1327498 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種雷射處理設備，尤其係關於一種使 用雷射束分岐的雷射處理設備，該設備可將入射雷射束分 成至少2束並使用至少2束的雷射束處理一工作部件，藉 此可改善雷射處理品質及增進處理效率。 【先前技術】 近來為了製造使用各種材料如晶圓、金屬及塑膠的產 品，需要如切割及溝蝕等處理程序。這些處理程序非常重 要因為它們對接下來的品質及收益有重大影響。 在這些處理程序中雷射近來常被使用。藉由集中具有 介於250至360nm高紫外線的雷射束在一工作部件的表面 上並因此產生熱能及化學反應，使用雷射的處理方法可消 除目標部份。 近來在半導體製造上，藉由減少晶片間的間隔可使每 一片晶圓的晶片數量有時增加，進而增加晶片製造的收 益。因此產業需要約15 um非常窄的晶圓處理線見^需要 增加雷射束處理的重疊程度-即工作部件上的雷射入射頻 率，並保持雷射束的強度相對地低，才能減少處理線的損 毁。然而，因其特性目前使用的雷射強度會隨着著雷射束 的頻率呈現相反比例，所以處理品質可以被改善但不能保 證處理時間。再者如果使用低頻率雷射束來改善處理速度 則雷射束會過度入射至工作部件以致於增加線寬，以致於 1227498 執行完美的處理是不可能的。 【發明内容】 本發明係用以解決上述先前技術中的問題，本發明的 目的是提供一種使用雷射束分歧的雷射處理設備，可以改 善處理速度同時又維持雷射束的強度。 本發明另外的目的是提供一種使用雷射束分歧的雷射 處理設備，其可將入射至工作部件之前的一雷射束先分成 至少兩束，並增加其功率倍數至相當於被分歧的雷射束數 量，同時並保持分歧後雷射束的強度相同於原來的雷射束 強度以改善處效能。 為達到上述目的，本發明的第一實施例說明一具有雷 射束分歧裝置的雷射處理設備，該裝置可將從雷射產生裝 置發射的一雷射束分成至少兩束，並使至少兩束雷射束入 射至一鏡子。該雷射分岐裝置可為一棱鏡、光束分岐器或 兩者之組合。 當從雷射處理設備入射的一雷射束被分成複數個雷射 束，並增加分歧後的雷射束的功率倍數至相當於被分歧的 雷射束數量，同時保持分歧後雷射束的強度相同於原來的 雷射束強度，並且雷射束的頻率也會增加。舉例來說，使 用一 200khz、4w雷射束處理的工作部件其強度相當於的一 使用1 OOkhz、2w雷射束處理工作部件。因此當一 1 OOkhz、 6w的雷射束被分成三束，並使用三束雷射束來處理工作部 件就可以產生較窄的線寬，處理速度也可增加（因為功率 1327498 . 鏡子10可為一反射鏡或—多邊形鏡。當鏡子10為— 多邊形鏡時，較佳的是，該鏡的反射表面數量讓雷射束的 直徑可覆蓋複數個反射表面。本發明申請人曾於2〇〇4年3 月31曰向韓國智產局申請_種使用多邊形鏡的雷射處理 設備的專利（韓國專利申請號：1〇_2〇〇4_〇〇22270)以及於 2GG4年8月18日中請-種使用—具有控制數量反射表面 的反射鏡之雷射處理設備（韓國專利申請號： 10-2004-0065066)。 _ 光學系統12可為-聚光鏡或―聚光鏡及—圓筒形 鏡。當光學系統12包括圓筒形鏡時，雷射束的剖面形狀為 橢圓形。如果橢圓的主軸被控制與處理方向一致可以達到 較佳處理效能。 當雷射處理設備對工作部件14進行處理時，輸入單元 150會先設定控制參數。可根據工作部件類型及處理類型 而將一選單輸入及預設於儲存單元Π〇並將選單調出來即 φ 可輕易執行設定流程。 在控制參數設定完成後’鏡子驅動單元丨40會調整鏡 . 子1〇的定位。如果鏡子是一多邊形鏡則鏡子ίο會以—預 •設的旋轉速度持續地轉動。控制單元110會啟動平台轉換 裝置18將工作部件14轉至一指定方向並控制雷射產生裝 置120產生一雷射束。當雷射束產生及發射時，發射的雷 射束被雷射束分岐裝置130分為至少2束並反射至鏡子 〇 之後由鏡子10所反射的至少2束雷射束透過光學系統 被垂直地發射至工作部件丨4。在此情況下穿透過光學系 t12的雷射束變成複數，可達職發射-雷射束至工作部 件14多次—樣的效杲。因為複數雷射束㈣被反射至工作 P件4彳達馳乍的線寬處理同時又保持與分歧前雷射 束-樣的處理速度並可確保處理後的品質。 第二A圖盘第-兑回〆^ /、 一 β圖係顯示根據本發明第一具體實施 例之，射分歧裝置的構成圖及雷射束剖面圖 第一 Α及一 Β圖説明使用一棱鏡將一雷射束分成兩束 的情況。為達本目的，—雷射束分岐裝置nG包括用以反 射-入射雷射束的第—鏡子1311，—棱鏡㈤用以分岐 由第-鏡子1311反射的雷射束，以及第二鏡子1313用以 反射從棱鏡1312所得到的兩雷射束。 在上述情況下，第一鏡子1311的功能係使雷射束入射 至棱鏡1312，該棱鏡1312再使兩雷射束依據位置彼此互 相對稱。而第二鏡子1313控制雷射束的光軸使從棱鏡1312 入射的雷射束光軸與從第一鏡子1311入射的雷射束光軸 平行。從第二鏡子1313反射的雷射束再入射至鏡子1〇然 後發射至一工作部件。為此目的，從鏡子1〇反射的雷射束 光轴必須被控制與工作部件垂直。 第二B圖顯示使用雷射分岐裝置發射雷射束至工作部 件上之剖面示意圖。可藉由棱鏡1312改變雷射束折射使具 有半圓形的兩這雷射束中間之間隔改變。根據先前技術兩 道雷射束可發射至與一雷射束完全相同的區域，即發射至 一單位區域的雷射束數量可被增加，進而提高處理效能。 1327498 第二A圖及二B圖係顯示根據本發明第二具體實施例 之雷射分歧裝置的構成圖及分歧雷射剖面圖。第三A圖及 三B圖揭露使用分W將-雷射束分成兩束。為達此目 的雷射束分岐裝置13〇包括一分光器1321用以將一入射 雷射束刀成兩束，-可改變從雷射分光器1321反射的一第 雷射束之偏振特性的偏振器1322，一第一鏡子GW用 以反射從分光器1321穿過的一第二雷射束，一第二鏡子 1325用來反射由第一鏡子1324所反射的第二雷射束，以 及偏振刀光器1323用以反射該偏振特性被偏振器1322 所轉變的第一雷射束，然後將從第二鏡子1325反射的第二 雷射束通過此處。經由偏振分光器1323反射及通過的第一 及第二雷射束再藉由鏡子1〇垂直發射在工作部件上。 第三B圖顯示在雷射束分岐裝置上的第一及第二雷射 面圖。可藉由改變第二鏡子1325的位置來任意控制兩道 雷射束的間隔。 偏振分光器1323發出的雷射束光軸必須控制與入射 至分光器1321的雷射束光軸平行並且從鏡子1〇反射的雷 射束光軸必須控制與工作部件垂直。 此外’用以將水平直線偏振光（p_偏振光）轉換成垂 直直線偏振光（s偏振光）的偏光鏡可以使用作為偏振器 1322，而用來通過及反射s偏振光的偏振分光器可為偏振 分光器1323。 第四A圖及第四b圖係顯示根據本發明第三具體實施 例之雷射分歧裝置的構成圖及雷射束剖面圖。 1327498 本具體實施例揭示透過一分光器將一雷射束分成兩束 之每射分岐裝置’並可將兩雷射束任一束再分成兩束因此 可產生三道雷射束。 如第四A圖所示，本實施例的雷射分岐裝置包括有一 刀光器1331用以將一入射雷射束分成兩束，一可改變從雷 射分光器1331反射的雷射束之偏振特性的偏振器1332, —棱鏡1333將偏振器1332偏振後的雷射束分為第一及第 二雷射束’一第一鏡子1335用來反射穿過分光器1331的 第二雷射束，一第二鏡子丨336用來反射由第一鏡子1335 所反射的第三雷射束，以及一偏振分光器1334用以反射從 棱鏡1333發射的第一及第二雷射束並將入射於第二鏡子 的第二雷射束通過此處。由偏振分光器反射或 通過的第一至第二雷射束藉由鏡子1〇垂直發射在工作部 件上。 第四B圖顯示根據本實施例的雷射分岐裝置所得到的 雷射束剖面圖。可藉由控制棱鏡1333的折射率來調整第一 及第二雷射束的間隔，也可藉由控制棱鏡1333的配置使這 兩道雷射束彼此對稱，並且可以控制第二鏡子1336的位置 來調整第三雷射束的位置。 用以將水平直線偏振光（p-偏振光）轉換成垂直直線 偏振光（s偏振光）的偏光鏡可以使用作為偏振器1332， 而用來通過及反射S偏振光的偏振分光器可為偏振分光器 1334。 