JP2019068034A - リジッドフレキシブルプリント回路基板、ディスプレイ装置及びリジッドフレキシブルプリント回路基板の製造方法 - Google Patents
リジッドフレキシブルプリント回路基板、ディスプレイ装置及びリジッドフレキシブルプリント回路基板の製造方法 Download PDFInfo
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- JP2019068034A JP2019068034A JP2018078755A JP2018078755A JP2019068034A JP 2019068034 A JP2019068034 A JP 2019068034A JP 2018078755 A JP2018078755 A JP 2018078755A JP 2018078755 A JP2018078755 A JP 2018078755A JP 2019068034 A JP2019068034 A JP 2019068034A
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- rigid
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- insulating layer
- printed circuit
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000004020 conductor Substances 0.000 claims abstract description 80
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000009751 slip forming Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 25
- 239000011889 copper foil Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
Description
210、220、230、240、250、260 リジッド絶縁層
211、221 ローフロータイプのプリプレグ
212、222 一般プリプレグ
300 第1内層導体パターン層
310 部品実装パッド
400 第2内層導体パターン層
410 ボンディングパッド
500 凹部
700 カバーレイ
1000 リジッドフレキシブルプリント回路基板
2000 電子部品
3000 ディスプレイパネル
4000 フレーム
5000 ディスプレイ装置
P1、P2、P3、P4、P5、P6 外層導体パターン層
SR ソルダーレジスト層
R リジッド領域
F フレキシブル領域
C キャリア
Claims (10)
- フレキシブル領域及びリジッド領域を含むフレキシブル絶縁層と、
前記フレキシブル領域に配置された部品実装パッドを含み、前記フレキシブル絶縁層に埋め込まれて一面が前記フレキシブル絶縁層の一面に露出された第1内層導体パターン層と、
前記フレキシブル絶縁層の一面上に形成され、前記リジッド領域に配置されるリジッド絶縁層と、
を含む、リジッドフレキシブルプリント回路基板。 - 前記フレキシブル領域に配置されたボンディングパッドを含み、前記フレキシブル絶縁層の他面に形成された第2内層導体パターン層をさらに含む請求項1に記載のリジッドフレキシブルプリント回路基板。
- 前記第1内層導体パターン層の一面に形成される凹部をさらに含む請求項1または2に記載のリジッドフレキシブルプリント回路基板。
- リジッド領域とフレキシブル領域とに区画されたリジッドフレキシブルプリント回路基板において、
前記リジッドフレキシブルプリント回路基板は、
前記リジッド領域と前記フレキシブル領域に連続して形成されたフレキシブル絶縁層と、
前記フレキシブル絶縁層に埋め込まれて一面が前記フレキシブル絶縁層の一面に露出され、前記フレキシブル領域に配置された部品実装パッドを含む第1内層導体パターン層と、
前記フレキシブル絶縁層の一面に積層され、前記フレキシブル領域に対応する開口が形成されたリジッド絶縁層と、
を含む、リジッドフレキシブルプリント回路基板。 - リジッド領域及びフレキシブル領域に区画されたリジッドフレキシブルプリント回路基板と、
前記フレキシブル領域に配置され、前記リジッドフレキシブルプリント回路基板に実装される電子部品と、を含み、
前記リジッドフレキシブルプリント回路基板は、
フレキシブル絶縁層と、
前記電子部品が実装される部品実装パッドを含み、前記フレキシブル絶縁層に埋め込まれて一面が前記フレキシブル絶縁層の一面に露出された第1内層導体パターン層と、
前記フレキシブル絶縁層の一面に積層され、前記リジッド領域に配置されたリジッド絶縁層と、
を含むディスプレイ装置。 - 前記リジッドフレキシブルプリント回路基板は、
前記フレキシブル領域に配置されたボンディングパッドを含み、前記フレキシブル絶縁層の他面に形成された第2内層導体パターン層をさらに含む請求項5に記載のディスプレイ装置。 - 前記ボンディングパッドに接続されるディスプレイパネルをさらに含む請求項6に記載のディスプレイ装置。
- 前記電子部品は、DDIチップである請求項7に記載のディスプレイ装置。
- 部品実装パッドを含む第1内層導体パターン層をキャリアの一面に形成する段階と、
前記第1内層導体パターン層をカバーするように、前記キャリアの一面にフレキシブル絶縁層を形成する段階と、
前記第1内層導体パターン層及び前記フレキシブル絶縁層から前記キャリアを除去する段階と、
前記部品実装パッドを露出するリジッド絶縁層を前記フレキシブル絶縁層の一面に形成する段階と、
を含むリジッドフレキシブルプリント回路基板の製造方法。 - 前記キャリアを除去する段階は、
前記キャリアの第1金属層と前記キャリアの第2金属層とを分離する段階と、
前記第1内層導体パターン層及び前記フレキシブル絶縁層に結合された第1金属層を除去する段階と、
を含むリ請求項9に記載のリジッドフレキシブルプリント回路基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170126503A KR102494328B1 (ko) | 2017-09-28 | 2017-09-28 | 리지드 플렉서블 인쇄회로기판, 디스플레이 장치 및 리지드 플렉서블 인쇄회로기판의 제조방법 |
KR10-2017-0126503 | 2017-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019068034A true JP2019068034A (ja) | 2019-04-25 |
Family
ID=66104343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018078755A Pending JP2019068034A (ja) | 2017-09-28 | 2018-04-16 | リジッドフレキシブルプリント回路基板、ディスプレイ装置及びリジッドフレキシブルプリント回路基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2019068034A (ja) |
KR (1) | KR102494328B1 (ja) |
TW (1) | TWI757475B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023173472A1 (zh) * | 2022-03-18 | 2023-09-21 | 武汉华星光电半导体显示技术有限公司 | 电路板及显示模组 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20210073805A (ko) * | 2019-12-11 | 2021-06-21 | 삼성전기주식회사 | 인쇄회로기판, 이를 포함하는 디스플레이 장치, 및 인쇄회로기판의 제조방법 |
Citations (5)
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---|---|---|---|---|
JP2003332743A (ja) * | 2002-05-14 | 2003-11-21 | Olympus Optical Co Ltd | リジットフレキシブル基板 |
JP2006339186A (ja) * | 2005-05-31 | 2006-12-14 | Shinko Electric Ind Co Ltd | 配線基板およびその製造方法 |
JP2010258311A (ja) * | 2009-04-27 | 2010-11-11 | Furukawa Electric Co Ltd:The | プリント配線基板の製造方法 |
US20150024552A1 (en) * | 2013-07-22 | 2015-01-22 | Zhen Ding Technology Co., Ltd. | Substrate, chip package and method for manufacturing substrate |
JP2017126740A (ja) * | 2016-01-13 | 2017-07-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | プリント回路基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050029042A (ko) | 2003-09-19 | 2005-03-24 | 주식회사 복스오라테크놀로지코리아 | 고주파 동축 스위치 |
TWI393512B (zh) * | 2008-08-20 | 2013-04-11 | Unimicron Technology Corp | 硬式線路板 |
KR101241544B1 (ko) * | 2011-06-10 | 2013-03-11 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
KR102411996B1 (ko) * | 2015-05-29 | 2022-06-22 | 삼성전기주식회사 | 패키지 기판 및 그 제조 방법 |
TWI577251B (zh) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | 軟硬複合線路板及其製作方法 |
-
2017
- 2017-09-28 KR KR1020170126503A patent/KR102494328B1/ko active IP Right Grant
-
2018
- 2018-04-16 JP JP2018078755A patent/JP2019068034A/ja active Pending
- 2018-04-23 TW TW107113749A patent/TWI757475B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003332743A (ja) * | 2002-05-14 | 2003-11-21 | Olympus Optical Co Ltd | リジットフレキシブル基板 |
JP2006339186A (ja) * | 2005-05-31 | 2006-12-14 | Shinko Electric Ind Co Ltd | 配線基板およびその製造方法 |
JP2010258311A (ja) * | 2009-04-27 | 2010-11-11 | Furukawa Electric Co Ltd:The | プリント配線基板の製造方法 |
US20150024552A1 (en) * | 2013-07-22 | 2015-01-22 | Zhen Ding Technology Co., Ltd. | Substrate, chip package and method for manufacturing substrate |
JP2017126740A (ja) * | 2016-01-13 | 2017-07-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | プリント回路基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023173472A1 (zh) * | 2022-03-18 | 2023-09-21 | 武汉华星光电半导体显示技术有限公司 | 电路板及显示模组 |
Also Published As
Publication number | Publication date |
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TW201916758A (zh) | 2019-04-16 |
KR102494328B1 (ko) | 2023-02-02 |
TWI757475B (zh) | 2022-03-11 |
KR20190036965A (ko) | 2019-04-05 |
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