JP2018159690A - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
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- JP2018159690A JP2018159690A JP2017058503A JP2017058503A JP2018159690A JP 2018159690 A JP2018159690 A JP 2018159690A JP 2017058503 A JP2017058503 A JP 2017058503A JP 2017058503 A JP2017058503 A JP 2017058503A JP 2018159690 A JP2018159690 A JP 2018159690A
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- 239000000523 sample Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000013461 design Methods 0.000 claims description 12
- 238000007689 inspection Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
図3では、基準ガイド穴150の上下左右に1つずつ予備ガイド穴を配置した構成を例示的に示した。しかし、基準ガイド穴150の上下左右にそれぞれ配置する予備ガイド穴の個数は1個に限られず、複数個の予備ガイド穴を配置してもよい。図7に、基準ガイド穴150の上下左右に2個ずつ予備ガイド穴を配置した例を示す。図7では、予備ガイド穴の符号を省略している。また、予備ガイド穴を放射状に配置してもよいし、予備ガイド穴の個数が1個でもよい。
上記のように本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
11…プローブ
12…プローブヘッド
13…電極基板
14…ガイドピン
20…被検査体
131…電極パッド
132…電極配線
133…接続パッド
150…基準ガイド穴
151〜154…予備ガイド穴
Claims (5)
- プローブと、
前記プローブを保持するプローブヘッドと、
前記プローブの基端部に接続させる電極パッドが配置された電極基板と
を備え、
前記プローブヘッドに、前記プローブヘッドと前記電極基板とを位置合わせするためのガイドピンが配置され、
前記電極基板に、前記ガイドピンと対応する複数のガイド穴で構成されるガイド穴群が配置されている
ことを特徴とする電気的接続装置。 - 前記プローブヘッドに複数の前記ガイドピンが配置され、1つの前記ガイドピンに対して前記ガイド穴群が前記電極基板に配置され、
前記ガイド穴群は、設計時の基準位置に配置された基準ガイド穴と前記基準ガイド穴の周囲に配置された予備ガイド穴とで構成されている
ことを特徴とする請求項1に記載の電気的接続装置。 - 前記ガイド穴群の少なくともいずれかと前記ガイドピンを嵌合させた場合に前記プローブの前記基端部が前記電極基板の前記電極パッドと正確に接触するように、前記基準ガイド穴と前記予備ガイド穴との相対位置が設定されていることを特徴とする請求項2に記載の電気的接続装置。
- 1つの前記基準ガイド穴の周囲に複数の前記予備ガイド穴が配置されていることを特徴とする請求項2又は3に記載の電気的接続装置。
- 前記基準位置が設計時の前記ガイドピンの位置に合わせて決定され、
前記基準ガイド穴と前記予備ガイド穴との相対位置が、前記ガイドピン及び前記基準ガイド穴の位置の設計時の位置からの予測されるずれ量を見込んで設定されている
ことを特徴とする請求項2乃至4のいずれか1項に記載の電気的接続装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017058503A JP6872943B2 (ja) | 2017-03-24 | 2017-03-24 | 電気的接続装置 |
EP18770366.5A EP3605116A4 (en) | 2017-03-24 | 2018-01-22 | ELECTRICAL CONNECTION DEVICE |
CN201880017541.1A CN110392839B (zh) | 2017-03-24 | 2018-01-22 | 电连接装置 |
PCT/JP2018/001723 WO2018173448A1 (ja) | 2017-03-24 | 2018-01-22 | 電気的接続装置 |
US16/495,263 US11085948B2 (en) | 2017-03-24 | 2018-01-22 | Electric connection device |
KR1020197026674A KR102257278B1 (ko) | 2017-03-24 | 2018-01-22 | 전기적 접속 장치 |
TW107103225A TWI665450B (zh) | 2017-03-24 | 2018-01-30 | 電性連接裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017058503A JP6872943B2 (ja) | 2017-03-24 | 2017-03-24 | 電気的接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018159690A true JP2018159690A (ja) | 2018-10-11 |
JP6872943B2 JP6872943B2 (ja) | 2021-05-19 |
Family
ID=63584269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017058503A Active JP6872943B2 (ja) | 2017-03-24 | 2017-03-24 | 電気的接続装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11085948B2 (ja) |
EP (1) | EP3605116A4 (ja) |
JP (1) | JP6872943B2 (ja) |
KR (1) | KR102257278B1 (ja) |
CN (1) | CN110392839B (ja) |
TW (1) | TWI665450B (ja) |
WO (1) | WO2018173448A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021076486A (ja) * | 2019-11-11 | 2021-05-20 | 株式会社日本マイクロニクス | 電気的接続装置 |
TWI765652B (zh) * | 2021-04-09 | 2022-05-21 | 晶英科技股份有限公司 | 運用半導體製程成形於晶圓基板之電性檢測裝置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002107411A (ja) * | 2000-09-29 | 2002-04-10 | Ando Electric Co Ltd | テストヘッドの支持台 |
JP2007178405A (ja) * | 2005-12-28 | 2007-07-12 | Nhk Spring Co Ltd | プローブカード |