第五A圖及五B圖係顯示根據本發明第四具體實施例1327498 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus using laser beam splitting, which can divide an incident laser beam into at least two beams A working beam is processed using at least two laser beams, thereby improving the quality of the laser processing and improving the processing efficiency. [Prior Art] Recently, in order to manufacture products using various materials such as wafers, metals, and plastics, processing procedures such as cutting and gully etching are required. These processes are important because they have a significant impact on the quality and benefits of the next. Lasers have recently been used in these processes. By concentrating a laser beam having a high ultraviolet ray of 250 to 360 nm on the surface of a working member and thereby generating thermal energy and chemical reaction, the laser treatment method can eliminate the target portion. Recently, in semiconductor manufacturing, the number of wafers per wafer is sometimes increased by reducing the spacing between wafers, thereby increasing the profitability of wafer fabrication. Therefore, the industry needs a very narrow wafer processing line of about 15 um. See the need to increase the overlap of the laser beam processing - that is, the laser incident frequency on the working part, and keep the intensity of the laser beam relatively low to reduce the processing line. Damaged. However, the laser intensity currently used for its characteristics will be inversely proportional to the frequency of the laser beam, so the processing quality can be improved but the processing time cannot be guaranteed. Furthermore, if a low-frequency laser beam is used to improve the processing speed, the laser beam will be excessively incident on the working part so as to increase the line width, so that 1227498 performing perfect processing is impossible. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems in the prior art, and an object of the present invention is to provide a laser processing apparatus using laser beam divergence, which can improve the processing speed while maintaining the intensity of the laser beam. It is a further object of the present invention to provide a laser processing apparatus using laser beam divergence that first divides a laser beam incident before a working component into at least two beams and increases its power multiplier to correspond to a divergent mine. The number of beams, while maintaining the divergence, the intensity of the laser beam is the same as the original laser beam intensity to improve performance. In order to achieve the above object, a first embodiment of the present invention describes a laser processing apparatus having a laser beam diverging device that divides a laser beam emitted from a laser generating device into at least two beams and enables at least two The beam of the beam is incident on a mirror. The laser branching device can be a prism, a beam splitter or a combination of the two. When a laser beam incident from a laser processing device is divided into a plurality of laser beams, and the power multiple of the divergent laser beam is increased to correspond to the number of divergent laser beams while maintaining the divergence of the laser beam The intensity is the same as the original laser beam intensity, and the frequency of the laser beam is also increased. For example, a 200 khz, 4W laser beam treated work piece is used to process a working part with a strength equivalent to a 1 OOkhz, 2w laser beam. Therefore, when a 1 OOkhz, 6w laser beam is divided into three beams, and three laser beams are used to process the working part, a narrow line width can be generated, and the processing speed can