TW200726565A - Laser processing apparatus using laser beam splitting - Google Patents
Laser processing apparatus using laser beam splittingInfo
- Publication number
- TW200726565A TW200726565A TW095140298A TW95140298A TW200726565A TW 200726565 A TW200726565 A TW 200726565A TW 095140298 A TW095140298 A TW 095140298A TW 95140298 A TW95140298 A TW 95140298A TW 200726565 A TW200726565 A TW 200726565A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- processing apparatus
- beam splitting
- beams
- laser beam
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Abstract
The present invention relates to a laser processing apparatus using laser beam splitting, which divides an incident laser beam into at least two beams and processes a workpiece using at least two beams, thereby improving processing quality and increasing processing efficiency. The laser processing apparatus includes a beam splitting means for dividing the laser beam emitted from the laser generation means into at least two beams and causing the resultant beams to be incident on the mirror. The beam splitting means comprises a prism, beam splitter or a combination of a prism and a beam splitter.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050106475A KR100709171B1 (en) | 2005-11-08 | 2005-11-08 | Laser processing apparatus using beam split |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200726565A true TW200726565A (en) | 2007-07-16 |
TWI327498B TWI327498B (en) | 2010-07-21 |
Family
ID=38023424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140298A TWI327498B (en) | 2005-11-08 | 2006-10-31 | Laser processing apparatus using laser beam splitting |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100709171B1 (en) |
MY (1) | MY144488A (en) |
TW (1) | TWI327498B (en) |
WO (1) | WO2007055452A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100817825B1 (en) * | 2007-05-02 | 2008-03-31 | 주식회사 이오테크닉스 | Laser machining apparatus |
KR100864863B1 (en) | 2007-05-09 | 2008-10-23 | 주식회사 이오테크닉스 | Multi laser system |
KR101057457B1 (en) | 2008-11-03 | 2011-08-17 | 주식회사 이오테크닉스 | Drilling device and drilling method |
KR101339637B1 (en) * | 2010-01-18 | 2013-12-09 | 주식회사 이오테크닉스 | Laser Processing Apparatus and Method Using Beam Split |
KR101209064B1 (en) | 2011-05-19 | 2012-12-06 | 주식회사 엘에스텍 | Apparatus for forming pattern on light guide panel |
KR101826739B1 (en) * | 2016-11-21 | 2018-02-08 | 주식회사 신도리코 | 3D printer using linear laser source |
KR102618163B1 (en) | 2016-12-05 | 2023-12-27 | 삼성디스플레이 주식회사 | Laser processing apparatus |
CN110328452A (en) * | 2019-07-15 | 2019-10-15 | 广东华奕激光技术有限公司 | A kind of double-station laser cutting device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63148342A (en) * | 1986-12-12 | 1988-06-21 | Nec Corp | System for counting loop execution time |
JPH01186293A (en) * | 1988-01-22 | 1989-07-25 | Nec Corp | Laser welding method |
JPH01316415A (en) * | 1988-06-17 | 1989-12-21 | Nippon Steel Corp | Laser beam heat treating method using polygon mirror and apparatus thereof |
JPH08108289A (en) * | 1994-10-07 | 1996-04-30 | Sumitomo Electric Ind Ltd | Optical device for laser beam machining |
JPH1195773A (en) * | 1997-09-17 | 1999-04-09 | Yamaha Corp | Karaoke machine |
JP3194250B2 (en) | 1998-12-25 | 2001-07-30 | 住友重機械工業株式会社 | 2-axis laser processing machine |
JP2000288765A (en) | 1999-04-02 | 2000-10-17 | Murata Mfg Co Ltd | Method and device for machining ceramic green sheet |
KR100347766B1 (en) * | 2000-02-17 | 2002-08-09 | 주식회사 이오테크닉스 | Dividing apparatus of laser beam |
-
2005
- 2005-11-08 KR KR1020050106475A patent/KR100709171B1/en active IP Right Grant
-
2006
- 2006-06-28 WO PCT/KR2006/002517 patent/WO2007055452A1/en active Application Filing
- 2006-10-31 TW TW095140298A patent/TWI327498B/en not_active IP Right Cessation
- 2006-11-06 MY MYPI20064455A patent/MY144488A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR100709171B1 (en) | 2007-04-18 |
WO2007055452A1 (en) | 2007-05-18 |
MY144488A (en) | 2011-09-30 |
TWI327498B (en) | 2010-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |