WO2023173472A1 - 电路板及显示模组 - Google Patents

电路板及显示模组 Download PDF

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Publication number
WO2023173472A1
WO2023173472A1 PCT/CN2022/083321 CN2022083321W WO2023173472A1 WO 2023173472 A1 WO2023173472 A1 WO 2023173472A1 CN 2022083321 W CN2022083321 W CN 2022083321W WO 2023173472 A1 WO2023173472 A1 WO 2023173472A1
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WO
WIPO (PCT)
Prior art keywords
board
board body
flexible circuit
layer
circuit layer
Prior art date
Application number
PCT/CN2022/083321
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English (en)
French (fr)
Inventor
郭蓉
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Publication of WO2023173472A1 publication Critical patent/WO2023173472A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions

Definitions

  • the present invention relates to the field of display technology, and in particular, to a circuit board and a display module.
  • the medium-sized display panel side and the printed circuit board side need to be interconnected with a flexible circuit board, and the flexible circuit board side and the printed circuit board side are commonly connected by electrical connectors or gold finger binding, but the electrical connectors There is a height limit, and Goldfinger has very high requirements for the pad spacing and bonding process on the side of the printed circuit board, making it difficult to achieve thinner products and stable product quality.
  • Embodiments of the present application provide a circuit board that integrates a flexible circuit board into the preparation process of a printed circuit board. Part of the circuit layers of the flexible circuit board are embedded in the interlayer structure of the printed circuit board and pressed together to achieve the integration of the printed circuit board and the flexible circuit board. Combined to avoid the need for binding process or electrical connector access in the later stage, the product can be made lighter and thinner and the stability of the circuit connection can be enhanced.
  • the present invention provides a circuit board, which includes: a first board body and a second board body combined with the first board body.
  • the first board body is a hard board body.
  • the second board body is a flexible board body, and a flexible circuit layer is fixedly provided in the first board body.
  • the flexible circuit layer includes a flexible substrate and a metal wiring layer provided on at least one side of the flexible substrate; wherein, The flexible circuit layer is electrically connected to the metal wiring layer of the first board body and extends outside the first board body.
  • the portion of the flexible circuit layer located outside the first board body is Any functional layer of the second plate body.
  • the first board body includes a multi-layer interlayer substrate and the metal wiring layer located on the interlayer substrate.
  • the interlayer substrate includes a hard board and at least one layer of The flexible circuit layer.
  • the edge of the flexible circuit layer located in the first board body is flush with the edge of the first board body, or is set inwardly in the first board body and aligned with the first board body.
  • the edge of a plate body maintains a preset distance.
  • the flexible circuit layer in the thickness direction of the first board body, is located relatively at the middle position of the first board body.
  • a via hole is formed on the interlayer substrate, and the metal wiring layers located on different layers are connected through the via hole.
  • the material of the hard board is one or a combination of two or more materials selected from phenolic resin, glass fiber, and epoxy resin; the flexible circuit layer is The substrate material is polyimide, polyester film, polytetrafluoroethylene or polyamide fiber.
  • the second board body includes at least one layer of the flexible circuit layer, one end of the flexible circuit layer is provided with a pressing portion, and the pressing portion of the flexible circuit layer is fixedly provided on the Inside the first plate.
  • the opposite end of the pressing part of the flexible circuit layer is set as a binding part, and the binding part of the flexible circuit layer is set in the air before binding the external device.
  • the second board body includes two or more sub-boards spaced apart along the same direction, and the pressing portions of each sub-board are connected to form a board, and the binding portions of each sub-board are connected to each other. Independent setting.
  • the present invention also provides a display module.
  • the display module includes a display panel and a circuit board.
  • the circuit board includes a first board body and a second board body combined with the first board body.
  • the third board body is One board body is a hard board body, the second board body is a flexible board body, and a flexible circuit layer is fixedly installed in the first board body.
  • the flexible circuit layer includes a flexible substrate, and is provided on the flexible substrate at least Metal trace layer on one side;
  • the flexible circuit layer is electrically connected to the metal wiring layer of the first board body and extends outside the first board body.
  • the flexible circuit layer is located outside the first board body.
  • the portion is any functional layer of the second board body, the frame area of the display panel is provided with binding terminals, and the binding portion of the flexible circuit layer is fixed and electrically connected to the binding terminals of the display panel.
  • the first board body includes a multi-layer interlayer substrate and the metal wiring layer located on the interlayer substrate.
  • the interlayer substrate includes a hard board and at least one layer of The flexible circuit layer.
  • the edge of the flexible circuit layer located in the first board body is flush with the edge of the first board body, or is set inwardly in the first board body and aligned with the first board body.
  • the edge of a plate body maintains a preset distance.
  • the flexible circuit layer in the thickness direction of the first board body, is located relatively at the middle position of the first board body.
  • a via hole is formed on the interlayer substrate, and the metal wiring layers located on different layers are connected through the via hole.
  • the via hole is filled with a metal conductive material
  • the metal conductive material includes any one of copper, aluminum, nickel, and tin.