JP2009027373A (ja) * | 2007-07-18 | 2009-02-05 | Toshiba Corp | 方向性結合器 |
US20100134128A1 (en) * | 2008-12-03 | 2010-06-03 | Formfactor, Inc. | Thermocentric Alignment Of Elements On Parts Of An Apparatus |
JP2013130459A (ja) * | 2011-12-21 | 2013-07-04 | Micronics Japan Co Ltd | 板状部材の位置決め方法及び電気的接続装置の製造方法 |
JP2015200621A (ja) * | 2014-04-10 | 2015-11-12 | 株式会社ヨコオ | プローブカバー |
JP2017096788A (ja) * | 2015-11-25 | 2017-06-01 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び基板検査方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3061008B2 (ja) | 1997-07-10 | 2000-07-10 | 日本電気株式会社 | プローブ装置 |
US7071715B2 (en) * | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
JP2007304008A (ja) * | 2006-05-12 | 2007-11-22 | Nidec-Read Corp | 基板検査用接触子、基板検査用治具及び基板検査装置 |
JP2007322179A (ja) * | 2006-05-30 | 2007-12-13 | Nidec-Read Corp | 基板検査用治具及びこの治具を備える基板検査装置 |
JP2008070146A (ja) * | 2006-09-12 | 2008-03-27 | Yokowo Co Ltd | 検査用ソケット |
JP5449907B2 (ja) * | 2009-07-30 | 2014-03-19 | ポーラ化成工業株式会社 | 化粧料保持具 |
TWI518340B (zh) | 2009-08-27 | 2016-01-21 | 李諾工業股份有限公司 | 半導體晶片測試插座 |
JP5629545B2 (ja) | 2009-12-18 | 2014-11-19 | 株式会社日本マイクロニクス | プローブカード及び検査装置 |
JP2012204695A (ja) * | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法 |
US8723538B2 (en) * | 2011-06-17 | 2014-05-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe head formation methods employing guide plate raising assembly mechanism |
JP6466128B2 (ja) * | 2014-10-08 | 2019-02-06 | 株式会社日本マイクロニクス | プローブカード |
JP6537315B2 (ja) * | 2015-03-23 | 2019-07-03 | オルガン針株式会社 | ワイヤープローブ用治具 |
JP7075725B2 (ja) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | 電気的接続装置 |
-
2017
- 2017-03-24 JP JP2017058503A patent/JP6872943B2/ja active Active
-
2018
- 2018-01-22 EP EP18770366.5A patent/EP3605116A4/en active Pending
- 2018-01-22 CN CN201880017541.1A patent/CN110392839B/zh active Active
- 2018-01-22 WO PCT/JP2018/001723 patent/WO2018173448A1/ja active Application Filing
- 2018-01-22 US US16/495,263 patent/US11085948B2/en active Active
- 2018-01-22 KR KR1020197026674A patent/KR102257278B1/ko active IP Right Grant
- 2018-01-30 TW TW107103225A patent/TWI665450B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002107411A (ja) * | 2000-09-29 | 2002-04-10 | Ando Electric Co Ltd | テストヘッドの支持台 |
JP2007178405A (ja) * | 2005-12-28 | 2007-07-12 | Nhk Spring Co Ltd | プローブカード |
JP2009027373A (ja) * | 2007-07-18 | 2009-02-05 | Toshiba Corp | 方向性結合器 |
US20100134128A1 (en) * | 2008-12-03 | 2010-06-03 | Formfactor, Inc. | Thermocentric Alignment Of Elements On Parts Of An Apparatus |
JP2013130459A (ja) * | 2011-12-21 | 2013-07-04 | Micronics Japan Co Ltd | 板状部材の位置決め方法及び電気的接続装置の製造方法 |
JP2015200621A (ja) * | 2014-04-10 | 2015-11-12 | 株式会社ヨコオ | プローブカバー |
JP2017096788A (ja) * | 2015-11-25 | 2017-06-01 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び基板検査方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110392839B (zh) | 2022-02-18 |
US20200011897A1 (en) | 2020-01-09 |
KR102257278B1 (ko) | 2021-05-27 |
JP6872943B2 (ja) | 2021-05-19 |
EP3605116A1 (en) | 2020-02-05 |
WO2018173448A1 (ja) | 2018-09-27 |
EP3605116A4 (en) | 2021-01-06 |
TW201835576A (zh) | 2018-10-01 |
TWI665450B (zh) | 2019-07-11 |
US11085948B2 (en) | 2021-08-10 |
KR20190113958A (ko) | 2019-10-08 |
CN110392839A (zh) | 2019-10-29 |
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