KR102346493B1 - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

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Publication number
KR102346493B1
KR102346493B1 KR1020207008765A KR20207008765A KR102346493B1 KR 102346493 B1 KR102346493 B1 KR 102346493B1 KR 1020207008765 A KR1020207008765 A KR 1020207008765A KR 20207008765 A KR20207008765 A KR 20207008765A KR 102346493 B1 KR102346493 B1 KR 102346493B1
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South Korea
Prior art keywords
liquid
substrate
nozzle
droplet
rinse
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KR1020207008765A
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English (en)
Korean (ko)
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KR20200041990A (ko
Inventor
다카유키 니시다
준이치 이시이
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20200041990A publication Critical patent/KR20200041990A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020207008765A 2017-10-12 2018-10-04 기판 처리 방법 및 기판 처리 장치 Active KR102346493B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017198618A JP6966917B2 (ja) 2017-10-12 2017-10-12 基板処理方法および基板処理装置
JPJP-P-2017-198618 2017-10-12
PCT/JP2018/037271 WO2019073905A1 (ja) 2017-10-12 2018-10-04 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
KR20200041990A KR20200041990A (ko) 2020-04-22
KR102346493B1 true KR102346493B1 (ko) 2021-12-31

Family

ID=66100772

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KR1020207008765A Active KR102346493B1 (ko) 2017-10-12 2018-10-04 기판 처리 방법 및 기판 처리 장치

Country Status (5)

Country Link
JP (1) JP6966917B2 (enExample)
KR (1) KR102346493B1 (enExample)
CN (1) CN111095494B (enExample)
TW (1) TWI697948B (enExample)
WO (1) WO2019073905A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7285166B2 (ja) * 2019-08-20 2023-06-01 株式会社荏原製作所 基板洗浄方法および基板洗浄装置
CN116153775B (zh) * 2020-03-05 2025-11-18 东京毅力科创株式会社 基片处理方法和基片处理装置
KR102682854B1 (ko) 2020-06-02 2024-07-10 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN114888722B (zh) * 2022-05-17 2024-11-22 华海清科股份有限公司 一种化学机械抛光方法
US12138745B2 (en) * 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203892A (ja) * 2001-11-01 2003-07-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
JP2008130643A (ja) * 2006-11-17 2008-06-05 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW561516B (en) * 2001-11-01 2003-11-11 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
US7766565B2 (en) * 2005-07-01 2010-08-03 Sokudo Co., Ltd. Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
JP2007012998A (ja) * 2005-07-01 2007-01-18 Dainippon Screen Mfg Co Ltd 基板洗浄装置およびそれを備えた基板処理システム
JP5151629B2 (ja) * 2008-04-03 2013-02-27 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体
JP5512424B2 (ja) * 2010-07-06 2014-06-04 東京エレクトロン株式会社 基板洗浄装置および基板洗浄方法
JP6709555B2 (ja) * 2015-03-05 2020-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6508721B2 (ja) 2015-09-28 2019-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203892A (ja) * 2001-11-01 2003-07-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
JP2008130643A (ja) * 2006-11-17 2008-06-05 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TW201923876A (zh) 2019-06-16
CN111095494B (zh) 2024-11-26
JP6966917B2 (ja) 2021-11-17
JP2019075413A (ja) 2019-05-16
WO2019073905A1 (ja) 2019-04-18
TWI697948B (zh) 2020-07-01
KR20200041990A (ko) 2020-04-22
CN111095494A (zh) 2020-05-01

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