  • the material of the hard board is one or a combination of two or more materials selected from phenolic resin, glass fiber, and epoxy resin; the flexible circuit layer is The substrate material is polyimide, polyester film, polytetrafluoroethylene or polyamide fiber.
  • the second board body includes at least one layer of the flexible circuit layer, one end of the flexible circuit layer is set as a pressing portion, and the pressing portion of the flexible circuit layer is fixedly provided on the Inside the first plate.
  • the opposite end of the pressing part of the flexible circuit layer is set as a binding part, and the binding part of the flexible circuit layer is set in the air before binding the external device.
  • the second board body includes two or more sub-boards spaced apart along the same direction, and the pressing portions of each sub-board are connected to form a board, and the binding portions of each sub-board are connected to each other. Independent setting.
  • the material of the metal wiring layer may be tin, copper, chromium, palladium, nickel, gold, aluminum or one of the alloys of the above metal materials.
  • the circuit board provided by the present invention integrates the flexible circuit board into the preparation process of the printed circuit board, and some circuit layers of the flexible circuit board are embedded in the interlayer structure of the printed circuit board and pressed together , realizing the combination of printed circuit boards and flexible circuit boards, avoiding the post-binding process or the access of electrical connectors, making the product lighter and thinner and enhancing the connection stability.
  • Figure 1 is a schematic structural diagram of a circuit board provided by the present invention.
  • FIG. 2 is a schematic cross-sectional view along the A-A direction of the first circuit board provided by the embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional view along the A-A direction of the second circuit board provided by the embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view along the A-A direction of the third circuit board provided by the embodiment of the present application.
  • Figure 5 is a schematic structural diagram of a display module provided by an embodiment of the present application.
  • Figure 1 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • the circuit board provided by an embodiment of the present application at least includes a first board body 10.
  • the first board body 10 is a rigid printed circuit.
  • a printed circuit board (PCB), and a second board body 20 connected to the first board body 10 , and the second board body 20 is a flexible printed circuit board (FPC).
  • PCB printed circuit board
  • FPC flexible printed circuit board
  • Figure 2 is a schematic cross-sectional view along the A-A direction of the first circuit board provided by the embodiment of the present application.
  • the first board body 10 includes a multi-layer metal wiring layer 11 and a layer carrying the metal wiring layer 11.
  • the multi-layer interlayer substrate 12 of the first board body 10 includes a hard board 120; the second board body 20 includes at least one metal wiring layer 11 and a metal wiring layer carrying the metal wiring layer 11.
  • the flexible substrate 21 of 11; a flexible circuit layer 30 is also provided on the first board body 10 and/or the second board body 20, that is, the flexible circuit layer 30 is between the first board body 10 and the second board body 20.
  • the flexible circuit layer 30 can be integrally provided with the first board body 10 and extended out of the first board body 10, and then connected with the first board body 10.
  • the second board body 20 forms a connection.
  • the flexible circuit layer 30 can also be integrally provided with the second board body 20 and extended out of the second board body 20, and then connected with the first board body 20.
  • the board body 10 constitutes a connection, which is not limited here; instead of realizing the combination of the flexible circuit board and the hard circuit board through external binding of the circuit board or through electrical connectors, the flexible circuit layer 30 is prefabricated on the hard circuit board.
  • the combination with the flexible circuit board in the board has a more stable electrical function and can also reduce the increase in the volume of the circuit board caused by the arrangement of electrical connectors.
  • the flexible circuit layer 30 includes a flexible substrate 21 and a metal wiring layer 11 provided on at least one side of the flexible substrate; wherein part of the flexible circuit layer 30 is fixedly provided on the first board body 10 inside, and is electrically connected to the different-layer metal wiring layer 11 in the first board body 10; the second board body 20 includes multiple functional layers, and the functional layer refers to a single layer or a superposition of two or more layers. Circuit layer, the flexible substrate 21 is disposed between different circuit layers, and the part of the flexible circuit layer 30 located outside the first board body 10 is any functional layer of the second board body 20 .
  • the flexible substrate 21 of the flexible circuit layer 30 is made of one or a combination of one or more flexible materials including polyimide, polyester film, polytetrafluoroethylene or polyamide fiber.
  • the hard board 120 in the first board body 10 is made of one or a combination of two or more materials selected from the group consisting of phenolic resin, glass fiber, and epoxy resin.
  • the first board body 10 includes a multi-layer interlayer substrate 12 and the metal wiring layer 11 located on the interlayer substrate 12 .
  • the interlayer substrate 12 includes a hard board 120 and at least One layer of the flexible circuit layer 30 .
  • the metal wiring layer 11 includes a first metal wiring layer 111 and a second metal wiring layer 112 .
  • the first metal wiring layer 111 is provided on the hard board 120 away from the On one side of the flexible substrate 21
  • the second metal wiring layer 112 is provided on the flexible substrate 21 and is located between the flexible substrate 21 and the hard board 120 .
  • the material of the metal wiring layer 11 may be tin (Sn), copper (Cu), chromium (Cr), palladium (Pd), nickel (Ni), gold (Au), aluminum ( Al) or one of the alloys of the above metal materials.