also be increased (because the power is 1327498. The mirror 10 can be A mirror or a polygon mirror. When the mirror 10 is a polygonal mirror, preferably, the number of reflective surfaces of the mirror allows the diameter of the laser beam to cover a plurality of reflective surfaces. The applicant of the present invention has 2 On March 31, 2014, he applied to the Korea Intellectual Property Office for a patent for a laser processing equipment using a polygon mirror (Korean Patent Application No.: 1〇_2〇〇4_〇〇22270) and on August 18, 2GG4 A laser processing apparatus having a mirror that controls the number of reflective surfaces (Korean Patent Application No.: 10-2004-0065066). The optical system 12 can be a condensing mirror or a concentrating mirror and a cylindrical mirror. When the optical system 12 includes a cylindrical mirror, the cross-sectional shape of the laser beam is elliptical. If the major axis of the ellipse is controlled to be consistent with the processing direction, better processing performance can be achieved. When the laser processing apparatus processes the working component 14 , input form 150 will first set the control parameters. According to the type of work part and the type of processing, a menu can be input and preset to the storage unit, and the menu can be adjusted. φ can be easily executed. After the control parameter setting is completed, the mirror drive The unit 丨40 adjusts the positioning of the mirror. If the mirror is a polygon mirror, the mirror ίο will continuously rotate at a pre-set rotational speed. The control unit 110 activates the platform switching device 18 to rotate the working member 14 to A laser beam is generated by a specified direction and controlled laser generating device 120. When the laser beam is generated and emitted, the emitted laser beam is split into at least two beams by the laser beam splitting device 130 and reflected to the mirror and then mirrored by the mirror. 10 reflected at least two laser beams are transmitted vertically through the optical system to the working member 丨4. In this case, the laser beam penetrating through the optical system t12 becomes a complex number, and the laser beam is transmitted to the working unit. 14 times-like effect. Because the complex laser beam (four) is reflected to the working P piece 4 彳 乍 乍 乍 乍 乍 乍 乍 乍 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 分歧 分歧The quality of the processed second. The second A-panel-return 〆^/, a β-picture shows the first diagram of the configuration of the diverging device and the cross-sectional view of the laser beam according to the first embodiment of the present invention. A diagram illustrating the use of a prism to split a laser beam into two beams. For this purpose, the laser beam splitting device nG includes a first mirror 1311 for reflecting-incident laser beams, and a prism (5) for The laser beam reflected by the first mirror 1311 and the second mirror 1313 are used to reflect the two laser beams obtained from the prism 1312. In the above case, the function of the first mirror 1311 causes the laser beam to be incident on the prism. At 1312, the prism 1312 further aligns the two laser beams with each other depending on the position. The second mirror 1313 controls the optical axis of the laser beam such that the optical axis of the laser beam incident from the prism 1312 is parallel to the optical axis of the laser beam incident from the first mirror 1311. The laser beam reflected from the second mirror 1313 is incident on the mirror 1 and then emitted to a working