SG10201806236TA - Cutting apparatus and wafer processing method - Google Patents

Cutting apparatus and wafer processing method

Info

Publication number
SG10201806236TA
SG10201806236TA SG10201806236TA SG10201806236TA SG10201806236TA SG 10201806236T A SG10201806236T A SG 10201806236TA SG 10201806236T A SG10201806236T A SG 10201806236TA SG 10201806236T A SG10201806236T A SG 10201806236TA SG 10201806236T A SG10201806236T A SG 10201806236TA
Authority
SG
Singapore
Prior art keywords
wafer
cutting apparatus
laser beam
reflected light
sensor unit
Prior art date
Application number
SG10201806236TA
Inventor
Komatsu Atsushi
Minato Kokichi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201806236TA publication Critical patent/SG10201806236TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

CUTTING APPARATUS AND WAFER PROCESSING METHOD A cutting apparatus includes a line sensor unit that applies a laser beam in a band shape elongated in a radial direction of a wafer to a region inclusive of a peripheral portion of the wafer held on a chuck table, and detects reflected light, and an information calculation section that calculates the position of the wafer and the height of the front surface of the wafer from the reflected light of the laser beam detected by the line sensor unit in a state in which the chuck table is rotated before the wafer is cut to form a stepped portion, and that calculates the width and the height of the stepped portion from the reflected light of the laser beam detected by the line sensor unit after the wafer is cut to form the stepped portion. (Figure 1)
SG10201806236TA 2017-08-09 2018-07-20 Cutting apparatus and wafer processing method SG10201806236TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017153874A JP6953075B2 (en) 2017-08-09 2017-08-09 Cutting equipment and wafer processing method

Publications (1)

Publication Number Publication Date
SG10201806236TA true SG10201806236TA (en) 2019-03-28

Family

ID=65275419

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201806236TA SG10201806236TA (en) 2017-08-09 2018-07-20 Cutting apparatus and wafer processing method

Country Status (6)

Country Link
US (1) US10622215B2 (en)
JP (1) JP6953075B2 (en)
KR (1) KR102546465B1 (en)
CN (1) CN109382920B (en)
SG (1) SG10201806236TA (en)
TW (1) TWI751354B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7283951B2 (en) * 2019-04-05 2023-05-30 株式会社ディスコ processing equipment
JP7216613B2 (en) * 2019-05-16 2023-02-01 株式会社ディスコ processing equipment
JP2020203366A (en) * 2019-06-19 2020-12-24 株式会社ディスコ Processing device
JP7262901B2 (en) * 2019-06-24 2023-04-24 株式会社ディスコ Workpiece cutting method
JP7430455B2 (en) 2020-06-05 2024-02-13 株式会社ディスコ Edge position detection device and edge position detection method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409744B2 (en) * 2000-10-20 2010-02-03 ライトロン株式会社 Etching process progress display method and etching process monitoring apparatus
US6831742B1 (en) * 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
JP2005038978A (en) * 2003-07-18 2005-02-10 Speedfam Co Ltd Outer periphery polishing device for flat surface of semiconductor wafer
JP2006108532A (en) * 2004-10-08 2006-04-20 Disco Abrasive Syst Ltd Method of grinding wafer
EP1918983A4 (en) * 2005-08-05 2010-03-31 Nikon Corp Stage apparatus and exposure apparatus
TWI447798B (en) * 2010-12-07 2014-08-01 Alpha & Omega Semiconductor Cayman Ltd Method of avoiding resin outflow from the wafer scribe line in wlcsp
JP5757831B2 (en) * 2011-09-14 2015-08-05 株式会社ディスコ Cutting blade tip shape detection method
JP5829881B2 (en) * 2011-10-07 2015-12-09 株式会社ディスコ Cutting equipment
JP2013149822A (en) * 2012-01-20 2013-08-01 Disco Abrasive Syst Ltd Edge trimming method
CN104137249B (en) * 2012-04-25 2017-11-14 应用材料公司 The measurement and control of Waffer edge
JP6105872B2 (en) 2012-08-06 2017-03-29 株式会社ディスコ Wafer processing method
US20140054748A1 (en) * 2012-08-21 2014-02-27 Genmao Liu Edge trimming method for semiconductor wafer and semiconductor wafer having trimmed edge
JP5991890B2 (en) * 2012-09-11 2016-09-14 株式会社ディスコ Wafer processing method
JP6196776B2 (en) * 2013-01-21 2017-09-13 株式会社ディスコ Wafer processing method
JP6242619B2 (en) * 2013-07-23 2017-12-06 株式会社ディスコ Processing equipment
JP2015085398A (en) * 2013-10-28 2015-05-07 株式会社ディスコ Cutting device
JP2016078147A (en) * 2014-10-14 2016-05-16 株式会社ディスコ Grinding device
CN204271041U (en) * 2014-10-20 2015-04-15 上海技美电子科技有限公司 Wafer detecting apparatus
JP2016100356A (en) * 2014-11-18 2016-05-30 株式会社ディスコ Cutting machine
CN104567685A (en) * 2015-01-23 2015-04-29 北京中拓机械集团有限责任公司 Semiconductor chip detection device
CN106158694A (en) * 2015-04-10 2016-11-23 北京北方微电子基地设备工艺研究中心有限责任公司 Detection device and semiconductor processing equipment
JP6880364B2 (en) * 2015-08-18 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and substrate processing method

Also Published As

Publication number Publication date
TWI751354B (en) 2022-01-01
US20190051532A1 (en) 2019-02-14
JP6953075B2 (en) 2021-10-27
KR20190016914A (en) 2019-02-19
KR102546465B1 (en) 2023-06-21
US10622215B2 (en) 2020-04-14
JP2019033189A (en) 2019-02-28
CN109382920A (en) 2019-02-26
CN109382920B (en) 2022-02-18
TW201911403A (en) 2019-03-16

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