  • the edge of the flexible circuit layer 30 located in the first board body 10 is flush with the edge of the first board body 10 , or is set inwardly in the first board body 10 and aligned with the edge of the first board body 10 .
  • the edge of the first plate body 10 maintains a preset distance.
  • the edge of the flexible circuit layer 30 located in the first board body 10 is flush with the edge of the first board body 10 .
  • the edge of the flexible substrate 21 in the flexible circuit layer 30 may be flush with the edge of the hard board 120 in the first board body 10 , or the flexible substrate 21 in the flexible circuit layer 30 and the second metal wiring layer may be flush with each other.
  • the edges of 112 can all be kept flush with the edges of the hard board 120 .
  • the flexible circuit layer 30 located in the first board body 10 can be connected to the upper, lower and left edges of the first board body 10 . At least one edge of the flexible circuit layer 30 located in the first board body 10 may be flush with the upper, lower and left edges of the first board body 10 .
  • Figure 3 is a schematic cross-sectional view along the A-A direction of the second circuit board provided by the embodiment of the present application.
  • the second circuit board shown in Figure 3 The structure is roughly the same as that of the first circuit board shown in Figure 2 . The difference is that in the second circuit board shown in Figure 3 , the edge of the flexible circuit layer 30 located in the first board body 10 The recess is arranged in the first plate body 10 and maintains a preset distance from the edge of the first plate body 10. The preset distance can be set according to actual needs and is not limited here.
  • the edge of the flexible circuit layer 30 located in the first board body 10 can be aligned with the upper, lower and left edges of the first board body 10 . At least one of them maintains the preset distance shown in Figure 3 , and the edge of the flexible circuit layer 30 located in the first board body 10 can also maintain the upper, lower and left edges of the first board body 10 as shown in Figure 3 preset distance shown.
  • the flexible circuit layer 30 is relatively located in the middle position of the first board body 10 .
  • the first board body 10 has seven layers of interlayer substrates 12 and a total of eight layers of metal wiring layers 11 respectively provided on each of the interlayer substrates 12 .
  • the fourth interlayer substrate is the flexible circuit layer 30, and the other interlayer substrates are all hard boards 120.
  • the side of the hard board 120 away from the flexible circuit layer 30 is provided with The first metal wiring layer 111.
  • the flexible circuit layer 30 is disposed between the third interlayer substrate and the fourth interlayer substrate.
  • the flexible circuit layer 30 includes the flexible substrate 21 and second metal wiring layers 112 located on the upper and lower sides of the flexible substrate 21 .
  • the flexible second board body 20 includes at least one layer of the flexible circuit layer 30 , one end of the flexible circuit layer 30 is set as a pressing portion 302 , and the pressing portion 302 of the flexible circuit layer 30 disposed inside the first plate body 10 .
  • the flexible circuit layer 30 has a main body part 301 and a pressing part 302 located at one end of the main body part 301.
  • the pressing part 302 of the flexible circuit layer 30 disposed inside the first plate body 10 .
  • a via hole is formed on the interlayer substrate 12, and the metal wiring layers 11 located in different layers are connected through the via hole.
  • the via hole includes a first via hole V1 and a second via hole V2.
  • a plurality of first via holes V1 penetrating at least one layer of the hard board 120 may be formed by laser drilling.
  • the first via holes V1 may be filled with metal conductive material.
  • the first connection portion 121 is formed so that the first metal wiring layer 111 located on the same side of the flexible circuit layer 30 and on different hard boards 120 is electrically connected through the first via V1 that penetrates the hard board 120 . sexual connection.
  • the upper and lower sides of the pressed portion of the flexible circuit layer 30 and the hard board 120 in the first board body 10 can be pressed together by hot pressing, and then combined with the flexible circuit board.
  • a second via hole V2 penetrating the at least one layer of hard board 120 is formed by mechanical drilling on at least one layer of hard board 120 adjacent to the circuit layer 30, and then a connection is formed in the second via hole V2 by electroplating or other means. 121 , thereby connecting the first metal wiring layer 111 on the hard board 120 in the first board body 10 with the second metal wiring layer 112 in the flexible circuit layer 30 .
  • the flexible circuit layer 30 can be integrated into the preparation process of the first board body 10 , thereby eliminating the need for connectors or binding terminals required for electrical connection between the first board body 10 and the second board body 20 .
  • first connecting part 121 and the second connecting part 122 may include copper, aluminum, nickel, tin or other metal materials with ductile properties.
  • first connecting part 121 and the second connecting part 122 may be made of solid copper pillars as shown in FIG. 2 or FIG. 3 .
  • Figure 4 is a schematic cross-sectional view along the A-A direction of the third circuit board provided by the embodiment of the present application.
  • the structure of the third circuit board shown in Figure 4 is different from that shown in Figure 2
  • the structure of the first type of circuit board is roughly the same.
  • the third type of circuit board shown in Figure 4 includes two layers of flexible circuit layers 30.
  • the two layers of flexible circuit layers 30 are stacked in sequence.
