JP2015200621A - プローブカバー - Google Patents
プローブカバー Download PDFInfo
- Publication number
- JP2015200621A JP2015200621A JP2014081152A JP2014081152A JP2015200621A JP 2015200621 A JP2015200621 A JP 2015200621A JP 2014081152 A JP2014081152 A JP 2014081152A JP 2014081152 A JP2014081152 A JP 2014081152A JP 2015200621 A JP2015200621 A JP 2015200621A
- Authority
- JP
- Japan
- Prior art keywords
- base
- probe cover
- socket
- positioning pin
- locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 77
- 238000000926 separation method Methods 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 description 9
- 238000007689 inspection Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
- H01R33/7664—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket having additional guiding, adapting, shielding, anti-vibration or mounting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
- H01R33/7671—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket having multiple positions or sockets, e.g. stacked sockets while mounting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
複数のコンタクトプローブを支持したソケットに取り付けるプローブカバーであって、
ベースと、
前記ベースに設けられた2つの位置決めピンと、
前記ベースに設けられた少なくとも1つの支持部材とを備え、
前記2つの位置決めピン及び前記支持部材により、前記ソケットに対して前記ベースを所定距離離間した状態で位置決め可能であり、
前記2つの位置決めピンの相互離間距離を変更可能である。
Claims (9)
- 複数のコンタクトプローブを支持したソケットに取り付けるプローブカバーであって、
ベースと、
前記ベースに設けられた2つの位置決めピンと、
前記ベースに設けられた少なくとも1つの支持部材とを備え、
前記2つの位置決めピン及び前記支持部材により、前記ソケットに対して前記ベースを所定距離離間した状態で位置決め可能であり、
前記2つの位置決めピンの相互離間距離を変更可能である、プローブカバー。 - 前記相互離間距離を連続値の中から選択可能である請求項1に記載のプローブカバー。
- 前記ベースは、前記2つの位置決めピンをそれぞれスライド可能に支持するガイド部を有する、請求項1又は2に記載のプローブカバー。
- 双方の前記ガイド部が同一直線上に設けられている請求項3に記載のプローブカバー。
- 前記2つの位置決めピンの一方を任意のスライド位置で係止する係止手段を有する請求項3又は4に記載のプローブカバー。
- 前記ベースが複数の取付穴を有し、前記支持部材を任意の前記取付穴に取付け可能である、請求項1から5のいずれか一項に記載のプローブカバー。
- 前記支持部材を2つ有し、前記2つの支持部材を、前記2つの位置決めピンを通る直線を挟んで両側に分けて配置可能である、請求項1から6のいずれか一項に記載のプローブカバー。
- 前記ベースが円板形状である請求項1から7のいずれか一項に記載のプローブカバー。
- 前記ベースが透明である請求項1から8のいずれか一項に記載のプローブカバー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014081152A JP6254038B2 (ja) | 2014-04-10 | 2014-04-10 | プローブカバー |
MYPI2016703694A MY176785A (en) | 2014-04-10 | 2015-03-20 | Probe cover |
US15/302,666 US10324110B2 (en) | 2014-04-10 | 2015-03-20 | Probe cover |
PCT/JP2015/058574 WO2015156104A1 (ja) | 2014-04-10 | 2015-03-20 | プローブカバー |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014081152A JP6254038B2 (ja) | 2014-04-10 | 2014-04-10 | プローブカバー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015200621A true JP2015200621A (ja) | 2015-11-12 |
JP6254038B2 JP6254038B2 (ja) | 2017-12-27 |
Family
ID=54287683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014081152A Active JP6254038B2 (ja) | 2014-04-10 | 2014-04-10 | プローブカバー |
Country Status (4)
Country | Link |
---|---|
US (1) | US10324110B2 (ja) |
JP (1) | JP6254038B2 (ja) |
MY (1) | MY176785A (ja) |
WO (1) | WO2015156104A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017090385A1 (ja) * | 2015-11-25 | 2017-06-01 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び基板検査方法 |
