JP7783104B2 - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法

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Publication number
JP7783104B2
JP7783104B2 JP2022046364A JP2022046364A JP7783104B2 JP 7783104 B2 JP7783104 B2 JP 7783104B2 JP 2022046364 A JP2022046364 A JP 2022046364A JP 2022046364 A JP2022046364 A JP 2022046364A JP 7783104 B2 JP7783104 B2 JP 7783104B2
Authority
JP
Japan
Prior art keywords
film thickness
thickness value
substrate
polishing
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022046364A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022170684A (ja
JP2022170684A5 (enExample
Inventor
真朗 大田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US18/557,069 priority Critical patent/US20240238934A1/en
Priority to PCT/JP2022/017484 priority patent/WO2022230646A1/ja
Priority to CN202280031299.XA priority patent/CN117222497A/zh
Priority to KR1020237039560A priority patent/KR20230175244A/ko
Priority to TW111114758A priority patent/TW202310975A/zh
Publication of JP2022170684A publication Critical patent/JP2022170684A/ja
Publication of JP2022170684A5 publication Critical patent/JP2022170684A5/ja
Application granted granted Critical
Publication of JP7783104B2 publication Critical patent/JP7783104B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022046364A 2021-04-28 2022-03-23 研磨装置および研磨方法 Active JP7783104B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US18/557,069 US20240238934A1 (en) 2021-04-28 2022-04-11 Polishing apparatus and polishing method
PCT/JP2022/017484 WO2022230646A1 (ja) 2021-04-28 2022-04-11 研磨装置および研磨方法
CN202280031299.XA CN117222497A (zh) 2021-04-28 2022-04-11 研磨装置及研磨方法
KR1020237039560A KR20230175244A (ko) 2021-04-28 2022-04-11 연마 장치 및 연마 방법
TW111114758A TW202310975A (zh) 2021-04-28 2022-04-19 研磨裝置及研磨方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021076022 2021-04-28
JP2021076022 2021-04-28

Publications (3)

Publication Number Publication Date
JP2022170684A JP2022170684A (ja) 2022-11-10
JP2022170684A5 JP2022170684A5 (enExample) 2025-01-08
JP7783104B2 true JP7783104B2 (ja) 2025-12-09

Family

ID=83944603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022046364A Active JP7783104B2 (ja) 2021-04-28 2022-03-23 研磨装置および研磨方法

Country Status (1)

Country Link
JP (1) JP7783104B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024092647A (ja) * 2022-12-26 2024-07-08 株式会社荏原製作所 研磨方法、研磨装置、およびコンピュータ読み取り可能な記録媒体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098407A (ja) 2015-11-24 2017-06-01 株式会社荏原製作所 研磨方法
JP2019084614A (ja) 2017-11-06 2019-06-06 株式会社荏原製作所 研磨方法および研磨装置
JP2019217595A (ja) 2018-06-20 2019-12-26 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115017B1 (en) * 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098407A (ja) 2015-11-24 2017-06-01 株式会社荏原製作所 研磨方法
JP2019084614A (ja) 2017-11-06 2019-06-06 株式会社荏原製作所 研磨方法および研磨装置
JP2019217595A (ja) 2018-06-20 2019-12-26 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム

Also Published As

Publication number Publication date
JP2022170684A (ja) 2022-11-10

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