JP2019009129A - 異方導電性フィルム及び接続構造体 - Google Patents
異方導電性フィルム及び接続構造体 Download PDFInfo
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- JP2019009129A JP2019009129A JP2018134336A JP2018134336A JP2019009129A JP 2019009129 A JP2019009129 A JP 2019009129A JP 2018134336 A JP2018134336 A JP 2018134336A JP 2018134336 A JP2018134336 A JP 2018134336A JP 2019009129 A JP2019009129 A JP 2019009129A
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- conductive film
- anisotropic conductive
- electronic component
- center distance
- connection
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- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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Abstract
Description
任意の導電粒子と、該導電粒子に隣接する導電粒子との中心間距離につき、任意の導電粒子と最も短い距離を第1中心間距離とし、その次に短い距離を第2中心間距離とした場合に、
第1中心間距離及び第2中心間距離が、それぞれ導電粒子の粒子径の1.5〜5倍であり、
任意の導電粒子P0と、任意の導電粒子P0と第1中心間距離にある導電粒子P1と、任意の導電粒子P0と第1中心間距離又は第2中心間距離にある導電粒子P2で形成される鋭角三角形について、導電粒子P0、P1を通る直線の方向(以下、第1配列方向という)に対して直交する直線と、導電粒子P1、P2を通る直線の方向(以下、第2配列方向という)とがなす鋭角の角度α(以下、第2配列方向の傾斜角αともいう)が18〜35°である異方導電性フィルムを提供する。
ここで、略直交するとは、第1配列方向に厳密に直交する方向だけでなく、異方導電性フィルムを用いて電子部品を実装する際に生じるずれの範囲を含む。通常、第1配列方向に直交する方向に対して、±3°が含まれる。
図1は、本発明の一実施例の異方導電性フィルム1Aにおける導電粒子Pの配置図である。この異方導電性フィルム1Aは、絶縁接着剤層10と、絶縁接着剤層10に格子状の配置で固定された導電粒子Pを有する。
成物層の上に、貫通孔が所定の配置で形成されている部材を設け、その上から導電粒子P
を供給し、貫通孔を通過させるなどの方法でもよい。
異方導電性フィルムにおける導電粒子P(粒子径D=4μm)の配置について、第1中心間距離d1=第2中心間距離d2=10μmとし、表1に示すように傾斜角αを変えた場合に、電極サイズ15μm×100μmの狭小のバンプを異方導電性フィルムのパターンに重ねることによって、加熱加圧前のバンプが捕捉し得る導電粒子の最多粒子数と最少粒子数とを求めた。この場合、異方導電性フィルムの長手方向とバンプの短手方向を合わせた。また、バンプの縁端部に対してその面積の50%以上が外れている粒子は、バンプが捕捉し得る導電粒子としてカウントしなかった。
この結果から、傾斜角αとバンプの粒子捕捉性の傾向をみることができる。結果を表1に示す。
これに対し、傾斜角αが小さすぎると、捕捉数の差が大きくなる。これは傾斜角が小さすぎることにより、粒子配列の、バンプの端部へのかかり具合が捕捉数に直接影響するためである。逆に傾斜角αが大きすぎても同様な現象が生じ、バンプから外れる粒子が多くなる傾向がある。
次に、導電粒子の粒子間の距離と傾斜角αとの関係を具体的に検証するために、表2に示す樹脂を使用し、導電粒子(積水化学工業(株)、AUL704、粒径4μm)が表2に示す配置となる異方導電性フィルムを次のようにして製造した。即ち、表2に示す組成で熱可塑性樹脂、熱硬化性樹脂及び潜在性硬化剤を含む絶縁性樹脂の混合溶液を調製し、それを、フィルム厚さ50μmのPETフィルム上に塗布し、80℃のオーブンにて5分間乾燥させ、PETフィルム上に厚み20μmの粘着層を形成した。
導電粒子を表3に示した配置とする以外は、上述の実施例及び比較例と同様にして実施例9〜13、比較例6、7の異方導電性フィルムを製造した。
なお、比較例1、比較例6では導電粒子を、低沸点溶媒に分散し噴霧してランダムに同一平面上に配置した。
一方、比較例1、6は任意に導電粒子100個を選択し、各導電粒子の最近接粒子中心間距離を計測した。
各実施例及び比較例の異方導電性フィルムの(a)粒子捕捉数、(b)初期導通抵抗、(c)導通信頼性、(d)ショート発生率を、それぞれ次のように評価した。結果を表2、表3に示す。
(a-1)平均数
各実施例及び比較例の異方導電性フィルムを用いて15×100μmのバンプ100個とガラス基板とを加熱加圧(180℃、80MPa、5秒)して接続物を得た。この場合、異方導電性フィルムの長手方向とバンプの短手方向を合わせた。そして、各バンプにおける粒子捕捉数を計測し、バンプ1個当たりの平均粒子捕捉数を求めた。
(a-1)で計測した各バンプの粒子捕捉数のうち、最小数を求めた。
各実施例及び比較例の異方導電性フィルムを、初期導通および導通信頼性の評価用ICとガラス基板の間に挟み、加熱加圧(180℃、80MPa、5秒)して各評価用接続物を得た。この場合、異方導電性フィルムの長手方向とバンプの短手方向を合わせた。そして、評価用接続物の導通抵抗を測定した。
ここで、この各評価用ICとガラス基板は、それらの端子パターンが対応しており、サイズは次の通りである。
外径 0.7×20mm
厚み 0.2mm
バンプ仕様 金メッキ、高さ12μm、サイズ15×100μm、バンプ間距離15μm
ガラス材質 コーニング社製
外径 30×50mm
厚み 0.5mm
電極 ITO配線
(b)の評価用ICと各実施例及び比較例の異方導電性フィルムとの評価用接続物を温度85℃、湿度85%RHの恒温槽に500時間おいた後の導通抵抗を、(b)と同様に測定した。なお、この導通抵抗が5Ω以上であると、接続した電子部品の実用的な導通安定性の点から好ましくない。
ショート発生率の評価用ICとして次のIC(7.5μmスペースの櫛歯TEG(test element group))を用意した。
外径 1.5×13mm
厚み 0.5mm
バンプ仕様 金メッキ、高さ15μm、サイズ25×140μm、バンプ間距離7.5μm
各実施例及び比較例の異方導電性フィルムを、ショート発生率の評価用ICと、該評価用ICに対応したパターンのガラス基板との間に挟み、(b)と同様の接続条件で加熱加圧して接続物を得、その接続物のショート発生率を求めた。ショート発生率は、「ショートの発生数/7.5μmスペース総数」で算出される。ショート発生率が1ppm以上であると実用上の接続構造体を製造する点から好ましくない。
これに対し、比較例1では、粒子密度が過度に高いために絶縁性が悪く、また、比較例2〜比較例5では、傾斜角αが18〜35°の範囲を外れており、バンプにおける粒子捕捉数が少なく、導通信頼性に欠けることがわかる。
実施例3、9〜13において、導電粒子粒子径Dを4μmから3μmに変更し、隣接粒子間中心距離を6μm(即ち、(d-D)/D=1)、配置密度28000個/mm2として実施例14〜19の異方導電性フィルムを製造し、同様に評価した。その結果、これらについても、実施例3及び9〜13とほぼ同様の初期導通抵抗の低さと、導通信頼性の高さと、ショート発生率抑制効果が得られた。また、これらの評価用接続物におけるバンプの縁辺上にある導電粒子と、幅方向の中央部にある導電粒子の圧痕状態についても、実施例9〜13と同様であった。
実施例3、9〜13において、導電粒子粒子径Dを4μmのまま、隣接粒子間中心距離を7μm((d-D)/D=0.75、配置密度20000個/mm2)とした実施例20〜25の異方導電性フィルムを製造し、同様に評価した。その結果、これらについても、実施例3、9〜13とほぼ同様の初期導通抵抗の低さと、導通信頼性の高さと、ショート発生率の抑制効果が得られた。また、これらの評価用接続物におけるバンプの縁辺上にある導電粒子と、幅方向の中央部にある導電粒子の圧痕状態についても、実施例9〜13と同様であった。
実施例3、9〜13において、導電粒子粒子径Dを4μmのまま、隣接粒子間中心距離を16μm((d-D)/D=3、配置密度4000個/mm2)とした実施例26〜31の異方導電性フィルムを製造し、同様に評価した。その結果、これらについては、実施例3、9〜13よりも初期導通抵抗は高くなったが、実用上の問題はなかった。導通信頼性の高さとショート発生率の抑制効果は、実施例3、9〜13と同様であった。これは、実施例26〜31の異方導電性フィルムは、導電粒子の配置密度が低いためと考えられる。
評価用接続物におけるバンプの縁辺上にある導電粒子と、幅方向の中央部にある導電粒子の圧痕状態は、実施例9〜13と同様であった。
実施例5、7において絶縁性樹脂100質量部にシリカ微粒子フィラー(シリカ微粒子、アエロジルRY200、日本アエロジル株式会社)20質量部を加え、実施例5、7と同様にして異方導電性フィルムを製造し、評価した。その結果、実施例5、7と同様の初期導通抵抗の低さと、導通信頼性の高さと、ショート発生率抑制効果が得られた。
3 接続端子又はバンプ
10 絶縁接着剤層
L0 第1配列方向に直交する方向
L1 第1配列方向
L2 第2配列方向
L3 第3配列方向
Lf 異方導電性フィルムの長手方向
Lt 接続端子の長手方向
d1 第1中心間距離、ピッチ
d2 第2中心間距離、ピッチ
D 導電粒子の粒子径
P、P0、P1、P2、Pc、Pe 導電粒子
α 傾斜角
β 傾斜角
Claims (21)
- 絶縁接着剤層と、該絶縁接着剤層に格子状に配置された導電粒子を含む異方導電性フィルムであって、
任意の導電粒子と、該導電粒子に隣接する導電粒子との中心間距離につき、任意の導電粒子と最も短い距離を第1中心間距離とし、その次に短い距離を第2中心間距離とした場合に、
第1中心間距離及び第2中心間距離が、それぞれ導電粒子の粒子径の1.5〜5倍であり、
任意の導電粒子P0と、任意の導電粒子P0と第1中心間距離にある導電粒子P1と、任意の導電粒子P0と第1中心間距離又は第2中心間距離にある導電粒子P2で形成される非鈍角三角形について、導電粒子P0、P1を通る直線の方向(以下、第1配列方向という)に対して直交する直線と、導電粒子P1、P2を通る直線の方向(以下、第2配列方向という)とがなす角度αが18〜35°であり、前記絶縁接着剤層は、当該絶縁接着剤層を形成する樹脂100質量部に対し絶縁性フィラーを3〜40質量部含有する異方導電性フィルム。 - 第1配列方向とフィルム長手方向とが平行である請求項1記載の異方導電性フィルム。
- 絶縁接着剤層が、アクリレート化合物と光又は熱ラジカル重合開始剤とを含む光又は熱ラジカル重合型樹脂層、又はエポキシ化合物と熱カチオン又は熱アニオン重合開始剤とを含む熱カチオン又はアニオン重合型樹脂層である請求項1又は2記載の異方導電性フィルム。
- 絶縁性フィラーが、シリカ微粒子、アルミナ又は水酸化アルミニウムを含有する請求項1〜3のいずれかに記載の異方導電性フィルム。
- 第1中心間距離と第2中心間距離との差が導電粒子の粒子径の2倍未満である請求項1〜4のいずれかに記載の異方導電性フィルム。
- 導電粒子の個数密度が2000〜250000個/mm2である請求項1〜5のいずれかに記載の異方導電性フィルム。
- 第1配列方向及び第2配列方向のそれぞれについて、導電粒子の連続した欠落数が6個以下である請求項1〜6のいずれかに記載の異方導電性フィルム。
- 請求項1〜7のいずれかに記載の異方導電性フィルムを用いて、第1電子部品の接続端子と第2電子部品の接続端子を異方導電性接続する接続方法であって、異方導電性フィルムの長手方向を第1電子部品又は第2電子部品の接続端子の短手方向に合わせ、異方導電性フィルムの第1配列方向に略直交する方向を第1電子部品又は第2電子部品の接続端子の長手方向に合わせる接続方法。
- 第1電子部品が、透明電極で接続端子が形成されたガラス基板であり、第2電子部品がICチップである請求項8記載の接続方法。
- 接続端子の接続面の大きさが、幅8〜60μm、長さ400μm以下である請求項8又は9記載の接続方法。
- 請求項1〜7のいずれかに記載の異方導電性フィルムを介して第1電子部品の接続端子と第2電子部品の接続端子とを異方導電性接続する接続構造体の製造方法。
- 請求項1〜7のいずれかに記載の異方導電性フィルムを介して第1電子部品の接続端子と第2電子部品の接続端子とが異方導電性接続されている接続構造体。
- 絶縁接着剤層と、該絶縁接着剤層に格子状に配置された導電粒子を含む異方導電性フィルムであって、
任意の導電粒子と、該導電粒子に隣接する導電粒子との中心間距離につき、任意の導電粒子と最も短い距離を第1中心間距離とし、その次に短い距離を第2中心間距離とした場合に、
第1中心間距離及び第2中心間距離が、それぞれ導電粒子の粒子径の1.5〜5倍であり、