WO2018173448A1 (ja) * | 2017-03-24 | 2018-09-27 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2021148700A (ja) * | 2020-03-23 | 2021-09-27 | 株式会社ヨコオ | プローブヘッド |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148535A (ja) * | 1994-11-15 | 1996-06-07 | Sony Corp | 半導体測定プローブカード用プロテクターおよび保管方法 |
JPH11101848A (ja) * | 1997-09-29 | 1999-04-13 | Nec Kansai Ltd | 半導体装置の環境試験用治具 |
JP2005514596A (ja) * | 2001-12-19 | 2005-05-19 | フォームファクター,インコーポレイテッド | プローブ・カード・カバーリング・システムおよび方法 |
JP2007287425A (ja) * | 2006-04-14 | 2007-11-01 | Enplas Corp | 電気部品用ソケット |
US7598727B1 (en) * | 2006-09-12 | 2009-10-06 | Xilinx, Inc. | Probe card head protection device for wafer sort set up |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02237047A (ja) * | 1989-03-09 | 1990-09-19 | Mitsubishi Electric Corp | 半導体試験装置 |
JP2005061851A (ja) * | 2003-08-12 | 2005-03-10 | Japan Electronic Materials Corp | プローブカード用基板 |
JP2011014377A (ja) | 2009-07-02 | 2011-01-20 | Alps Electric Co Ltd | 接点ボード用の収納容器、および前記収納容器を使用した接続装置の組み立て方法 |
US8876536B2 (en) * | 2012-02-29 | 2014-11-04 | Data I/O Corporation | Integrated circuit socket system with configurable structures and method of manufacture thereof |
-
2014
- 2014-04-10 JP JP2014081152A patent/JP6254038B2/ja active Active
-
2015
- 2015-03-20 US US15/302,666 patent/US10324110B2/en active Active
- 2015-03-20 WO PCT/JP2015/058574 patent/WO2015156104A1/ja active Application Filing
- 2015-03-20 MY MYPI2016703694A patent/MY176785A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148535A (ja) * | 1994-11-15 | 1996-06-07 | Sony Corp | 半導体測定プローブカード用プロテクターおよび保管方法 |
JPH11101848A (ja) * | 1997-09-29 | 1999-04-13 | Nec Kansai Ltd | 半導体装置の環境試験用治具 |
JP2005514596A (ja) * | 2001-12-19 | 2005-05-19 | フォームファクター,インコーポレイテッド | プローブ・カード・カバーリング・システムおよび方法 |
JP2007287425A (ja) * | 2006-04-14 | 2007-11-01 | Enplas Corp | 電気部品用ソケット |
US7598727B1 (en) * | 2006-09-12 | 2009-10-06 | Xilinx, Inc. | Probe card head protection device for wafer sort set up |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017090385A1 (ja) * | 2015-11-25 | 2017-06-01 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び基板検査方法 |
JP2017096788A (ja) * | 2015-11-25 | 2017-06-01 | 日本電産リード株式会社 | 検査治具、基板検査装置、及び基板検査方法 |
WO2018173448A1 (ja) * | 2017-03-24 | 2018-09-27 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2018159690A (ja) * | 2017-03-24 | 2018-10-11 | 株式会社日本マイクロニクス | 電気的接続装置 |
US11085948B2 (en) | 2017-03-24 | 2021-08-10 | Kabushiki Kaisha Nihon Micronics | Electric connection device |
JP2021148700A (ja) * | 2020-03-23 | 2021-09-27 | 株式会社ヨコオ | プローブヘッド |
Also Published As
Publication number | Publication date |
---|---|
US20170038412A1 (en) | 2017-02-09 |
WO2015156104A1 (ja) | 2015-10-15 |
JP6254038B2 (ja) | 2017-12-27 |
MY176785A (en) | 2020-08-21 |
US10324110B2 (en) | 2019-06-18 |
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