  • the two layers of flexible circuit layers 30 both include The flexible substrate 21 and the second metal wiring layer 112 located on both sides of the flexible substrate 21.
  • the second metal wiring layer 112 between the two adjacent layers of the flexible circuit layer 30 can be formed by penetrating at least one layer of the flexible circuit layer 30.
  • the second via hole V2 of the flexible substrate 21 is electrically connected, and the second metal wiring layer 112 in the flexible circuit layer 30 can also be electrically connected to the first metal wiring layer 111 on the hard board 120 through other via holes.
  • the number of flexible circuit layers 30 in the circuit board is not limited to one or two layers in the above embodiment.
  • the circuit board may also have three or more flexible circuit layers. No restrictions anywhere.
  • the opposite end of the flexible circuit layer where the pressing part is arranged is set as a binding part, and the binding part of the flexible circuit layer is set in the air before binding the external device.
  • a binding portion 303 is provided at an end of the main body portion 301 of the flexible circuit layer 30 away from the pressing portion 302.
  • the binding portion 303 can be A plurality of first binding terminals 22 are provided for binding.
  • the first binding terminals 22 and the second metal wiring layer 112 in the flexible circuit layer 30 may be made of the same layer of metal.
  • the binding part 303 is set in the air before binding the external device.
  • the second board body includes two or more sub-boards spaced apart along the same direction, and the pressing portions of each sub-board are connected to form a board, and the binding portions of each sub-board are arranged independently of each other.
  • the second board body 20 may include six sub-boards 201 spaced apart along the same direction.
  • the structure of each sub-board 201 may be the same as that of the second sub-board in the circuit board provided by the embodiment of the present application.
  • the structure of the plate body 20 is the same.
  • FIG. 1 only illustrates the distribution manner of the sub-boards 201.
  • the number and size of the sub-boards 201 in FIG. 1 do not represent the actual number and size of the sub-boards in the circuit board.
  • a display module adapted to the circuit board is also provided.
  • the frame area of the display panel is provided with binding terminals, and the binding portion of the flexible circuit layer is The binding terminals of the display panel are fixed and electrically connected.
  • FIG. 5 is a schematic structural diagram of a display module provided by an embodiment of the present application.
  • the display module 100 includes a display panel 40 , and the display panel 40 includes a display area AA and a device located in the display area AA.
  • a second binding terminal 41 is provided in the frame area NA located on the side of the display area AA.
  • the first binding terminal 22 located in the binding part 303 of the flexible circuit layer 30 and The second binding terminal 41 of the display panel 40 is fixed and electrically connected.
  • the circuit board provided by the present invention integrates the flexible circuit board into the preparation process of the printed circuit board, and some circuit layers of the flexible circuit board are embedded in the interlayer structure of the printed circuit board and pressed together , realizing the combination of printed circuit boards and flexible circuit boards, avoiding the post-binding process or the access of electrical connectors, making the product lighter and thinner and enhancing the connection stability.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种电路板及显示模组（100），显示模组（100）包括显示面板（40）以及电路板，电路板包括硬质的第一板体（10）和软质的第二板体（20），通过将柔性电路层（30）融入第一板体（10）的制备过程，实现第一板体（10）与第二板体（20）的结合，避免了后期绑定工艺或电连接件接入，做到产品的轻薄化及连接稳定性地增强。

Description

电路板及显示模组 技术领域
本发明涉及显示技术领域，尤其涉及一种电路板及显示模组。
 背景技术
随着OLED技术的普及，消费者对于OLED屏的工作频率、分辨率、轻薄度要求越来越高。对于常规设计，中尺寸显示面板侧和印刷电路板侧需要用柔性电路板实现互联，而柔性电路板侧与印刷电路板侧常用电连接件或者金手指绑定的方式进行连接，但是电连接件有高度限制，而金手指对于印刷电路板侧焊盘间距和绑定工艺要求都很高，较难实现产品轻薄化和产品品质稳定性。
 技术问题
现有技术印刷电路板与柔性电路板在制备时为分别独立制备，在后期组装时需要通过电连接件或使用金手指绑定工艺来实现两个电路板的连接，绑定工艺要求较高、绑定过程较为复杂从而影响产品良率，或使用电连接件导致使用电路板的产品空间受到影响，需要提供一种新的电路板连接方式。
 技术解决方案
本申请实施例提供一种电路板，将柔性电路板融入印刷电路板的制备过程，柔性电路板部分线路层嵌入印刷电路板的层间结构中并压合，实现印刷电路板和柔性电路板的结合，以避免后期需要绑定工艺或电连接件接入，做到产品的轻薄化及增强电路连接稳定性。
为解决上述技术问题，本发明提供一种电路板，包括：包括第一板体、与所述第一板体相结合的第二板体，所述第一板体为硬质板体，所述第二板体为柔性板体，所述第一板体内固定设置有柔性电路层，所述柔性电路层包括柔性基板、以及设置于所述柔性基板至少一侧的金属走线层；其中，所述柔性电路层与所述第一板体的金属走线层电性连接，并延伸至所述第一板体之外，所述柔性电路层位于所述第一板体之外的部分为所述第二板体的任意功能层。
根据本申请一实施例，所述第一板体包括多层层间基板、以及位于所述层间基板上的所述金属走线层，所述层间基板包括硬质板、以及至少一层所述柔性电路层。
根据本申请一实施例，位于所述第一板体内的所述柔性电路层的边缘与所述第一板体边缘平齐设置，或内缩设置于所述第一板体内并与所述第一板体边缘保持预设距离。
根据本申请一实施例，在所述第一板体的厚度方向上，所述柔性电路层相对位于所述第一板体的中间位置。
根据本申请一实施例，所述层间基板上形成有过孔，位于异层的所述金属走线层之间通过所述过孔连通。
根据本申请一实施例，在所述层间基板中，所述硬质板的材料为酚醛树脂、玻璃纤维、环氧树脂中的一种或两种以上的组合材料；所述柔性电路层的衬底材料为聚酰亚胺、聚酯膜、聚四氟乙烯或聚酰胺纤维。
根据本申请一实施例，所述第二板体包括至少一层所述柔性电路层，所述柔性电路层的一端设置-为压合部，所述柔性电路层的压合部固定设置于所述第一板体内。
根据本申请一实施例，所述柔性电路层的设置所述压合部的相对另一端设置为绑定部，所述柔性电路层的绑定部在绑定外接设备之前为悬空设置。
