JP2018130959A - 高周波複合基板及び液晶組成物 - Google Patents
高周波複合基板及び液晶組成物 Download PDFInfo
- Publication number
- JP2018130959A JP2018130959A JP2018022328A JP2018022328A JP2018130959A JP 2018130959 A JP2018130959 A JP 2018130959A JP 2018022328 A JP2018022328 A JP 2018022328A JP 2018022328 A JP2018022328 A JP 2018022328A JP 2018130959 A JP2018130959 A JP 2018130959A
- Authority
- JP
- Japan
- Prior art keywords
- group
- liquid crystal
- crystal polymer
- composite substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 79
- 239000002131 composite material Substances 0.000 title claims abstract description 74
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 24
- 239000000203 mixture Substances 0.000 title claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 135
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 135
- 229910052751 metal Inorganic materials 0.000 claims abstract description 75
- 239000002184 metal Substances 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 41
- 125000003118 aryl group Chemical group 0.000 claims abstract description 34
- 229920000728 polyester Polymers 0.000 claims abstract description 27
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 24
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims abstract description 16
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims abstract description 8
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229940093475 2-ethoxyethanol Drugs 0.000 claims abstract description 8
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 251
- -1 polyparaphenylene terephthalamide Polymers 0.000 claims description 63
- 239000012790 adhesive layer Substances 0.000 claims description 31
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 claims description 24
- 125000003277 amino group Chemical group 0.000 claims description 21
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 10
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 125000000033 alkoxyamino group Chemical group 0.000 claims description 8
- 125000006598 aminocarbonylamino group Chemical group 0.000 claims description 8
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 claims description 8
- 125000005392 carboxamide group Chemical group NC(=O)* 0.000 claims description 8
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 claims description 8
- 125000002349 hydroxyamino group Chemical group [H]ON([H])[*] 0.000 claims description 8
- 125000005462 imide group Chemical group 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 claims description 6
- 239000004760 aramid Substances 0.000 claims description 6
- 229920003235 aromatic polyamide Polymers 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 5
- ICXAPFWGVRTEKV-UHFFFAOYSA-N 2-[4-(1,3-benzoxazol-2-yl)phenyl]-1,3-benzoxazole Chemical compound C1=CC=C2OC(C3=CC=C(C=C3)C=3OC4=CC=CC=C4N=3)=NC2=C1 ICXAPFWGVRTEKV-UHFFFAOYSA-N 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 125000004185 ester group Chemical group 0.000 claims description 5
- 229920006287 phenoxy resin Polymers 0.000 claims description 5
- 239000013034 phenoxy resin Substances 0.000 claims description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 5
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 125000002813 thiocarbonyl group Chemical group *C(*)=S 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 5
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 125000004682 aminothiocarbonyl group Chemical group NC(=S)* 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001841 imino group Chemical group [H]N=* 0.000 description 3
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 0 CC(C)(C)CCN*N Chemical compound CC(C)(C)CCN*N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
- C09K2219/11—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used used in the High Frequency technical field
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Laminated Bodies (AREA)
- Polyesters Or Polycarbonates (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyamides (AREA)
Abstract
Description
110 金属層
120、220、420、620、720、820、920 絶縁層構造
121 液晶ポリマー層
122 高分子層
130 接着層
T11、T21 厚み
Claims (20)
- 金属層と、
前記金属層に接着される少なくとも1つの液晶ポリマー層を含む絶縁層構造と、
を備える高周波複合基板。 - 前記液晶ポリマー層は、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド、γ−ブチロラクトン、ジメチルホルムアミド、2−ブトキシエタノール、又は2−エトキシエタノールに溶解可能な可溶性液晶ポリマーを含む請求項1に記載の高周波複合基板。
- 前記可溶性液晶ポリマーは、芳香族液晶ポリエステルである請求項2に記載の高周波複合基板。
- 前記可溶性液晶ポリマーは、液晶高分子及び芳香性高分子を含み、前記芳香性高分子は、芳香族ポリエステル、芳香族ポリアミド、ポリパラフェニレンテレフタルアミド、ポリ−p−フェニレンベンゾビスオキサゾール、及びp−ヒドロキシ安息香酸と6−ヒドロキシ−2−ナフトエ酸との共重合体からなる群から選ばれる請求項2に記載の高周波複合基板。
- 前記可溶性液晶ポリマーにおける液晶高分子は、下記繰り返し単位構造を有し、
- 前記絶縁層構造は、互いに積み重ねる複数の前記液晶ポリマー層を更に含む請求項1に記載の高周波複合基板。
- 前記絶縁層構造は、接着層を更に含み、前記液晶ポリマー層が前記金属層と前記接着層との間に挟まれる請求項1に記載の高周波複合基板。
- 前記接着層は、エポキシ樹脂、フェノキシ樹脂、アクリル樹脂、ウレタン樹脂、シリコーンゴム樹脂、パリレン系樹脂、液晶ポリマー、ビスマレイミド樹脂、ポリイミド樹脂及びその組み合わせからなる群から選ばれる請求項7に記載の高周波複合基板。
- 金属層と、
高分子層と、
前記高分子層と前記金属層との間に位置する少なくとも1つの液晶ポリマー層と、
を備える高周波複合基板。 - 前記液晶ポリマー層は、下記繰り返し単位を含む可溶性液晶ポリマーを含み、
- 前記可溶性液晶ポリマーは、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド、γ−ブチロラクトン、ジメチルホルムアミド、2−ブトキシエタノール、又は2−エトキシエタノールに溶解することができる請求項9に記載の高周波複合基板。
- 前記可溶性液晶ポリマーは、液晶高分子及び芳香性高分子を含み、前記芳香性高分子は、芳香族ポリエステル、芳香族ポリアミド、ポリパラフェニレンテレフタルアミド、ポリ−p−フェニレンベンゾビスオキサゾール、及びp−ヒドロキシ安息香酸と6−ヒドロキシ−2−ナフトエ酸との共重合体からなる群から選ばれる請求項11に記載の高周波複合基板。
- 前記高分子層は、ポリイミド、ポリテトラフルオロエチレン、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ塩化ビニル、ポリアミド、ポリメチルメタクリレート、ABSプラスチック、フェノール樹脂、エポキシ樹脂、ポリエステル、ポリエチレンテレフタレート、シリコーン、ガラス繊維及びポリウレタンからなる群から選ばれる材料を含む請求項9に記載の高周波複合基板。
- 前記液晶ポリマー層と前記金属層との間に挟まれる接着層を更に含む請求項9に記載の高周波複合基板。
- 前記接着層は、エポキシ樹脂、フェノキシ樹脂、アクリル樹脂、ウレタン樹脂、シリコーンゴム樹脂、パリレン系樹脂、液晶ポリマー、ビスマレイミド樹脂及びポリイミド樹脂からなる群から選ばれる材料を含む請求項14に記載の高周波複合基板。
- 少なくとも2つの金属層と、
前記2つの金属層の間に挟まれる複数の液晶ポリマー層を含む絶縁層構造と、
を備える高周波複合基板。 - 前記液晶ポリマー層は、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド、γ−ブチロラクトン、ジメチルホルムアミド、2−ブトキシエタノール、又は2−エトキシエタノールに溶解可能な可溶性液晶ポリマーを含む請求項16に記載の高周波複合基板。
- 溶媒と、
下記繰り返し単位を有する芳香族液晶ポリエステルと、
を含み、
- 前記溶媒は、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド、γ−ブチロラクトン、ジメチルホルムアミド、2−ブトキシエタノール及び2−エトキシエタノールからなる群から選ばれる請求項17に記載の液晶組成物。
- 前記芳香族液晶ポリエステルの重量パーセントは1wt%〜85wt%であり、且つ前記溶媒の重量パーセントは15wt%〜99wt%である請求項17に記載の液晶組成物。
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106202228 | 2017-02-16 | ||
TW106202228U TWM543170U (zh) | 2017-02-16 | 2017-02-16 | 複合基板及其絕緣層結構 |
TW106202277U TWM543523U (zh) | 2017-02-17 | 2017-02-17 | 電路板 |
