JP2014130884A5 - - Google Patents

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Publication number
JP2014130884A5
JP2014130884A5 JP2012287122A JP2012287122A JP2014130884A5 JP 2014130884 A5 JP2014130884 A5 JP 2014130884A5 JP 2012287122 A JP2012287122 A JP 2012287122A JP 2012287122 A JP2012287122 A JP 2012287122A JP 2014130884 A5 JP2014130884 A5 JP 2014130884A5
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JP
Japan
Prior art keywords
substrate
cleaning
fluid nozzle
fluid
fluid jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2012287122A
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English (en)
Japanese (ja)
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JP2014130884A (ja
JP6093569B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2012287122A priority Critical patent/JP6093569B2/ja
Priority claimed from JP2012287122A external-priority patent/JP6093569B2/ja
Priority to KR1020130157711A priority patent/KR102103356B1/ko
Priority to US14/139,685 priority patent/US10737301B2/en
Priority to TW102147711A priority patent/TWI586488B/zh
Publication of JP2014130884A publication Critical patent/JP2014130884A/ja
Publication of JP2014130884A5 publication Critical patent/JP2014130884A5/ja
Application granted granted Critical
Publication of JP6093569B2 publication Critical patent/JP6093569B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012287122A 2012-12-28 2012-12-28 基板洗浄装置 Active JP6093569B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012287122A JP6093569B2 (ja) 2012-12-28 2012-12-28 基板洗浄装置
KR1020130157711A KR102103356B1 (ko) 2012-12-28 2013-12-18 기판 세정 장치
US14/139,685 US10737301B2 (en) 2012-12-28 2013-12-23 Substrate cleaning apparatus
TW102147711A TWI586488B (zh) 2012-12-28 2013-12-23 基板洗淨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287122A JP6093569B2 (ja) 2012-12-28 2012-12-28 基板洗浄装置

Publications (3)

Publication Number Publication Date
JP2014130884A JP2014130884A (ja) 2014-07-10
JP2014130884A5 true JP2014130884A5 (enExample) 2015-08-27
JP6093569B2 JP6093569B2 (ja) 2017-03-08

Family

ID=51015751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012287122A Active JP6093569B2 (ja) 2012-12-28 2012-12-28 基板洗浄装置

Country Status (4)

Country Link
US (1) US10737301B2 (enExample)
JP (1) JP6093569B2 (enExample)
KR (1) KR102103356B1 (enExample)
TW (1) TWI586488B (enExample)

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* Cited by examiner, † Cited by third party
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JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
CN111589752B (zh) * 2014-04-01 2023-02-03 株式会社荏原制作所 清洗装置
KR20160065226A (ko) * 2014-11-07 2016-06-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
JP6545511B2 (ja) * 2015-04-10 2019-07-17 株式会社東芝 処理装置
KR101704494B1 (ko) * 2015-05-26 2017-02-09 주식회사 케이씨텍 고속 유체 분사 노즐 및 이를 이용한 기판 처리 장치
WO2017098823A1 (ja) 2015-12-07 2017-06-15 東京エレクトロン株式会社 基板洗浄装置
US20170178918A1 (en) * 2015-12-18 2017-06-22 Globalfoundries Inc. Post-polish wafer cleaning
US11355366B2 (en) 2018-08-30 2022-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for shuttered wafer cleaning
US11791173B2 (en) * 2019-03-21 2023-10-17 Samsung Electronics Co., Ltd. Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
TWI765192B (zh) * 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7407574B2 (ja) * 2019-11-29 2024-01-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
CN112122197A (zh) * 2020-09-11 2020-12-25 鹤壁市人民医院 一种医疗用重症监护护理消毒装置
JP7584965B2 (ja) * 2020-09-24 2024-11-18 芝浦メカトロニクス株式会社 洗浄装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

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TWI613037B (zh) * 2011-07-19 2018-02-01 荏原製作所股份有限公司 硏磨方法
JP2013089797A (ja) 2011-10-19 2013-05-13 Ebara Corp 基板洗浄方法及び基板洗浄装置
JP5528486B2 (ja) * 2012-02-07 2014-06-25 東京エレクトロン株式会社 基板処理装置、これを備える塗布現像装置、及び基板処理方法
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体

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