part. For this purpose, the beam axis of the beam reflected from the mirror 1 must be controlled perpendicular to the working part. Figure B is a schematic cross-sectional view showing the use of a laser-split device to emit a laser beam onto a workpiece. The laser beam refraction can be varied by prism 1312 to change the spacing between the two laser beams having a semicircle. According to the prior art, two laser beams can be emitted to exactly the same area as a laser beam, i.e., the number of laser beams emitted to a unit area can be increased, thereby improving the processing efficiency. 1327498 FIGS. 2A and 2B show a configuration diagram of a laser divergence device and a cross-sectional view of a divergent laser according to a second embodiment of the present invention. The third A and third B diagrams disclose the use of a sub-W to split the laser beam into two beams. To this end, the laser beam splitting device 13A includes a beam splitter 1321 for splitting an incident laser beam into two beams, which can change the polarization of the polarization characteristics of a first laser beam reflected from the laser beam splitter 1321. a first mirror GW for reflecting a second laser beam passing through the beam splitter 1321, a second mirror 1325 for reflecting the second laser beam reflected by the first mirror 1324, and a polarizing knife The optical device 1323 is configured to reflect the first laser beam whose polarization characteristic is converted by the polarizer 1322, and then pass the second laser beam reflected from the second mirror 1325 therethrough. The first and second laser beams reflected and passed through the polarization beam splitter 1323 are then vertically emitted on the working member by the mirror 1 。. Figure 3B shows the first and second laser views on the laser beam splitting device. The interval between the two laser beams can be arbitrarily controlled by changing the position of the second mirror 1325. The optical axis of the laser beam emitted by the polarization beam splitter 1323 must be controlled in parallel with the optical axis of the laser beam incident on the beam splitter 1321 and the optical axis of the beam reflected from the mirror 1 must be controlled perpendicular to the working member. In addition, a polarizer for converting horizontally linearly polarized light (p-polarized light) into vertically linearly polarized light (s-polarized light) can be used as the polarizer 1322, and a polarizing beam splitter for passing and reflecting s-polarized light can be used. It is a polarization beam splitter 1323. The fourth A diagram and the fourth b diagram show a configuration diagram of a laser divergence device and a cross-sectional view of a laser beam according to a third embodiment of the present invention. 1327498 This embodiment discloses splitting a laser beam into two beams per beam splitting device by a beam splitter and splitting either beam of the two laser beams into two beams so that three laser beams can be generated. As shown in FIG. 4A, the laser branching device of the present embodiment includes a knife 1331 for splitting an incident laser beam into two beams, one for changing the polarization of the laser beam reflected from the laser beam splitter 1331. The characteristic polarizer 1332, the prism 1333 divides the polarized beam polarized by the polarizer 1332 into first and second laser beams 'a first mirror 1335 is used to reflect the second laser beam passing through the beam splitter 1331, A second mirror 丨 336 is used to reflect the third laser beam reflected by the first mirror 1335, and a polarization beam splitter 1334 is used to reflect the first and second laser beams emitted from the prism 1333 and will be incident on the first The second laser beam of the second mirror passes here. The first to second laser beams reflected or passed by the polarization beam splitter are vertically emitted on the working member by the mirror 1 。. Fig. 4B is a cross-sectional view showing the laser beam obtained by the laser branching device according to the present embodiment. The spacing of the first and second laser beams can be adjusted by controlling the refractive index of the prism 1333, and the two laser beams can be symmetrical to each other by controlling the configuration of the prism 1333, and the position of the second mirror 1336 can be controlled. To adjust the position of the third laser beam. A polarizer for converting horizontally linearly polarized light (p-polarized light) into vertically linearly polarized light (s-polarized light) can be used as the polarizer 1332, and a polarizing beam splitter for passing and reflecting the S-polarized light can be polarized. Beam splitter 1334. 5A and 5B show a fourth embodiment according to the present invention
II 1327498 ' 之雷射分歧裝置的構成圖及其雷射束剖面圖。 本具體實施例揭示透過一棱鏡將一雷射束分成兩束之 雷射分岐裝置’並可將兩雷射束每一束再分成兩束因此可 產生四道雷射束。 如第五圖所示’本實施例的雷射分岐裝置包括一棱鏡 1341用以將一入射雷射束分成2束’一分光器1342將從 棱鏡1341得到的2束雷射束之每一束再分成2束並反射或 由此通過雷射束’一偏振器1343用以改變由分光器1342 I 反射的第一及第二雷射束的偏振特性，一第二鏡子1346用 來反射由第一鏡子1345反射的雷射束，以及一偏振分光器 1344用以反射已由偏振器1343改變偏振特性的第一及第 二雷射束並將入射於第二鏡子1346的第三及第四雷射束 通過此處。由偏振分光器1344反射或通過的第一至第四雷 射束藉由鏡子10垂直發射在工作部件上。 第五B圖顯示根據本實施例的雷射分岐裝_置所得到的 • 雷射束剖面圖。可藉由控制棱鏡1341的折射率或第二鏡子 1346的配置來調整第一至第四雷射束的間隔。在此情況 下’由第二鏡子1346所反射的雷射束光軸必須控制與入射 到棱鏡1341的雷射束光軸平行，並且由鏡子1〇所反射的 雷射束光軸必須控制與工作部件垂直。 在上述本發明實施例中，揭露使用棱鏡，分光器或棱 鏡與分光器的組合可將一雷射束分為兩束或更多束而把所 得到的雷射束用來處理工作部件。所有被分岐雷射束的總 合能量與原來的雷射束相同所以可以維持處理速度，而被 12 1327498 分岐雷射束的強度比原來的雷射束低所以可產生較窄線 寬。被分岐雷射束間的間隔可經由構成雷射分岐裝置的光 學元件的配置而被輕易改變。 雖然已經參考較佳具體實施例來顯示和說明本發明， 熟習此項技術者在範圍内所作的各種變更、增加及置換， 不會脫離申請專利範圍内所定義之本發明範疇。 0 【圖式簡單說明】 第一圖係顯示本發明之雷射處理設備的構成圖； 第二A圖係顯示根據本發明第一具體實施例之雷射分 歧裝置的構成圖； 第二B圖係說明將根據本發明第一具體實施例的分歧 雷射剖面圖； 第三A圖係顯示根據本發明第二具體實施例之雷射分 歧裝置的構成圖； • 第三B圖係說明將根據本發明第二具體實施例的分歧 雷射剖面圖； ' 第四A圖係顯示根據本發明第三具體實施例之雷射分 歧裝置的構成圖； 第四B圖係說明將根據本發明第三具體實施例的分歧 雷射剖面圖； 第五A圖係顯示根據本發明第四具體實施例之雷射分 歧裝置的構成圖， 第五B圖係說明將根據本發明第四具體實施例的分歧 13 1327498 雷射剖面圖；II 1327498 'The composition of the laser divergence device and its laser beam profile. This embodiment discloses a laser branching device that splits a laser beam into two beams through a prism and divides the two laser beams into two beams, thereby producing four laser beams. As shown in the fifth figure, the laser branching device of the present embodiment includes a prism 1341 for dividing an incident laser beam into two beams, a beam splitter 1342, and each of the two laser beams obtained from the prism 1341. Dividing into two beams and reflecting or thereby passing through the laser beam 'a polarizer 1343 for changing the polarization characteristics of the first and second laser beams reflected by the beam splitter 1342 I, a second mirror 1346 is used to reflect a laser beam reflected by a mirror 1345, and a polarization beam splitter 1344 for reflecting the first and second laser beams that have been polarized by the polarizer 1343 and will be incident on the third and fourth thunder of the second mirror 1346. The beam passes here. The first to fourth laser beams reflected or passed by the polarization beam splitter 1344 are vertically emitted by the mirror 10 on the working member. Fig. 5B is a cross-sectional view showing the laser