根据本申请一实施例，所述第二板体包括两个以上沿同一方向间隔设置的子板，且各所述子板的压合部连接成板，各所述子板的绑定部相互独立设置。
本发明还提供一种显示模组，所述显示模组包括显示面板以及电路板，所述电路板包括第一板体、与所述第一板体相结合的第二板体，所述第一板体为硬质板体，所述第二板体为柔性板体，所述第一板体内固定设置有柔性电路层，所述柔性电路层包括柔性基板、以及设置于所述柔性基板至少一侧的金属走线层；
其中，所述柔性电路层与所述第一板体的金属走线层电性连接，并延伸至所述第一板体之外，所述柔性电路层位于所述第一板体之外的部分为所述第二板体的任意功能层，所述显示面板的边框区域设置有绑定端子，所述柔性电路层的绑定部与所述显示面板的绑定端子固定并电性连接。
根据本申请一实施例，所述第一板体包括多层层间基板、以及位于所述层间基板上的所述金属走线层，所述层间基板包括硬质板、以及至少一层所述柔性电路层。
根据本申请一实施例，位于所述第一板体内的所述柔性电路层的边缘与所述第一板体边缘平齐设置，或内缩设置于所述第一板体内并与所述第一板体边缘保持预设距离。
根据本申请一实施例，在所述第一板体的厚度方向上，所述柔性电路层相对位于所述第一板体的中间位置。
根据本申请一实施例，所述层间基板上形成有过孔，位于异层的所述金属走线层之间通过所述过孔连通。
根据本申请一实施例，所述过孔内填充有金属导电材料，所述金属导电材料包括铜、铝、镍、锡中的任意一种。
根据本申请一实施例，在所述层间基板中，所述硬质板的材料为酚醛树脂、玻璃纤维、环氧树脂中的一种或两种以上的组合材料；所述柔性电路层的衬底材料为聚酰亚胺、聚酯膜、聚四氟乙烯或聚酰胺纤维。
根据本申请一实施例，所述第二板体包括至少一层所述柔性电路层，所述柔性电路层的一端设置为压合部，所述柔性电路层的压合部固定设置于所述第一板体内。
根据本申请一实施例，所述柔性电路层的设置所述压合部的相对另一端设置为绑定部，所述柔性电路层的绑定部在绑定外接设备之前为悬空设置。
根据本申请一实施例，所述第二板体包括两个以上沿同一方向间隔设置的子板，且各所述子板的压合部连接成板，各所述子板的绑定部相互独立设置。
根据本申请一实施例，所述金属走线层的材料可以为锡、铜、铬、钯、镍、金、铝或者上述金属材料的合金之一。
 有益效果
本揭示实施例的有益效果：相比现有技术，本发明提供的电路板将柔性电路板融入印刷电路板的制备过程，柔性电路板部分线路层嵌入印刷电路板的层间结构中并压合，实现印刷电路板和柔性电路板的结合，避免了后期绑定工艺或电连接件接入，做到产品的轻薄化及连接稳定性地增强。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明提供的电路板的结构示意图。
图2为本申请实施例提供的第一种电路板沿A-A方向的截面示意图。
图3为本申请实施例提供的第二种电路板沿A-A方向的截面示意图。
图4为本申请实施例提供的第三种电路板沿A-A方向的截面示意图。
图5为本申请实施例提供的显示模组的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本揭示可用以实施的特定实施例。本揭示所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本揭示，而非用以限制本揭示。在图中，结构相似的单元是用以相同标号表示。
下面结合附图和具体实施例对本揭示做进一步的说明：
请参照图1，图1为本申请实施例提供的电路板的结构示意图，本申请实施例提供的电路板，至少包括第一板体10，所述第一板体10为硬质的印刷电路板（printed circuit board，PCB），以及连接所述第一板体10的第二板体20，所述第二板体20为可挠的柔性电路板（flexible printed circuit, FPC）。
请参照图2，图2为本申请实施例提供的第一种电路板沿A-A方向的截面示意图，所述第一板体10包括多层金属走线层11和承载所述金属走线层11的多层层间基板12，所述第一板体10的层间基板12包括硬质板120；所述第二板体20包括至少一层金属走线层11和承载所述金属走线层11的柔性基板21；所述第一板体10和/或所述第二板体20上还设置有柔性电路层30，也即所述柔性电路层30在所述第一板体10和所述第二板体20上均有电性连接和位置对应关系，且所述柔性电路层30可以是与所述第一板体10一体设置并延伸出所述第一板体10后，再与所述第二板体20构成连接，同样的，所述柔性电路层30还可以是与所述第二板体20一体设置并延伸出所述第二板体20后，再与所述第一板体10构成连接，此处不做限定；相较于通过电路板外部绑定方式或通过电连接件实现柔性电路板和硬质电路板的结合，通过将柔性电路层30预制在硬质电路板中来实现与柔性电路板的结合则具有更加稳定的电性功能，也能够减少电连接件的设置带来的电路板体积增加。
进一步的，所述柔性电路层30包括柔性基板21、以及设置于所述柔性基板至少一侧的金属走线层11；其中，部分所述柔性电路层30固定设置于所述第一板体10内，并与所述第一板体10内的异层金属走线层11电性连接；所述第二板体20包括多层功能层，所述功能层指单层或两层以上的叠加电路层，异层电路层之间设置有所述柔性基板21，所述柔性电路层30位于所述第一板体10之外的部分为所述第二板体20的任意功能层。
所述柔性电路层30的柔性基板21的材料采用聚酰亚胺、聚酯膜、聚四氟乙烯或聚酰胺纤维的其中一种或多种柔性材料的组合材料。
所述第一板体10中的所述硬质板120的材料采用酚醛树脂、玻璃纤维、环氧树脂中的一种或两种以上的组合材料。
具体的，所述第一板体10包括多层层间基板12、以及位于所述层间基板12上的所述金属走线层11，所述层间基板12包括硬质板120、以及至少一层所述柔性电路层30。
