JP2019075413A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019075413A5 JP2019075413A5 JP2017198618A JP2017198618A JP2019075413A5 JP 2019075413 A5 JP2019075413 A5 JP 2019075413A5 JP 2017198618 A JP2017198618 A JP 2017198618A JP 2017198618 A JP2017198618 A JP 2017198618A JP 2019075413 A5 JP2019075413 A5 JP 2019075413A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- substrate
- nozzle
- droplet
- rinse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 342
- 239000000758 substrate Substances 0.000 claims description 127
- 230000001681 protective effect Effects 0.000 claims description 82
- 238000004140 cleaning Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- 238000007599 discharging Methods 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 12
- 238000003672 processing method Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 9
- 230000007717 exclusion Effects 0.000 claims description 5
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003595 mist Substances 0.000 description 2
- -1 dry air or clean air Chemical compound 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017198618A JP6966917B2 (ja) | 2017-10-12 | 2017-10-12 | 基板処理方法および基板処理装置 |
| PCT/JP2018/037271 WO2019073905A1 (ja) | 2017-10-12 | 2018-10-04 | 基板処理方法および基板処理装置 |
| CN201880060333.XA CN111095494B (zh) | 2017-10-12 | 2018-10-04 | 基板处理方法及基板处理装置 |
| KR1020207008765A KR102346493B1 (ko) | 2017-10-12 | 2018-10-04 | 기판 처리 방법 및 기판 처리 장치 |
| TW107136001A TWI697948B (zh) | 2017-10-12 | 2018-10-12 | 基板處理方法以及基板處理裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017198618A JP6966917B2 (ja) | 2017-10-12 | 2017-10-12 | 基板処理方法および基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019075413A JP2019075413A (ja) | 2019-05-16 |
| JP2019075413A5 true JP2019075413A5 (enExample) | 2020-12-10 |
| JP6966917B2 JP6966917B2 (ja) | 2021-11-17 |
Family
ID=66100772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017198618A Active JP6966917B2 (ja) | 2017-10-12 | 2017-10-12 | 基板処理方法および基板処理装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6966917B2 (enExample) |
| KR (1) | KR102346493B1 (enExample) |
| CN (1) | CN111095494B (enExample) |
| TW (1) | TWI697948B (enExample) |
| WO (1) | WO2019073905A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7285166B2 (ja) * | 2019-08-20 | 2023-06-01 | 株式会社荏原製作所 | 基板洗浄方法および基板洗浄装置 |
| CN116153775B (zh) * | 2020-03-05 | 2025-11-18 | 东京毅力科创株式会社 | 基片处理方法和基片处理装置 |
| KR102682854B1 (ko) * | 2020-06-02 | 2024-07-10 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
| CN114888722B (zh) * | 2022-05-17 | 2024-11-22 | 华海清科股份有限公司 | 一种化学机械抛光方法 |
| US12138745B2 (en) * | 2023-03-22 | 2024-11-12 | Yield Engineering Systems, Inc. | Apparatus and method for coating removal |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3834542B2 (ja) * | 2001-11-01 | 2006-10-18 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法 |
| TW561516B (en) * | 2001-11-01 | 2003-11-11 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| JP2007012998A (ja) * | 2005-07-01 | 2007-01-18 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置およびそれを備えた基板処理システム |
| US7766565B2 (en) * | 2005-07-01 | 2010-08-03 | Sokudo Co., Ltd. | Substrate drying apparatus, substrate cleaning apparatus and substrate processing system |
| JP2008130643A (ja) * | 2006-11-17 | 2008-06-05 | Dainippon Screen Mfg Co Ltd | ノズル、基板処理装置および基板処理方法 |
| JP5151629B2 (ja) * | 2008-04-03 | 2013-02-27 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体 |
| JP5512424B2 (ja) * | 2010-07-06 | 2014-06-04 | 東京エレクトロン株式会社 | 基板洗浄装置および基板洗浄方法 |
| JP6709555B2 (ja) * | 2015-03-05 | 2020-06-17 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP6508721B2 (ja) | 2015-09-28 | 2019-05-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
-
2017
- 2017-10-12 JP JP2017198618A patent/JP6966917B2/ja active Active
-
2018
- 2018-10-04 CN CN201880060333.XA patent/CN111095494B/zh active Active
- 2018-10-04 KR KR1020207008765A patent/KR102346493B1/ko active Active
- 2018-10-04 WO PCT/JP2018/037271 patent/WO2019073905A1/ja not_active Ceased
- 2018-10-12 TW TW107136001A patent/TWI697948B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019075413A5 (enExample) | ||
| JP5470306B2 (ja) | ２流体ノズル、基板液処理装置、基板液処理方法、及び基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体 | |
| US9378988B2 (en) | Substrate processing apparatus and substrate processing method using processing solution | |
| TWI557792B (zh) | 基板處理裝置、基板處理方法及記憶媒體 | |
| JP5284004B2 (ja) | 基板の処理装置 | |
| TWI443722B (zh) | 基板處理裝置及基板處理方法 | |
| KR100949090B1 (ko) | 스핀 유닛 및 이를 갖는 기판 가공 장치 | |
| CN110537245B (zh) | 衬底处理装置及衬底处理方法 | |
| CN204668283U (zh) | 晶片处理装置 | |
| TWI698922B (zh) | 基板處理方法及基板處理裝置 | |
| JP6784546B2 (ja) | 基板処理装置 | |
| TWI697948B (zh) | 基板處理方法以及基板處理裝置 | |
| JP2002208579A (ja) | 基板処理装置および基板処理方法 | |
| JP2014130884A5 (enExample) | ||
| JP2009231628A (ja) | 基板処理装置 | |
| TWI595545B (zh) | 基板處理方法及基板處理裝置 | |
| JPH10308374A (ja) | 洗浄方法及び洗浄装置 | |
| JP2015037147A (ja) | 洗浄装置及び洗浄方法 | |
| TWI745830B (zh) | 液處理裝置及液處理方法 | |
| KR102134261B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| JP4707730B2 (ja) | 半導体ウェーハの洗浄装置、及び半導体ウェーハの洗浄方法 | |
| JP2016072344A (ja) | 基板処理装置および基板処理方法 | |
| KR20220047335A (ko) | 기판 세정 방법 및 기판 세정 장치 | |
| KR102248891B1 (ko) | 노즐 유닛 및 기판 처리 장치 | |
| JP6934918B2 (ja) | 基板洗浄装置 |