 화학 기계적 연마 장치
KR101712920B1 (ko) * 2015-12-07 2017-03-08 주식회사 케이씨텍 화학 기계적 연마 장치
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JP7312103B2 (ja) * 2016-09-15 2023-07-20 アプライド マテリアルズ インコーポレイテッド 化学機械研磨スマートリング
CN106346333A (zh) * 2016-11-29 2017-01-25 延康汽车零部件如皋有限公司 一种汽车电镀件实验用自动磨片系统
US10875149B2 (en) * 2017-03-30 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for timed dispensing various slurry components
US11571786B2 (en) 2018-03-13 2023-02-07 Applied Materials, Inc. Consumable part monitoring in chemical mechanical polisher
CN111263682A (zh) 2018-03-13 2020-06-09 应用材料公司 化学机械抛光期间的振动的监测
KR102706476B1 (ko) * 2018-03-14 2024-09-13 어플라이드 머티어리얼스, 인코포레이티드 패드 컨디셔너 절삭률 모니터링
KR102512133B1 (ko) * 2018-05-10 2023-03-22 주식회사 케이씨텍 기판 캐리어 및 그 제어방법
TWI828706B (zh) 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
KR20200068785A (ko) * 2018-12-05 2020-06-16 삼성디스플레이 주식회사 연마 모니터링 시스템 및 연마 모니터링 방법
JP7305178B2 (ja) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
JP7436684B2 (ja) * 2020-06-26 2024-02-22 アプライド マテリアルズ インコーポレイテッド 変形可能な基板チャック
CN113927472B (zh) * 2020-07-13 2022-07-19 济南晶正电子科技有限公司 一种用于改善晶圆抛光厚度均匀性的装置
WO2022187105A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
US20220281052A1 (en) * 2021-03-05 2022-09-08 Applied Materials, Inc. Machine learning for classifying retaining rings
KR20240021291A (ko) * 2021-06-15 2024-02-16 액서스 테크놀로지, 엘엘씨 화학적 기계적 평탄화 (cmp) 공정의 현장 모니터링을 위한 방법 및 장치
CN116652813A (zh) * 2022-02-17 2023-08-29 中国科学院微电子研究所 一种化学机械平坦化设备、终点检测方法、装置及系统
KR20250092244A (ko) * 2022-10-27 2025-06-23 어플라이드 머티어리얼스, 인코포레이티드 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링
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Also Published As

Publication number Publication date
TW201408435A (zh) 2014-03-01
US9067295B2 (en) 2015-06-30
CN104471685A (zh) 2015-03-25
WO2014018238A1 (en) 2014-01-30
TWI572445B (zh) 2017-03-01
CN104471685B (zh) 2018-02-13
KR20150037859A (ko) 2015-04-08
US20140027407A1 (en) 2014-01-30
KR101965475B1 (ko) 2019-04-03

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