如图2所示，所述金属走线层11包括第一金属走线层111以及第二金属走线层112，所述第一金属走线层111设置于所述硬质板120背离所述柔性基板21的一侧，所述第二金属走线层112设置于所述柔性基板21上，并位于所述柔性基板21与所述硬质板120之间。
在本申请实施例中，所述金属走线层11的材料可以为锡(Sn)、铜(Cu)、铬 (Cr)、钯(Pd)、镍(Ni)、金(Au)、铝(Al)或者上述金属材料的合金之一。
进一步的，位于所述第一板体10内的所述柔性电路层30的边缘与所述第一板体10边缘平齐设置，或内缩设置于所述第一板体10内并与所述第一板体10边缘保持预设距离。
在其中一个实施例中，如图2所示，位于所述第一板体10内的所述柔性电路层30的边缘与所述第一板体10的边缘平齐设置。具体的，柔性电路层30中的柔性基板21的边缘可以与第一板体10中的硬质板120的边缘保持齐平，或者柔性电路层30中的柔性基板21以及第二金属走线层112的边缘均可以与硬质板120的边缘保持齐平。
结合图1和图2所示，在图1所示的平面图视角下，位于第一板体10内的所述柔性电路层30可以与第一板体10的上、下以及左侧边缘中的至少一个平齐设置，位于第一板体10内的所述柔性电路层30的边缘也可以与第一板体10的上、下以及左侧边缘均保持平齐设置。
在其中一个实施例中，如图3所示，图3为本申请实施例提供的第二种电路板沿A-A方向的截面示意图，需要说明的是，图3所示的第二种电路板的结构与图2所示的第一种电路板的结构大致相同，区别在于，图3所示的第二种电路板中，位于所述第一板体10内的所述柔性电路层30的边缘内缩设置于所述第一板体10内并与所述第一板体10的边缘保持预设距离，所述预设距离可以根据实际需求设定，此处不做限制。
结合图1和图3所示，在图1所示的平面图视角下，位于第一板体10内的所述柔性电路层30的边缘可以与第一板体10的上、下以及左侧边缘中的至少一个保持图3所示的预设距离，位于第一板体10内的所述柔性电路层30的边缘也可以与第一板体10的上、下以及左侧边缘均保持图3所示的预设距离。
进一步的，在所述第一板体10的厚度方向上，所述柔性电路层30相对位于所述第一板体10的中间位置。
如图2所示，第一板体10具有7层层间基板12以及分别设置于各个层间基板12上的总计8层金属走线层11。按照从上至下的顺序，第四层层间基板为所述柔性电路层30，其他层间基板均为硬质板120，硬质板120背离所述柔性电路层30的一侧均设置有第一金属走线层111。所述柔性电路层30设置于第三层层间基板与第四层层间基板之间。所述柔性电路层30具有所述柔性基板21以及位于所述柔性基板21上下两侧的第二金属走线层112。
进一步的，所述柔性第二板体20包括至少一层所述柔性电路层30，所述柔性电路层30的一端设置为压合部302，所述柔性电路层30的所述压合部302设置于所述第一板体10内。
如图2所示，在本申请实施例中，所述柔性电路层30具有主体部301、位于所述主体部301一端的压合部302，所述柔性电路层30的所述压合部302设置于所述第一板体10内。
进一步的，所述层间基板12上形成有过孔，位于异层的所述金属走线层11之间通过所述过孔连通。
如图2所示，所述过孔包括第一过孔V1和第二过孔V2。
在制备所述电路板的过程中，可以通过激光钻孔的方式形成多个贯穿至少一层所述硬质板120的第一过孔V1，第一过孔V1内可以填充有金属导电材料以形成第一连接部121，以此将位于柔性电路层30同一侧且位于不同硬质板120上的第一金属走线层111之间通过贯穿所述硬质板120的第一过孔V1电性连接。
在制备所述电路板的过程中，可以将柔性电路层30的压合部的上下两侧与第一板体10中的硬质板120通过热压的方式压合在一起，并在与柔性电路层30临近的至少一层硬质板120上通过机械钻孔的方式形成贯穿至少一层硬质板120的第二过孔V2，然后在第二过孔V2内通过电镀或者其他方式形成连接部121，以此将第一板体10中硬质板120上的第一金属走线层111与柔性电路层30中的第二金属走线层112导通。如此，可以将柔性电路层30融入第一板体10的制备过程，从而可以省去第一板体10与第二板体20电性连接所需的连接器或绑定端子。
进一步的，第一连接部121和第二连接部122的材料可以包括铜、铝、镍、锡或其他具有延展特性的金属材质。在本申请实施例中，所述第一连接部121和所述第二连接部122的材质可以为图2或图3所示的实心铜柱。
如图4所示，图4为本申请实施例提供的第三种电路板沿A-A方向的截面示意图，需要说明的是，图4所示的第三种电路板的结构与图2所示的第一种电路板的结构大致相同，区别在于，图4所示的第三种电路板包括两层柔性电路层30，两层柔性电路层30依次层叠设置，该两层柔性电路层30均包括柔性基板21以及位于所述柔性基板21两侧的第二金属走线层112，相邻的两层所述柔性电路层30之间的第二金属走线层112可以通过贯穿至少一层所述柔性基板21的第二过孔V2电性连接，柔性电路层30中的第二金属走线层112也可以通过其他过孔与硬质板120上的第一金属走线层111电性连接。
在实际应用中，所述电路板中的柔性电路层30的数量不仅限于上述实施例中的一层或两层，所述电路板中也可以具有三层或三层以上的柔性电路层，此处不做限制。
进一步的，所述柔性电路层的设置所述压合部的相对另一端设置为绑定部，所述柔性电路层的绑定部在绑定外接设备之前为悬空设置。
如图2所示，在图2所示的实施例中，所述柔性电路层30的主体部301背离所述压合部302的一端设置有绑定部303，所述绑定部303上可以设置有多个用于绑定的第一绑定端子22，所述第一绑定端子22可以与柔性电路层30中的第二金属走线层112采用同层金属制备形成。所述绑定部303在绑定外接设备之前为悬空设置。
进一步的，所述第二板体包括两个以上沿同一方向间隔设置的子板，且各所述子板的压合部连接成板，各所述子板的绑定部相互独立设置。
如图1所示，所述第二板体20可以包括6个沿同一方向间隔设置的子板201，每个所述子板201的结构可以与本申请实施例提供的电路板中的第二板体20的结构相同。
