KR102103356B1 - 기판 세정 장치 - Google Patents

기판 세정 장치 Download PDF

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Publication number
KR102103356B1
KR102103356B1 KR1020130157711A KR20130157711A KR102103356B1 KR 102103356 B1 KR102103356 B1 KR 102103356B1 KR 1020130157711 A KR1020130157711 A KR 1020130157711A KR 20130157711 A KR20130157711 A KR 20130157711A KR 102103356 B1 KR102103356 B1 KR 102103356B1
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KR
South Korea
Prior art keywords
substrate
fluid
fluid nozzle
cleaning
holding mechanism
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KR1020130157711A
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English (en)
Korean (ko)
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KR20140086840A (ko
Inventor
도모아츠 이시바시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20140086840A publication Critical patent/KR20140086840A/ko
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Publication of KR102103356B1 publication Critical patent/KR102103356B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020130157711A 2012-12-28 2013-12-18 기판 세정 장치 Active KR102103356B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-287122 2012-12-28
JP2012287122A JP6093569B2 (ja) 2012-12-28 2012-12-28 基板洗浄装置

Publications (2)

Publication Number Publication Date
KR20140086840A KR20140086840A (ko) 2014-07-08
KR102103356B1 true KR102103356B1 (ko) 2020-04-22

Family

ID=51015751

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130157711A Active KR102103356B1 (ko) 2012-12-28 2013-12-18 기판 세정 장치

Country Status (4)

Country Link
US (1) US10737301B2 (enExample)
JP (1) JP6093569B2 (enExample)
KR (1) KR102103356B1 (enExample)
TW (1) TWI586488B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
CN104971916B (zh) * 2014-04-01 2020-07-07 株式会社荏原制作所 清洗装置及清洗方法
KR20160065226A (ko) * 2014-11-07 2016-06-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
JP6545511B2 (ja) 2015-04-10 2019-07-17 株式会社東芝 処理装置
KR101704494B1 (ko) * 2015-05-26 2017-02-09 주식회사 케이씨텍 고속 유체 분사 노즐 및 이를 이용한 기판 처리 장치
CN108369905B (zh) * 2015-12-07 2022-08-23 东京毅力科创株式会社 基板清洗装置
US20170178918A1 (en) * 2015-12-18 2017-06-22 Globalfoundries Inc. Post-polish wafer cleaning
US11355366B2 (en) 2018-08-30 2022-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for shuttered wafer cleaning
US11791173B2 (en) * 2019-03-21 2023-10-17 Samsung Electronics Co., Ltd. Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
TWI765192B (zh) * 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7407574B2 (ja) * 2019-11-29 2024-01-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
CN112122197A (zh) * 2020-09-11 2020-12-25 鹤壁市人民医院 一种医疗用重症监护护理消毒装置
JP7584965B2 (ja) * 2020-09-24 2024-11-18 芝浦メカトロニクス株式会社 洗浄装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

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US20020148916A1 (en) 1999-07-01 2002-10-17 Lam Research Corporation Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing
JP2004079767A (ja) 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
US20040200513A1 (en) 2000-09-22 2004-10-14 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP2005353739A (ja) 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US20060068093A1 (en) 2002-12-26 2006-03-30 Hideo Shite Coating device and coating film forming method
US20070006904A1 (en) 2005-06-27 2007-01-11 Spc Electronics Corporation Substrate cleaning system and substrate cleaning method
US20070044823A1 (en) 2005-08-30 2007-03-01 Tokyo Electron Limited Substrate cleaning device and substrate cleaning method

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US6491764B2 (en) * 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
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JP3865602B2 (ja) * 2001-06-18 2007-01-10 大日本スクリーン製造株式会社 基板洗浄装置
TW561516B (en) * 2001-11-01 2003-11-11 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
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US7387455B2 (en) * 2002-06-07 2008-06-17 Tokyo Electron Limited Substrate processing device, substrate processing method, and developing device
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
JP2004335671A (ja) * 2003-05-07 2004-11-25 Renesas Technology Corp 枚葉式２流体洗浄装置及び半導体装置の洗浄方法
KR100758220B1 (ko) * 2005-10-20 2007-09-17 주식회사 케이씨텍 다중 슬릿형 노즐을 가지는 기판 세정 장치 및 이를 이용한세정 방법
JP4547016B2 (ja) * 2008-04-04 2010-09-22 東京エレクトロン株式会社 半導体製造装置、半導体製造方法
KR101041872B1 (ko) * 2008-11-26 2011-06-16 세메스 주식회사 노즐 및 이를 이용한 기판 처리 장치 및 방법
JP5294944B2 (ja) 2009-03-31 2013-09-18 株式会社荏原製作所 基板の洗浄方法
US20110289795A1 (en) * 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
JP2012174933A (ja) * 2011-02-22 2012-09-10 Toppan Printing Co Ltd 基板処理装置及び基板処理方法
JP5789400B2 (ja) * 2011-04-12 2015-10-07 東京エレクトロン株式会社 液処理方法及び液処理装置
TWI548483B (zh) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 研磨裝置及方法
JP2013089797A (ja) 2011-10-19 2013-05-13 Ebara Corp 基板洗浄方法及び基板洗浄装置
JP5528486B2 (ja) * 2012-02-07 2014-06-25 東京エレクトロン株式会社 基板処理装置、これを備える塗布現像装置、及び基板処理方法
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020148916A1 (en) 1999-07-01 2002-10-17 Lam Research Corporation Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing
US20040200513A1 (en) 2000-09-22 2004-10-14 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP2004079767A (ja) 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
US20060068093A1 (en) 2002-12-26 2006-03-30 Hideo Shite Coating device and coating film forming method
JP2005353739A (ja) 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US20070006904A1 (en) 2005-06-27 2007-01-11 Spc Electronics Corporation Substrate cleaning system and substrate cleaning method
US20070044823A1 (en) 2005-08-30 2007-03-01 Tokyo Electron Limited Substrate cleaning device and substrate cleaning method

Also Published As

Publication number Publication date
KR20140086840A (ko) 2014-07-08
US10737301B2 (en) 2020-08-11
TW201424936A (zh) 2014-07-01
US20140182634A1 (en) 2014-07-03
JP2014130884A (ja) 2014-07-10
TWI586488B (zh) 2017-06-11
JP6093569B2 (ja) 2017-03-08

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