TWI586488B - 基板洗淨裝置 - Google Patents

基板洗淨裝置 Download PDF

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Publication number
TWI586488B
TWI586488B TW102147711A TW102147711A TWI586488B TW I586488 B TWI586488 B TW I586488B TW 102147711 A TW102147711 A TW 102147711A TW 102147711 A TW102147711 A TW 102147711A TW I586488 B TWI586488 B TW I586488B
Authority
TW
Taiwan
Prior art keywords
substrate
fluid nozzle
fluid
cleaning
line
Prior art date
Application number
TW102147711A
Other languages
English (en)
Chinese (zh)
Other versions
TW201424936A (zh
Inventor
石橋知淳
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201424936A publication Critical patent/TW201424936A/zh
Application granted granted Critical
Publication of TWI586488B publication Critical patent/TWI586488B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW102147711A 2012-12-28 2013-12-23 基板洗淨裝置 TWI586488B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287122A JP6093569B2 (ja) 2012-12-28 2012-12-28 基板洗浄装置

Publications (2)

Publication Number Publication Date
TW201424936A TW201424936A (zh) 2014-07-01
TWI586488B true TWI586488B (zh) 2017-06-11

Family

ID=51015751

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102147711A TWI586488B (zh) 2012-12-28 2013-12-23 基板洗淨裝置

Country Status (4)

Country Link
US (1) US10737301B2 (enExample)
JP (1) JP6093569B2 (enExample)
KR (1) KR102103356B1 (enExample)
TW (1) TWI586488B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
CN111589752B (zh) * 2014-04-01 2023-02-03 株式会社荏原制作所 清洗装置
KR20160065226A (ko) * 2014-11-07 2016-06-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
JP6545511B2 (ja) * 2015-04-10 2019-07-17 株式会社東芝 処理装置
KR101704494B1 (ko) * 2015-05-26 2017-02-09 주식회사 케이씨텍 고속 유체 분사 노즐 및 이를 이용한 기판 처리 장치
WO2017098823A1 (ja) 2015-12-07 2017-06-15 東京エレクトロン株式会社 基板洗浄装置
US20170178918A1 (en) * 2015-12-18 2017-06-22 Globalfoundries Inc. Post-polish wafer cleaning
US11355366B2 (en) 2018-08-30 2022-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for shuttered wafer cleaning
US11791173B2 (en) * 2019-03-21 2023-10-17 Samsung Electronics Co., Ltd. Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
TWI765192B (zh) * 2019-11-19 2022-05-21 大量科技股份有限公司 化學機械研磨裝置之研磨墊檢測方法與研磨墊檢測裝置
JP7407574B2 (ja) * 2019-11-29 2024-01-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
CN112122197A (zh) * 2020-09-11 2020-12-25 鹤壁市人民医院 一种医疗用重症监护护理消毒装置
JP7584965B2 (ja) * 2020-09-24 2024-11-18 芝浦メカトロニクス株式会社 洗浄装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

Citations (3)

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TW379147B (en) * 1996-10-30 2000-01-11 Pre Tech Co Ltd A cleaning apparatus and a cleaning method
TW200952110A (en) * 2008-04-04 2009-12-16 Tokyo Electron Ltd Semiconductor manufacturing apparatus and semiconductor manufacturing method
JP2012174933A (ja) * 2011-02-22 2012-09-10 Toppan Printing Co Ltd 基板処理装置及び基板処理方法

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JP3504023B2 (ja) * 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
JPH10308374A (ja) 1997-03-06 1998-11-17 Ebara Corp 洗浄方法及び洗浄装置
US6491764B2 (en) * 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
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WO2001003165A1 (en) * 1999-07-01 2001-01-11 Lam Research Corporation Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing
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WO2003105201A1 (ja) * 2002-06-07 2003-12-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び現像装置
JP2004079767A (ja) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
JP4318913B2 (ja) * 2002-12-26 2009-08-26 東京エレクトロン株式会社 塗布処理装置
JP2004335671A (ja) * 2003-05-07 2004-11-25 Renesas Technology Corp 枚葉式２流体洗浄装置及び半導体装置の洗浄方法
JP2005353739A (ja) * 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2007038209A (ja) * 2005-06-27 2007-02-15 Shimada Phys & Chem Ind Co Ltd 基板洗浄装置および基板洗浄方法
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
KR100758220B1 (ko) * 2005-10-20 2007-09-17 주식회사 케이씨텍 다중 슬릿형 노즐을 가지는 기판 세정 장치 및 이를 이용한세정 방법
KR101041872B1 (ko) * 2008-11-26 2011-06-16 세메스 주식회사 노즐 및 이를 이용한 기판 처리 장치 및 방법
JP5294944B2 (ja) 2009-03-31 2013-09-18 株式会社荏原製作所 基板の洗浄方法
US20110289795A1 (en) * 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
JP5789400B2 (ja) * 2011-04-12 2015-10-07 東京エレクトロン株式会社 液処理方法及び液処理装置
TWI613037B (zh) * 2011-07-19 2018-02-01 荏原製作所股份有限公司 硏磨方法
JP2013089797A (ja) 2011-10-19 2013-05-13 Ebara Corp 基板洗浄方法及び基板洗浄装置
JP5528486B2 (ja) * 2012-02-07 2014-06-25 東京エレクトロン株式会社 基板処理装置、これを備える塗布現像装置、及び基板処理方法
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW379147B (en) * 1996-10-30 2000-01-11 Pre Tech Co Ltd A cleaning apparatus and a cleaning method
TW200952110A (en) * 2008-04-04 2009-12-16 Tokyo Electron Ltd Semiconductor manufacturing apparatus and semiconductor manufacturing method
JP2012174933A (ja) * 2011-02-22 2012-09-10 Toppan Printing Co Ltd 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JP2014130884A (ja) 2014-07-10
KR20140086840A (ko) 2014-07-08
JP6093569B2 (ja) 2017-03-08
US20140182634A1 (en) 2014-07-03
TW201424936A (zh) 2014-07-01
KR102103356B1 (ko) 2020-04-22
US10737301B2 (en) 2020-08-11

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