需要说明的是，图1仅对子板201的分布方式进行了示意，图1中的子板201的数量以及尺寸不代表实际情况下电路板中的子板的数量和尺寸。
根据本发明实施例提供的电路板，还提供一种与所述电路板相适配的显示模组，所述显示面板的边框区域设置有绑定端子，所述柔性电路层的绑定部与所述显示面板的绑定端子固定并电性连接。
如图5所示，图5为本申请实施例提供的显示模组的结构示意图，所述显示模组100包括显示面板40，所述显示面板40包括显示区域AA以及设置于所述显示区域AA外围的边框区域NA，位于所述显示区域AA一侧的所述边框区域NA内设置有第二绑定端子41，位于所述柔性电路层30的绑定部303的第一绑定端子22与所述显示面板40的第二绑定端子41固定并电性连接。
本申请实施例的有益效果：相比现有技术，本发明提供的电路板将柔性电路板融入印刷电路板的制备过程，柔性电路板部分线路层嵌入印刷电路板的层间结构中并压合，实现印刷电路板和柔性电路板的结合，避免了后期绑定工艺或电连接件接入，做到产品的轻薄化及连接稳定性地增强。
综上所述，虽然本申请以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为基准。

Claims (20)

  1. 一种电路板，包括第一板体、与所述第一板体相结合的第二板体，所述第一板体为硬质板体，所述第二板体为柔性板体，所述第一板体内固定设置有柔性电路层，所述柔性电路层包括柔性基板、以及设置于所述柔性基板至少一侧的金属走线层；
    其中，所述柔性电路层与所述第一板体的金属走线层电性连接，并延伸至所述第一板体之外，所述柔性电路层位于所述第一板体之外的部分为所述第二板体的任意功能层。
  2. 根据权利要求1所述的电路板，其中，所述第一板体包括多层层间基板、以及位于所述层间基板上的所述金属走线层，所述层间基板包括硬质板、以及至少一层所述柔性电路层。
  3. 根据权利要求2所述的电路板，其中，位于所述第一板体内的所述柔性电路层的边缘与所述第一板体边缘平齐设置，或内缩设置于所述第一板体内并与所述第一板体边缘保持预设距离。
  4. 根据权利要求3所述的电路板，其中，在所述第一板体的厚度方向上，所述柔性电路层相对位于所述第一板体的中间位置。
  5. 根据权利要求2所述的电路板，其中，所述层间基板上形成有过孔，位于异层的所述金属走线层之间通过所述过孔连通。
  6. 根据权利要求1所述的电路板，其中，在所述层间基板中，所述硬质板的材料为酚醛树脂、玻璃纤维、环氧树脂中的一种或两种以上的组合材料；所述柔性电路层的衬底材料为聚酰亚胺、聚酯膜、聚四氟乙烯或聚酰胺纤维。
  7. 根据权利要求2所述的电路板，其中，所述第二板体包括至少一层所述柔性电路层，所述柔性电路层的一端设置为压合部，所述柔性电路层的压合部固定设置于所述第一板体内。
  8. 根据权利要求7所述的电路板，其中，所述柔性电路层的设置所述压合部的相对另一端设置为绑定部，所述柔性电路层的绑定部在绑定外接设备之前为悬空设置。
  9. 根据权利要求8所述的电路板，其中，所述第二板体包括两个以上沿同一方向间隔设置的子板，且各所述子板的压合部连接成板，各所述子板的绑定部相互独立设置。
  10. 一种显示模组，包括：
    显示面板；以及
    电路板，所述电路板包括第一板体、与所述第一板体相结合的第二板体，所述第一板体为硬质板体，所述第二板体为柔性板体，所述第一板体内固定设置有柔性电路层，所述柔性电路层包括柔性基板、以及设置于所述柔性基板至少一侧的金属走线层；
    其中，所述柔性电路层与所述第一板体的金属走线层电性连接，并延伸至所述第一板体之外，所述柔性电路层位于所述第一板体之外的部分为所述第二板体的任意功能层，所述显示面板的边框区域设置有绑定端子，所述柔性电路层的绑定部与所述显示面板的绑定端子固定并电性连接。
  11. 根据权利要求10所述的显示模组，其中，所述第一板体包括多层层间基板、以及位于所述层间基板上的所述金属走线层，所述层间基板包括硬质板、以及至少一层所述柔性电路层。
  12. 根据权利要求11所述的显示模组，其中，位于所述第一板体内的所述柔性电路层的边缘与所述第一板体边缘平齐设置，或内缩设置于所述第一板体内并与所述第一板体边缘保持预设距离。
  13. 根据权利要求12所述的显示模组，其中，在所述第一板体的厚度方向上，所述柔性电路层相对位于所述第一板体的中间位置。
  14. 根据权利要求11所述的显示模组，其中，所述层间基板上形成有过孔，位于异层的所述金属走线层之间通过所述过孔连通。
  15. 如权利要求14所述的显示模组，其中，所述过孔内填充有金属导电材料，所述金属导电材料包括铜、铝、镍、锡中的任意一种。
  16. 根据权利要求10所述的显示模组，其中，在所述层间基板中，所述硬质板的材料为酚醛树脂、玻璃纤维、环氧树脂中的一种或两种以上的组合材料；所述柔性电路层的衬底材料为聚酰亚胺、聚酯膜、聚四氟乙烯或聚酰胺纤维。
  17. 根据权利要求11所述的显示模组，其中，所述第二板体包括至少一层所述柔性电路层，所述柔性电路层的一端设置为压合部，所述柔性电路层的压合部固定设置于所述第一板体内。
  18. 根据权利要求17所述的显示模组，其中，所述柔性电路层的设置所述压合部的相对另一端设置为绑定部，所述柔性电路层的绑定部在绑定外接设备之前为悬空设置。
  19. 根据权利要求18所述的显示模组，其中，所述第二板体包括两个以上沿同一方向间隔设置的子板，且各所述子板的压合部连接成板，各所述子板的绑定部相互独立设置。
  20. 根据权利要求10所述的显示模组，其中，所述金属走线层的材料可以为锡、铜、铬、钯、镍、金、铝或者上述金属材料的合金之一。
PCT/CN2022/083321 2022-03-18 2022-03-28 电路板及显示模组 WO2023173472A1 (zh)

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