任意の導電粒子P0と、任意の導電粒子P0と第1中心間距離にある導電粒子P1と、任意の導電粒子P0と第1中心間距離又は第2中心間距離にある導電粒子P2で形成される非鈍角三角形について、導電粒子P0、P1を通る直線の方向を第1配列方向とし、導電粒子P1、P2を通る直線の方向を第2配列方向とし、導電粒子P0、P2を通る直線の方向を第3配列方向とした場合に、第1配列方向、第2配列方向及び第3配列方向が異方導電性フィルムの長手方向に対して傾いており、
前記絶縁接着剤層は、当該絶縁接着剤層を形成する樹脂100質量部に対し絶縁性フィラーを3〜40質量部含有する異方導電性フィルム。 - 絶縁接着剤層が、アクリレート化合物と光又は熱ラジカル重合開始剤とを含む光又は熱ラジカル重合型樹脂層、又はエポキシ化合物と熱カチオン又は熱アニオン重合開始剤とを含む熱カチオン又はアニオン重合型樹脂層である請求項13記載の異方導電性フィルム。
- 絶縁性フィラーが、シリカ微粒子、アルミナ又は水酸化アルミニウムを含有する請求項13又は14記載の異方導電性フィルム。
- 第1配列方向に対して直交する直線と、第2配列方向とがなす角度αが、18〜35°である請求項13〜15のいずれかに記載の異方導電性フィルム。
- 請求項13〜16のいずれかに記載の異方導電性フィルムを用いて、第1電子部品の接続端子と第2電子部品の接続端子を異方導電性接続する接続方法であって、異方導電性フィルムの長手方向を第1電子部品又は第2電子部品の接続端子の短手方向に合わせ、異方導電性フィルムの第1配列方向に略直交する方向を第1電子部品又は第2電子部品の接続端子の長手方向に合わせる接続方法。
- 第1電子部品が、透明電極で接続端子が形成されたガラス基板であり、第2電子部品がICチップである請求項17記載の接続方法。
- 接続端子の接続面の大きさが、幅8〜60μm、長さ400μm以下である請求項17又は18記載の接続方法。
- 請求項13〜16のいずれかに記載の異方導電性フィルムを介して第1電子部品の接続端子と第2電子部品の接続端子とを異方導電性接続する接続構造体の製造方法。
- 請求項13〜16のいずれかに記載の異方導電性フィルムを介して第1電子部品の接続端子と第2電子部品の接続端子とが異方導電性接続されている接続構造体。
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JP2017139233A (ja) | 2017-08-10 |
JP6932110B2 (ja) | 2021-09-08 |
US20160270225A1 (en) | 2016-09-15 |
US20200020664A1 (en) | 2020-01-16 |
JP2022133317A (ja) | 2022-09-13 |
KR20160088294A (ko) | 2016-07-25 |
CN105637712A (zh) | 2016-06-01 |
US10522502B2 (en) | 2019-12-31 |
HK1257883A1 (zh) | 2019-11-01 |
CN108539440B (zh) | 2020-12-01 |
CN107123471A (zh) | 2017-09-01 |
KR20180041777A (ko) | 2018-04-24 |
JP2016066573A (ja) | 2016-04-28 |
CN108539440A (zh) | 2018-09-14 |
US20180294246A1 (en) | 2018-10-11 |
KR20200029640A (ko) | 2020-03-18 |
JP2017188446A (ja) | 2017-10-12 |
TWI699054B (zh) | 2020-07-11 |
JP2020129550A (ja) | 2020-08-27 |
CN105637712B (zh) | 2019-08-20 |
KR20190052161A (ko) | 2019-05-15 |
JP6640141B2 (ja) | 2020-02-05 |
US11139265B2 (en) | 2021-10-05 |
JP6380591B2 (ja) | 2018-08-29 |
US10510711B2 (en) | 2019-12-17 |
TW201909485A (zh) | 2019-03-01 |
TW201826624A (zh) | 2018-07-16 |
JP6119718B2 (ja) | 2017-04-26 |
TWI643417B (zh) | 2018-12-01 |
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