WO2018173448A1 - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
- Publication number
- WO2018173448A1 WO2018173448A1 PCT/JP2018/001723 JP2018001723W WO2018173448A1 WO 2018173448 A1 WO2018173448 A1 WO 2018173448A1 JP 2018001723 W JP2018001723 W JP 2018001723W WO 2018173448 A1 WO2018173448 A1 WO 2018173448A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- guide hole
- guide
- electrode substrate
- electrical connection
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Definitions
- the present invention relates to an electrical connection device used for measurement of electrical characteristics of an object to be inspected.
- an electrical connection device having a probe to be brought into contact with the object to be inspected is used.
- the electrical connection device a configuration in which a probe head that holds a probe is attached to an electrode substrate on which an electrode pad that is electrically connected to the probe is disposed is used.
- the position of the guide pins and electrode pads may differ from the design time due to manufacturing errors of the probe head and electrode substrate.
- the alignment between the probe and the electrode pad is not accurately performed.
- the contact between the probe and the electrode pad becomes insufficient, and there arises a problem that accurate electrical measurement of the object to be inspected cannot be performed.
- an object of the present invention is to provide an electrical connection device capable of accurately aligning a probe held on a probe head and an electrode pad disposed on an electrode substrate.
- a probe a probe head that holds the probe, and an electrode substrate on which an electrode pad that is connected to the proximal end portion of the probe is disposed, and the probe head includes the probe head and the electrode substrate.
- an electrical connection device in which guide pins for positioning are arranged, and a guide hole group composed of a plurality of guide holes corresponding to the guide pins is arranged on the electrode substrate.
- an electrical connection device capable of accurately aligning the probe held on the probe head and the electrode pad disposed on the electrode substrate.
- FIG. 4A is a side view
- FIG. 4B is a plan view seen from the surface side of the electrode pad.
- FIG. 4A is a side view
- FIG. 4B is a plan view seen from the surface side of the electrode pad.
- FIG. 4A is a side view
- FIG. 4B is a plan view seen from the surface side of the electrode pad.
- FIG. 4A is a side view
- FIG. 4B is a plan view seen from the surface side of the electrode pad.
- FIG. 4B is a plan view seen from the surface side of the electrode pad.
- FIG. 6A and 6B are schematic views showing an example of the alignment state of the probe and the electrode pad in FIG. 5, FIG. 6A is a side view, and FIG. 6B is a plan view seen from the surface side of the electrode pad.
- It is a typical top view which shows the example of arrangement
- It is a typical top view which shows the other example of arrangement
- the electrical connection device 10 includes a probe head 12 that holds the probe 11 and an electrode substrate 13 on which an electrode pad 131 is disposed.
- the probe 11 is displayed through the side surface of the probe head 12.
- the probe head 12 is attached so as to overlap with the electrode substrate 13, and the proximal end portion of the probe 11 and the electrode pad 131 are electrically connected. That is, as shown in FIG. 1, the base end portion of the probe 11 protruding from the upper surface of the probe head 12 facing the electrode substrate 13 has an electrode pad 131 disposed on the lower surface of the electrode substrate 13 facing the probe head 12. Connecting.
- the electrical connection device 10 shown in FIG. 1 is a vertical operation type probe card, and the tip of the probe 11 exposed on the lower surface of the probe head 12 is an object to be inspected 20 disposed below the electrical connection device 10. Contact with a test pad (not shown).
- FIG. 1 shows a state where the probe 11 is not in contact with the inspection object 20, for example, the chuck 30 on which the inspection object 20 is mounted rises and the tip of the probe 11 contacts the inspection object 20. To do.
- the electrode pad 131 of the electrode substrate 13 is electrically connected to the connection pad 133 disposed on the upper surface of the electrode substrate 13 by the electrode wiring 132 disposed inside the electrode substrate 13.
- the connection pad 133 is electrically connected to an inspection device such as an IC tester (not shown).
- a predetermined voltage or current is applied to the inspection object 20 via the probe 11 by the inspection apparatus.
- the signal output from the to-be-inspected object 20 is sent to an inspection apparatus via the probe 11, and the characteristic of the to-be-inspected object 20 is test
- a guide pin 14 for aligning the probe head 12 and the electrode substrate 13 is disposed on the probe head 12.
- a guide hole group composed of a plurality of guide holes corresponding to the guide pins 14 is arranged.
- a guide hole group composed of 151 to 152 is prepared.
- FIG. 2 shows a state in which the guide pin 14 and the reference guide hole 150 are fitted.
- the reference position at the time of design where the reference guide hole 150 is arranged is determined according to the position of the guide pin 14 at the time of designing the electrical connection device 10. That is, when the probe head 12 and the electrode substrate 13 are assembled as designed, the probe 11 and the electrode pad 131 can be accurately brought into contact with each other by fitting the guide pin 14 and the reference guide hole 150 at the time of design.
- the reference position is set.
- “accurately contact” means that the proximal end portion of the probe 11 is in contact with the center region of the electrode pad 131 and the electrical characteristics of the device under test 20 can be accurately measured. It means that the electrical contact resistance with is sufficiently low.
- the positions of the guide pins 14 and the reference guide holes 150 may differ from those at the time of design due to assembly intersections, processing errors, member deflection, and the like during manufacture of the probe head 12 and the electrode substrate 13.
- the position of the guide pin 14 and the reference guide hole 150 is likely to deviate from the design position due to the increase in the size of the probe head 12 and the pitch between the probes 11.
- the probe 11 and the electrode pad 131 are connected when the probe head 12 is attached to the electrode substrate 13 by fitting the guide pin 14 and the reference guide hole 150. Deviation occurs in the alignment. Even when the probe head 12 is removed from the electrode substrate 13 and the probe 11 is replaced or repaired, the probe 11 and the electrode pad 131 are misaligned when the probe head 12 is reattached to the electrode substrate 13. May occur. In these cases, the probe 11 and the electrode pad 131 are in poor contact, and the electrical inspection of the device under test 20 cannot be performed accurately.
- the electrical connection device 10 if the probe 11 and the electrode pad 131 do not accurately contact even when the guide pin 14 and the reference guide hole 150 are fitted, any one of the preliminary guide holes and the guide pin 14. Mate. At this time, the preliminary guide hole to be fitted with the guide pin 14 is selected so that the probe 11 comes into contact with the electrode pad 131 accurately.
- the probe pin 14 is fitted into any of the preliminary guide holes, whereby the probe 11 and the electrode pad 131 are in exact contact with each other.
- the position of the preliminary guide hole is set so as to eliminate the misalignment between the probe 11 and the electrode pad 131.
- the relative position between the reference guide hole 150 and the spare guide hole is set in consideration of a predicted deviation amount from the design position of the guide pin 14 or the reference guide hole 150.
- the spare guide hole The position to arrange is set.
- the position and number of the preliminary guide holes can be arbitrarily set within the range satisfying the above conditions.
- FIG. 3 is a plan view of the surface of the electrode substrate 13 facing the probe head 12, and the guide pins 14 and the reference guide holes 150 are fitted.
- 2 is a cross-sectional view taken along the II-II direction of FIG.
- the proximal end portion of the probe 11 and the electrode pad as shown in FIGS. 4 (a) and 4 (b).
- the base end portion of the probe 11 is shifted to the right side from the center of the electrode pad 131 on the paper surface.
- 3 and 4 show an example in which the guide hole group including the reference guide hole 150 and the surrounding preliminary guide holes is arranged at the corners on the diagonal line across the center of the electrode substrate 13.
- the region where the guide hole group is arranged is not limited to the above two places, and for example, the guide hole group may be arranged at each of the four corner portions.
- a guide hole group including the reference guide hole 150 and the preliminary guide holes arranged around the reference guide hole 150 is prepared.
- a guide hole that fits with the guide pin 14 can be selected from a preliminary guide hole in addition to the reference guide hole 150 so that the probe 11 and the electrode pad 131 of the electrode substrate 13 are in accurate contact with each other. For this reason, according to the electrical connection apparatus 10 shown in FIG. 1, the misalignment of the probe 11 and the electrode pad 131 can be easily eliminated.
- the base end portion of the probe 11 may deviate by about 10 ⁇ m to 20 ⁇ m from the center of the electrode pad 131 having an outer diameter of 30 ⁇ m to 40 ⁇ m.
- a spare guide hole having a distance of 10 ⁇ m to 20 ⁇ m from the reference guide hole 150 is prepared, and the guide pin 14 and the spare guide hole are fitted. Thereby, the base end portion of the probe 11 can be brought into contact with the central region of the electrode pad 131.
- the misalignment between the probe 11 and the electrode pad 131 is often increased by repeating the measurement.
- the contact resistance between the probe 11 and the electrode pad 131 increases, and the electrical characteristics of the device under test 20 may not be accurately measured.
- it is preferable that the proximal end portion of the probe 11 is in contact with the central region of the electrode pad 131, particularly in a state where the probe head 12 is first attached to the electrode substrate 13.
- the guide pin 14 and the reference guide hole 150 are first fitted. If there is misalignment between the probe 11 and the electrode pad 131, the direction or distance of the misalignment is confirmed. Then, a preliminary guide hole to be fitted with the guide pin 14 is appropriately selected according to the misalignment state.
- FIG. 3 exemplarily shows a configuration in which the preliminary guide holes are arranged one by one on the upper, lower, left, and right sides of the reference guide hole 150.
- the number of spare guide holes arranged on the upper, lower, left and right sides of the reference guide hole 150 is not limited to one, and a plurality of spare guide holes may be arranged.
- FIG. 7 shows an example in which two preliminary guide holes are arranged on the upper, lower, left, and right sides of the reference guide hole 150.
- backup guide hole is abbreviate
- the preliminary guide holes may be arranged radially, or the number of the preliminary guide holes may be one.
- preliminary guide holes may be arranged concentrically around the reference guide hole 150. Multiple preliminary guide holes may be arranged around the reference guide hole 150.
- the position where the preliminary guide hole is arranged can be arbitrarily set in accordance with the direction in which the misalignment between the probe 11 and the electrode pad 131 is expected. Therefore, for example, the preliminary guide holes may be arranged in a specific direction as viewed from the reference guide hole 150.
- the guide pins 14 are arranged on the probe head 12 and the guide holes are arranged on the electrode substrate 13.
- the guide pins 14 may be arranged on the electrode substrate 13 and the guide holes may be arranged on the probe head 12.
- the electrical connection device of this embodiment can be used in the field of measuring the characteristics of an object to be inspected.
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
図3では、基準ガイド穴150の上下左右に1つずつ予備ガイド穴を配置した構成を例示的に示した。しかし、基準ガイド穴150の上下左右にそれぞれ配置する予備ガイド穴の個数は1個に限られず、複数個の予備ガイド穴を配置してもよい。図7に、基準ガイド穴150の上下左右に2個ずつ予備ガイド穴を配置した例を示す。図7では、予備ガイド穴の符号を省略している。また、予備ガイド穴を放射状に配置してもよいし、予備ガイド穴の個数が1個でもよい。
上記のように本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
Claims (5)
- プローブと、
前記プローブを保持するプローブヘッドと、
前記プローブの基端部に接続させる電極パッドが配置された電極基板と
を備え、
前記プローブヘッドに、前記プローブヘッドと前記電極基板とを位置合わせするためのガイドピンが配置され、
前記電極基板に、前記ガイドピンと対応する複数のガイド穴で構成されるガイド穴群が配置されている
ことを特徴とする電気的接続装置。 - 前記プローブヘッドに複数の前記ガイドピンが配置され、1つの前記ガイドピンに対して前記ガイド穴群が前記電極基板に配置され、
前記ガイド穴群は、設計時の基準位置に配置された基準ガイド穴と前記基準ガイド穴の周囲に配置された予備ガイド穴とで構成されている
ことを特徴とする請求項1に記載の電気的接続装置。 - 前記ガイド穴群の少なくともいずれかと前記ガイドピンを嵌合させた場合に前記プローブの前記基端部が前記電極基板の前記電極パッドと正確に接触するように、前記基準ガイド穴と前記予備ガイド穴との相対位置が設定されていることを特徴とする請求項2に記載の電気的接続装置。
- 1つの前記基準ガイド穴の周囲に複数の前記予備ガイド穴が配置されていることを特徴とする請求項2に記載の電気的接続装置。
- 前記基準位置が設計時の前記ガイドピンの位置に合わせて決定され、
前記基準ガイド穴と前記予備ガイド穴との相対位置が、前記ガイドピン及び前記基準ガイド穴の位置の設計時の位置からの予測されるずれ量を見込んで設定されている
ことを特徴とする請求項2に記載の電気的接続装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020197026674A KR102257278B1 (ko) | 2017-03-24 | 2018-01-22 | 전기적 접속 장치 |
US16/495,263 US11085948B2 (en) | 2017-03-24 | 2018-01-22 | Electric connection device |
CN201880017541.1A CN110392839B (zh) | 2017-03-24 | 2018-01-22 | 电连接装置 |
EP18770366.5A EP3605116A4 (en) | 2017-03-24 | 2018-01-22 | ELECTRICAL CONNECTION DEVICE |
Applications Claiming Priority (2)
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JP2017058503A JP6872943B2 (ja) | 2017-03-24 | 2017-03-24 | 電気的接続装置 |
JP2017-058503 | 2017-03-24 |
Publications (1)
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WO2018173448A1 true WO2018173448A1 (ja) | 2018-09-27 |
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PCT/JP2018/001723 WO2018173448A1 (ja) | 2017-03-24 | 2018-01-22 | 電気的接続装置 |
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US (1) | US11085948B2 (ja) |
EP (1) | EP3605116A4 (ja) |
JP (1) | JP6872943B2 (ja) |
KR (1) | KR102257278B1 (ja) |
CN (1) | CN110392839B (ja) |
TW (1) | TWI665450B (ja) |
WO (1) | WO2018173448A1 (ja) |
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JP2021076486A (ja) * | 2019-11-11 | 2021-05-20 | 株式会社日本マイクロニクス | 電気的接続装置 |
TWI765652B (zh) * | 2021-04-09 | 2022-05-21 | 晶英科技股份有限公司 | 運用半導體製程成形於晶圓基板之電性檢測裝置 |
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2017
- 2017-03-24 JP JP2017058503A patent/JP6872943B2/ja active Active
-
2018
- 2018-01-22 CN CN201880017541.1A patent/CN110392839B/zh active Active
- 2018-01-22 KR KR1020197026674A patent/KR102257278B1/ko active IP Right Grant
- 2018-01-22 EP EP18770366.5A patent/EP3605116A4/en active Pending
- 2018-01-22 WO PCT/JP2018/001723 patent/WO2018173448A1/ja active Application Filing
- 2018-01-22 US US16/495,263 patent/US11085948B2/en active Active
- 2018-01-30 TW TW107103225A patent/TWI665450B/zh active
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JP2018159690A (ja) | 2018-10-11 |
US11085948B2 (en) | 2021-08-10 |
EP3605116A4 (en) | 2021-01-06 |
CN110392839A (zh) | 2019-10-29 |
US20200011897A1 (en) | 2020-01-09 |
TW201835576A (zh) | 2018-10-01 |
KR102257278B1 (ko) | 2021-05-27 |
KR20190113958A (ko) | 2019-10-08 |
TWI665450B (zh) | 2019-07-11 |
EP3605116A1 (en) | 2020-02-05 |
JP6872943B2 (ja) | 2021-05-19 |
CN110392839B (zh) | 2022-02-18 |
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