beam obtained by the laser sub-assembly according to the present embodiment. The spacing of the first to fourth laser beams can be adjusted by controlling the refractive index of the prism 1341 or the configuration of the second mirror 1346. In this case, the optical axis of the laser beam reflected by the second mirror 1346 must be controlled in parallel with the optical axis of the laser beam incident on the prism 1341, and the optical axis of the laser beam reflected by the mirror 1 must be controlled and operated. The parts are vertical. In the above-described embodiments of the present invention, the use of a prism, a beam splitter or a combination of a prism and a beam splitter can be used to divide a laser beam into two or more beams and use the resulting laser beam to process the working components. The sum of the energy of all the split laser beams is the same as the original laser beam, so the processing speed can be maintained, and the intensity of the 12 1327498 split laser beam is lower than the original laser beam, so that a narrower line width can be produced. The spacing between the split laser beams can be easily changed via the configuration of the optical components that make up the laser branching device. While the invention has been shown and described with reference to the preferred embodiments of the present invention, the various modifications, additions and permutations of those skilled in the art can be made without departing from the scope of the invention as defined in the appended claims. 0 [Brief Description of the Drawings] The first drawing shows the configuration of the laser processing apparatus of the present invention; the second drawing shows the constitutional drawing of the laser diverging apparatus according to the first embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a cross-sectional view showing a divergence laser according to a first embodiment of the present invention; FIG. 3 is a view showing a configuration of a laser divergence device according to a second embodiment of the present invention; A divergent laser cross-sectional view of a second embodiment of the present invention; 'fourth A is a structural diagram showing a laser divergence device according to a third embodiment of the present invention; and a fourth B is a third embodiment according to the present invention. A divergent laser cross-sectional view of a specific embodiment; a fifth A diagram showing a configuration of a laser divergence device according to a fourth embodiment of the present invention, and a fifth B diagram illustrating a divergence according to the fourth embodiment of the present invention 13 1327498 Laser profile view;
【主要元件符號說明】 10 鏡子 12 光學系統 14 工作部件 16 平台 18 平台轉換裝置 110 控制單元 120 雷射產生裝置 130 雷射分岐裝置 140 鏡子驅動單元 150 輸入單元 160 輸出單元 54 第二棱鏡板 170 儲存單元 1311 第一鏡子 1312 棱鏡 1313 第二鏡子 1321 分光器 1322 偏振器 1323 偏振分光器 1324 第一鏡子 1325 第二鏡子 14 1327498 分光器 偏振益 棱鏡 偏振分光器 第一鏡子 第二鏡子 棱鏡 分光器 偏振斋 偏振分光器 第一鏡子 第二鏡子[Main component symbol description] 10 Mirror 12 Optical system 14 Working component 16 Platform 18 Platform conversion device 110 Control unit 120 Laser generating device 130 Laser branching device 140 Mirror driving unit 150 Input unit 160 Output unit 54 Second prism plate 170 Storage Unit 1311 First Mirror 1312 Prism 1313 Second Mirror 1321 Beam Splitter 1322 Polarizer 1323 Polarization Beam Splitter 1324 First Mirror 1325 Second Mirror 14 1327498 Beam Splitter Polar Prism Polarization Beam Splitter First Mirror Second Mirror Prism Beam Splitter Polarizing beam splitter first mirror second mirror