TW106202277 | 2017-02-17 | ||
US201762485403P | 2017-04-14 | 2017-04-14 | |
US62/485,403 | 2017-04-14 | ||
TW106123857 | 2017-07-17 | ||
TW106123857A TWI634820B (zh) | 2017-07-17 | 2017-07-17 | 電路板 |
TW106127157 | 2017-08-10 | ||
TW106127157A TWI637849B (zh) | 2017-04-14 | 2017-08-10 | 高頻複合基板及液晶組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018130959A true JP2018130959A (ja) | 2018-08-23 |
JP6713491B2 JP6713491B2 (ja) | 2020-06-24 |
Family
ID=63105009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018022328A Active JP6713491B2 (ja) | 2017-02-16 | 2018-02-09 | 高周波複合基板及び液晶組成物 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10813213B2 (ja) |
JP (1) | JP6713491B2 (ja) |
KR (1) | KR102176155B1 (ja) |
CN (1) | CN108449865B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020082734A (ja) * | 2018-11-16 | 2020-06-04 | 佳勝科技股▲ふん▼有限公司 | 液晶ポリマーフィルムの加工方法及びその装置 |
JP2021008593A (ja) * | 2019-06-28 | 2021-01-28 | 南亞塑膠工業股▲分▼有限公司 | 液晶ポリマーフィルム、液晶ポリマーとポリイミドとの複合フィルム、及びその製造方法 |
JP2021012975A (ja) * | 2019-07-08 | 2021-02-04 | Tdk株式会社 | プリント配線板、多層プリント配線板、およびプリント配線板の製造方法 |
JP2022517051A (ja) * | 2019-12-20 | 2022-03-04 | トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッド | 軟性銅箔積層フィルム、それを含む電子素子、及び該軟性銅箔積層フィルムの製造方法 |
KR20220029342A (ko) * | 2020-09-01 | 2022-03-08 | 아조텍 컴퍼니 리미티드 | 복합기판 및 그 제조방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6991083B2 (ja) * | 2018-03-20 | 2022-01-12 | 住友化学株式会社 | 液晶性ポリエステル液状組成物、液晶ポリエステルフィルムの製造方法及び液晶性ポリエステルフィルム |
CN110876230B (zh) * | 2018-09-03 | 2020-09-15 | 昆山雅森电子材料科技有限公司 | 复合式叠构lcp基板及制备方法 |
CN111393806B (zh) * | 2020-03-10 | 2023-03-17 | 深圳市信维通信股份有限公司 | 液晶聚酯薄膜及其制备方法 |
JP7507502B2 (ja) * | 2022-03-24 | 2024-06-28 | 佳勝科技股▲ふん▼有限公司 | 多層基板 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007070418A (ja) * | 2005-09-06 | 2007-03-22 | Kyocera Chemical Corp | 接着シート、金属箔張積層板及びビルドアップ型多層プリント配線板 |
US20090111949A1 (en) * | 2007-10-25 | 2009-04-30 | Samsung Electronics Co., Ltd. | Liquid crystal polyester resin composition and printed circuit board using the same |
JP2009246200A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Steel Chem Co Ltd | 多層配線回路基板及びその製造方法 |
US20100326696A1 (en) * | 2008-03-11 | 2010-12-30 | Amaresh Mahapatra | Liquid crystal polymer blends for use as metal wire insulation |
WO2011018837A1 (ja) * | 2009-08-11 | 2011-02-17 | 東レ株式会社 | 液晶性ポリエステルおよびその製造方法 |
JP2011032316A (ja) * | 2009-07-30 | 2011-02-17 | Sumitomo Chemical Co Ltd | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
JP2011080170A (ja) * | 2009-10-09 | 2011-04-21 | Sumitomo Chemical Co Ltd | ガラスクロス含浸基材の製造方法およびプリント配線板 |
JP2012033869A (ja) * | 2010-06-28 | 2012-02-16 | Sumitomo Chemical Co Ltd | 積層基材の製造方法、積層基材およびプリント配線板 |
JP2012046742A (ja) * | 2010-07-30 | 2012-03-08 | Sumitomo Chemical Co Ltd | 液晶ポリエステル組成物の製造方法 |
WO2013065453A1 (ja) * | 2011-10-31 | 2013-05-10 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムならびにこれを用いた積層体および回路基板 |
JP2014120580A (ja) * | 2012-12-14 | 2014-06-30 | Mitsubishi Gas Chemical Co Inc | 金属張積層板及びその製造方法並びにプリント配線板 |
WO2014147903A1 (ja) * | 2013-03-22 | 2014-09-25 | 東亞合成株式会社 | 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板 |
WO2015050080A1 (ja) * | 2013-10-03 | 2015-04-09 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法 |
JP2015183159A (ja) * | 2014-03-26 | 2015-10-22 | 上野製薬株式会社 | 液晶ポリエステルブレンド |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590740A (ja) | 1991-04-26 | 1993-04-09 | Nitto Boseki Co Ltd | 導電性回路転写用シート,該転写用シートの製造方法,該転写用シートを利用したプリント配線体及びその製造方法 |
US5719354A (en) | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
JP3208028B2 (ja) | 1994-11-21 | 2001-09-10 | 松下電器産業株式会社 | 液晶表示素子およびその製造方法 |
JPH08328031A (ja) | 1995-06-02 | 1996-12-13 | Sharp Corp | フルカラー液晶表示装置およびその製造方法 |
US5959708A (en) | 1996-06-21 | 1999-09-28 | Hyundai Electronics Industries Co., Ltd. | Liquid crystal display having a conductive high molecular film for preventing the fringe field in the in-plane switching mode |
JP3636290B2 (ja) | 2000-03-27 | 2005-04-06 | 株式会社東芝 | プリント配線基板、及びその製造方法 |
JP2001284801A (ja) | 2000-04-04 | 2001-10-12 | Hitachi Chem Co Ltd | 多層プリント基板の製造方法 |
US6759600B2 (en) | 2001-04-27 | 2004-07-06 | Shinko Electric Industries Co., Ltd. | Multilayer wiring board and method of fabrication thereof |
JP2006282678A (ja) | 2001-05-24 | 2006-10-19 | Toray Ind Inc | フィラー高充填熱可塑性樹脂組成物 |
JP2003011284A (ja) | 2001-07-04 | 2003-01-15 | Mitsui Chemicals Inc | 積層フィルムないしシート、およびその製造方法 |
JP4449975B2 (ja) | 2001-12-25 | 2010-04-14 | 日立化成工業株式会社 | 接続基板、および該接続基板を用いた多層配線板、ならびにこれらの製造方法 |
US6936336B2 (en) | 2002-03-15 | 2005-08-30 | Kyocera Corporation | Transfer sheet and production method of the same and wiring board and production method of the same |
US6994896B2 (en) | 2002-09-16 | 2006-02-07 | World Properties, Inc. | Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
TWI337679B (en) | 2003-02-04 | 2011-02-21 | Sipix Imaging Inc | Novel compositions and assembly process for liquid crystal display |
JP4742580B2 (ja) | 2004-05-28 | 2011-08-10 | 住友化学株式会社 | フィルムおよびそれを用いた積層体 |
US20060134564A1 (en) | 2004-12-20 | 2006-06-22 | Eastman Kodak Company | Reflective display based on liquid crystal materials |
JP5595629B2 (ja) | 2005-12-13 | 2014-09-24 | 東レ株式会社 | 誘電性樹脂組成物およびそれから得られる成形品 |
JP4934334B2 (ja) | 2006-03-20 | 2012-05-16 | 三菱樹脂株式会社 | 両面銅張板 |
JP2008037982A (ja) | 2006-08-04 | 2008-02-21 | Sumitomo Chemical Co Ltd | 液晶ポリエステル組成物およびその用途 |
JP2007235167A (ja) | 2007-05-07 | 2007-09-13 | Tessera Interconnect Materials Inc | 配線回路基板 |
US7911805B2 (en) | 2007-06-29 | 2011-03-22 | Tessera, Inc. | Multilayer wiring element having pin interface |
KR100939550B1 (ko) | 2007-12-27 | 2010-01-29 | 엘지전자 주식회사 | 연성 필름 |
KR101625421B1 (ko) | 2008-12-26 | 2016-05-30 | 후지필름 가부시키가이샤 | 표면 금속막 재료, 표면 금속막 재료의 제작 방법, 금속 패턴 재료의 제작 방법, 및 금속 패턴 재료 |
JP5141568B2 (ja) | 2009-01-20 | 2013-02-13 | 住友化学株式会社 | 液晶ポリマー組成物及びそれを用いてなる成形体 |
CN102342186A (zh) | 2009-03-09 | 2012-02-01 | 株式会社村田制作所 | 柔性基板 |
US20110147668A1 (en) | 2009-12-23 | 2011-06-23 | Sang Hwa Kim | Conductive polymer composition and conductive film prepared using the same |
JP5717961B2 (ja) | 2009-12-24 | 2015-05-13 | 日本メクトロン株式会社 | フレキシブル回路基板の製造方法 |
JP5399995B2 (ja) | 2010-03-15 | 2014-01-29 | パナソニック株式会社 | 多層プリント配線板及び多層金属張積層板 |
EP2560033A4 (en) | 2010-04-15 | 2015-10-28 | Asahi Glass Co Ltd | PROCESS FOR PRODUCING LIQUID CRYSTAL ELEMENT AND LIQUID CRYSTAL ELEMENT |
JP5708227B2 (ja) | 2011-05-16 | 2015-04-30 | Jsr株式会社 | カラーフィルタ、液晶表示素子およびカラーフィルタの製造方法 |
JP5786451B2 (ja) | 2011-05-19 | 2015-09-30 | Jsr株式会社 | カラーフィルタ、液晶表示素子およびカラーフィルタの製造方法 |
KR101319677B1 (ko) | 2011-10-28 | 2013-10-17 | 삼성전기주식회사 | 인쇄 회로 기판용 절연성 수지 조성물 및 이를 포함하는 인쇄 회로 기판 |
KR101773204B1 (ko) | 2011-10-31 | 2017-09-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 대전방지 특성을 갖는 전방향족 액정 폴리에스테르 수지 컴파운드 및 물품 |
WO2013074476A1 (en) | 2011-11-15 | 2013-05-23 | Ticona Llc | Low naphthenic liquid crystalline polymer composition |
TWI437931B (zh) | 2011-12-16 | 2014-05-11 | Prologium Technology Co Ltd | 電路板結構 |
US9145469B2 (en) * | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
KR102338614B1 (ko) | 2014-06-30 | 2021-12-13 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 방향족 폴리에스테르 함유 경화성 수지 조성물, 경화물, 전기·전자 부품 및 회로 기판 |
JP6405817B2 (ja) | 2014-09-16 | 2018-10-17 | 株式会社村田製作所 | 電子回路基板用積層体および電子回路基板 |
TW201706689A (zh) | 2015-08-12 | 2017-02-16 | 佳勝科技股份有限公司 | 軟板結構及其製作方法 |
WO2018056294A1 (ja) | 2016-09-26 | 2018-03-29 | 東レ株式会社 | 液晶性ポリエステル樹脂組成物、成形品および成形品の製造方法 |
CN110088166B (zh) | 2016-12-01 | 2021-06-08 | Jxtg能源株式会社 | 全芳香族液晶聚酯树脂 |
-
2017
- 2017-10-31 US US15/800,051 patent/US10813213B2/en active Active
-
2018
- 2018-01-11 KR KR1020180003664A patent/KR102176155B1/ko active IP Right Grant
- 2018-01-11 CN CN201810026990.4A patent/CN108449865B/zh active Active
- 2018-02-09 JP JP2018022328A patent/JP6713491B2/ja active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007070418A (ja) * | 2005-09-06 | 2007-03-22 | Kyocera Chemical Corp | 接着シート、金属箔張積層板及びビルドアップ型多層プリント配線板 |
US20090111949A1 (en) * | 2007-10-25 | 2009-04-30 | Samsung Electronics Co., Ltd. | Liquid crystal polyester resin composition and printed circuit board using the same |
US20100326696A1 (en) * | 2008-03-11 | 2010-12-30 | Amaresh Mahapatra | Liquid crystal polymer blends for use as metal wire insulation |
JP2009246200A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Steel Chem Co Ltd | 多層配線回路基板及びその製造方法 |
JP2011032316A (ja) * | 2009-07-30 | 2011-02-17 | Sumitomo Chemical Co Ltd | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
WO2011018837A1 (ja) * | 2009-08-11 | 2011-02-17 | 東レ株式会社 | 液晶性ポリエステルおよびその製造方法 |
JP2011080170A (ja) * | 2009-10-09 | 2011-04-21 | Sumitomo Chemical Co Ltd | ガラスクロス含浸基材の製造方法およびプリント配線板 |
JP2012033869A (ja) * | 2010-06-28 | 2012-02-16 | Sumitomo Chemical Co Ltd | 積層基材の製造方法、積層基材およびプリント配線板 |
JP2012046742A (ja) * | 2010-07-30 | 2012-03-08 | Sumitomo Chemical Co Ltd | 液晶ポリエステル組成物の製造方法 |
WO2013065453A1 (ja) * | 2011-10-31 | 2013-05-10 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムならびにこれを用いた積層体および回路基板 |
JP2014120580A (ja) * | 2012-12-14 | 2014-06-30 | Mitsubishi Gas Chemical Co Inc | 金属張積層板及びその製造方法並びにプリント配線板 |
WO2014147903A1 (ja) * | 2013-03-22 | 2014-09-25 | 東亞合成株式会社 | 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板 |
WO2015050080A1 (ja) * | 2013-10-03 | 2015-04-09 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法 |
JP2015183159A (ja) * | 2014-03-26 | 2015-10-22 | 上野製薬株式会社 | 液晶ポリエステルブレンド |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020082734A (ja) * | 2018-11-16 | 2020-06-04 | 佳勝科技股▲ふん▼有限公司 | 液晶ポリマーフィルムの加工方法及びその装置 |
