SG10201807224SA - Height detecting apparatur and laser processing apparatus - Google Patents
Height detecting apparatur and laser processing apparatusInfo
- Publication number
- SG10201807224SA SG10201807224SA SG10201807224SA SG10201807224SA SG10201807224SA SG 10201807224S A SG10201807224S A SG 10201807224SA SG 10201807224S A SG10201807224S A SG 10201807224SA SG 10201807224S A SG10201807224S A SG 10201807224SA SG 10201807224S A SG10201807224S A SG 10201807224SA
- Authority
- SG
- Singapore
- Prior art keywords
- optical path
- height detecting
- light
- processing apparatus
- laser processing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
HEIGHT DETECTING APPARATUS AND LASER PROCESSING APPARATUS A spectral interference height detecting apparatus includes a chuck table for holding a workpiece thereon and a height detecting unit for detecting the height of an upper surface of the workpiece held on the chuck table. The height detecting unit includes a light source for emitting light in a predetermined wavelength band into a first optical path, a condenser disposed in the first optical path for converging light onto the workpiece held on the chuck table, a beam splitter disposed between the light source and the condenser for splitting the light in the first optical path into a second optical path, a mirror disposed in the second optical path to form a basic optical path length, for reflecting light into the second optical path and returning light through the beam splitter to the first optical path. (Figure 2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017171143A JP6953242B2 (en) | 2017-09-06 | 2017-09-06 | Height detector and laser machining equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201807224SA true SG10201807224SA (en) | 2019-04-29 |
Family
ID=65364120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201807224SA SG10201807224SA (en) | 2017-09-06 | 2018-08-24 | Height detecting apparatur and laser processing apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US11361996B2 (en) |
JP (1) | JP6953242B2 (en) |
KR (1) | KR102593879B1 (en) |
CN (1) | CN109465541B (en) |
DE (1) | DE102018214743A1 (en) |
MY (1) | MY198102A (en) |
SG (1) | SG10201807224SA (en) |
TW (1) | TWI768091B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021010936A (en) * | 2019-07-09 | 2021-02-04 | 株式会社ディスコ | Laser processing device |
JP7270216B2 (en) * | 2019-08-23 | 2023-05-10 | パナソニックIpマネジメント株式会社 | LASER PROCESSING DEVICE, LASER PROCESSING METHOD, AND CORRECTION DATA GENERATION METHOD |
JP7339086B2 (en) * | 2019-09-11 | 2023-09-05 | 株式会社ディスコ | Measuring device |
JP7408332B2 (en) * | 2019-09-27 | 2024-01-05 | 株式会社ディスコ | laser processing equipment |
JP2022030051A (en) | 2020-08-06 | 2022-02-18 | Towa株式会社 | Cutting device and manufacturing method of cutting article |
JP2022065259A (en) * | 2020-10-15 | 2022-04-27 | 株式会社ディスコ | Laser processing device |
JP2022077223A (en) * | 2020-11-11 | 2022-05-23 | 株式会社ディスコ | Laser beam machining apparatus |
CN113369682A (en) * | 2021-06-28 | 2021-09-10 | 成都飞机工业(集团)有限责任公司 | Light path system integration device for laser processing |
KR102650211B1 (en) * | 2021-12-27 | 2024-03-21 | 재단법인 구미전자정보기술원 | Apparatus for obtaining suface shape information using a single light source |
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US5042949A (en) * | 1989-03-17 | 1991-08-27 | Greenberg Jeffrey S | Optical profiler for films and substrates |
EP0474487B1 (en) * | 1990-09-07 | 1997-03-19 | Canon Kabushiki Kaisha | Method and device for optically detecting position of an article |
JPH10305420A (en) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device |
TW419839B (en) * | 1999-08-09 | 2001-01-21 | Nat Science Council | Device for measuring vibration and method thereof |
JP3408805B2 (en) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | Cutting origin region forming method and workpiece cutting method |
IL138552A (en) * | 2000-09-19 | 2006-08-01 | Nova Measuring Instr Ltd | Lateral shift measurement using an optical technique |
JP4474108B2 (en) * | 2002-09-02 | 2010-06-02 | 株式会社 日立ディスプレイズ | Display device, manufacturing method thereof, and manufacturing apparatus |
JP4260587B2 (en) * | 2003-09-18 | 2009-04-30 | 株式会社日立ハイテクノロジーズ | Pattern defect inspection system |
JP4993934B2 (en) * | 2006-03-31 | 2012-08-08 | Hoya株式会社 | Pattern defect inspection method, photomask manufacturing method, and display device substrate manufacturing method |
JP5122773B2 (en) * | 2006-08-04 | 2013-01-16 | 株式会社ディスコ | Laser processing machine |
JP4885658B2 (en) * | 2006-09-01 | 2012-02-29 | 株式会社ディスコ | Drilling hole depth detection device and laser processing machine |
JP2009050944A (en) * | 2007-08-24 | 2009-03-12 | Disco Abrasive Syst Ltd | Substrate thickness measuring method and substrate processing device |
CN101393015B (en) * | 2008-10-17 | 2010-06-16 | 华中科技大学 | On-line measurement method and device for micro/nano deep trench structure |
CN101819027A (en) * | 2009-02-27 | 2010-09-01 | 王晓东 | Method and device for detecting blind hole depth |
CN101504925B (en) * | 2009-03-06 | 2011-08-10 | 上海微电子装备有限公司 | Optical position measurement apparatus and method |
JP2010266407A (en) * | 2009-05-18 | 2010-11-25 | Disco Abrasive Syst Ltd | Height detector |
JP2011122894A (en) * | 2009-12-09 | 2011-06-23 | Disco Abrasive Syst Ltd | Apparatus for measuring workpiece held at chuck table and laser beam machine |
JP2011196785A (en) * | 2010-03-18 | 2011-10-06 | Disco Corp | Measurement apparatus and laser processing machine of to-be-processed object held on chuck table |
JP2011237348A (en) * | 2010-05-12 | 2011-11-24 | Disco Abrasive Syst Ltd | Height position measuring device for workpiece held by chuck table and laser processing apparatus |
JP5513272B2 (en) * | 2010-06-15 | 2014-06-04 | 株式会社ディスコ | Apparatus for measuring height position of workpiece held on chuck table and laser processing machine |
US9305341B2 (en) * | 2011-01-21 | 2016-04-05 | Christopher L. Claypool | System and method for measurement of through silicon structures |
JP5252026B2 (en) * | 2011-05-10 | 2013-07-31 | パナソニック株式会社 | Laser welding apparatus and laser welding method |
JP6138556B2 (en) * | 2013-04-05 | 2017-05-31 | 株式会社ディスコ | Laser processing equipment |
JP6151557B2 (en) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
JP6148075B2 (en) * | 2013-05-31 | 2017-06-14 | 株式会社ディスコ | Laser processing equipment |
GB201315715D0 (en) * | 2013-09-04 | 2013-10-16 | Metryx Ltd | Method and device for determining information relating to the mass of a semiconductor wafer |
JP6285784B2 (en) * | 2014-04-09 | 2018-02-28 | 株式会社ディスコ | Height position detector |
WO2016121685A1 (en) * | 2015-01-28 | 2016-08-04 | 株式会社東京精密 | Laser dicing device |
JP6327525B2 (en) * | 2015-01-28 | 2018-05-23 | 株式会社東京精密 | Laser dicing equipment |
-
2017
- 2017-09-06 JP JP2017171143A patent/JP6953242B2/en active Active
-
2018
- 2018-08-02 TW TW107126860A patent/TWI768091B/en active
- 2018-08-17 MY MYPI2018702918A patent/MY198102A/en unknown
- 2018-08-24 SG SG10201807224SA patent/SG10201807224SA/en unknown
- 2018-08-30 US US16/117,855 patent/US11361996B2/en active Active
- 2018-08-30 DE DE102018214743.4A patent/DE102018214743A1/en active Pending
- 2018-09-04 CN CN201811023780.6A patent/CN109465541B/en active Active
- 2018-09-05 KR KR1020180105921A patent/KR102593879B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US11361996B2 (en) | 2022-06-14 |
DE102018214743A1 (en) | 2019-03-07 |
CN109465541B (en) | 2021-11-19 |
MY198102A (en) | 2023-08-01 |
JP2019045418A (en) | 2019-03-22 |
CN109465541A (en) | 2019-03-15 |
TWI768091B (en) | 2022-06-21 |
TW201921546A (en) | 2019-06-01 |
KR20190027333A (en) | 2019-03-14 |
JP6953242B2 (en) | 2021-10-27 |
KR102593879B1 (en) | 2023-10-24 |
US20190074221A1 (en) | 2019-03-07 |
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