US11597806B2 (en) | 2018-11-16 | 2023-03-07 | Azotek Co., Ltd. | Method of processing liquid crystal polymer film and device of processing liquid crystal polymer |
US11649332B2 (en) | 2018-11-16 | 2023-05-16 | Azotek Co., Ltd. | Method of processing liquid crystal polymer film |
JP2021008593A (ja) * | 2019-06-28 | 2021-01-28 | 南亞塑膠工業股▲分▼有限公司 | 液晶ポリマーフィルム、液晶ポリマーとポリイミドとの複合フィルム、及びその製造方法 |
JP2021012975A (ja) * | 2019-07-08 | 2021-02-04 | Tdk株式会社 | プリント配線板、多層プリント配線板、およびプリント配線板の製造方法 |
JP7238648B2 (ja) | 2019-07-08 | 2023-03-14 | Tdk株式会社 | プリント配線板、多層プリント配線板、およびプリント配線板の製造方法 |
JP2022517051A (ja) * | 2019-12-20 | 2022-03-04 | トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッド | 軟性銅箔積層フィルム、それを含む電子素子、及び該軟性銅箔積層フィルムの製造方法 |
JP7208352B2 (ja) | 2019-12-20 | 2023-01-18 | トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッド | 軟性銅箔積層フィルム、それを含む電子素子、及び該軟性銅箔積層フィルムの製造方法 |
KR20220029342A (ko) * | 2020-09-01 | 2022-03-08 | 아조텍 컴퍼니 리미티드 | 복합기판 및 그 제조방법 |
JP2022041804A (ja) * | 2020-09-01 | 2022-03-11 | 佳勝科技股▲ふん▼有限公司 | 複合基板及びその製造方法 |
JP7120508B2 (ja) | 2020-09-01 | 2022-08-17 | 佳勝科技股▲ふん▼有限公司 | 複合基板及びその製造方法 |
KR102612937B1 (ko) * | 2020-09-01 | 2023-12-13 | 아조텍 컴퍼니 리미티드 | 복합기판 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR102176155B1 (ko) | 2020-11-10 |
CN108449865A (zh) | 2018-08-24 |
CN108449865B (zh) | 2020-10-20 |
KR20180113152A (ko) | 2018-10-15 |
US10813213B2 (en) | 2020-10-20 |
JP6713491B2 (ja) | 2020-06-24 |
US20180235072A1 (en) | 2018-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6713491B2 (ja) | 高周波複合基板及び液晶組成物 | |
KR100713333B1 (ko) | 다층 이방성 도전 필름 | |
TWI244497B (en) | Anisotropic conductive adhering film | |
KR101139749B1 (ko) | 접착제 및 접합체 | |
JP5196703B2 (ja) | 接着フィルム | |
CN105917529B (zh) | 连接体、连接体的制造方法、连接方法、各向异性导电粘接剂 | |
US20150287495A1 (en) | Composite substrate | |
JP2009242508A (ja) | 接着剤及び接合体 | |
WO2019188372A1 (ja) | 導電材料、及び接続体の製造方法 | |
CN108449866B (zh) | 电路板 | |
TWI634820B (zh) | 電路板 | |
JPH07157720A (ja) | 異方導電フィルム | |
TWI637849B (zh) | 高頻複合基板及液晶組成物 | |
KR100671138B1 (ko) | 다층구조 이방 전도성 필름 및 이를 이용한 디스플레이 소자 | |
CN103374204A (zh) | 环氧树脂复合材料、胶片及电路基板 | |
TWI670312B (zh) | 電路板結構以及用於形成絕緣基板的組成物 | |
KR20110131018A (ko) | 이방성 도전 필름용 도전 입자 및 이를 포함하는 이방성 도전 필름 | |
TW201537584A (zh) | 導電性粒子、導電性接著劑、接合體之製造方法、電子零件之連接方法、及接合體 | |
TWM543170U (zh) | 複合基板及其絕緣層結構 | |
KR101117768B1 (ko) | 이방성 도전필름 | |
CN103374202A (zh) | 环氧树脂复合材料、胶片及电路基板 | |
KR20110059274A (ko) | 이방성 도전접속용 절연 도전성 입자 및 이를 이용한 이방성 도전접속재료 | |
JP2003109436A (ja) | 異方導電フィルム | |
TW202002395A (zh) | 電子裝置及其多頻段柔性電路板天線結構 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180209 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190115 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190415 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190614 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20190614 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200203 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200519 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200603 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6713491 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |