JP2018130951A5 - - Google Patents

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Publication number
JP2018130951A5
JP2018130951A5 JP2017219330A JP2017219330A JP2018130951A5 JP 2018130951 A5 JP2018130951 A5 JP 2018130951A5 JP 2017219330 A JP2017219330 A JP 2017219330A JP 2017219330 A JP2017219330 A JP 2017219330A JP 2018130951 A5 JP2018130951 A5 JP 2018130951A5
Authority
JP
Japan
Prior art keywords
liquid discharge
wiring structure
forming
substrate
discharge element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017219330A
Other languages
English (en)
Japanese (ja)
Other versions
JP7037334B2 (ja
JP2018130951A (ja
Filing date
Publication date
Application filed filed Critical
Priority to CN201880011541.0A priority Critical patent/CN110290927B/zh
Priority to EP18753582.8A priority patent/EP3582972B1/en
Priority to PCT/JP2018/002188 priority patent/WO2018150830A1/en
Priority to US16/342,097 priority patent/US10899129B2/en
Publication of JP2018130951A publication Critical patent/JP2018130951A/ja
Priority to US17/100,260 priority patent/US11465417B2/en
Publication of JP2018130951A5 publication Critical patent/JP2018130951A5/ja
Priority to JP2022033787A priority patent/JP7223185B2/ja
Application granted granted Critical
Publication of JP7037334B2 publication Critical patent/JP7037334B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017219330A 2017-02-17 2017-11-14 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 Active JP7037334B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201880011541.0A CN110290927B (zh) 2017-02-17 2018-01-25 排液头基板、制造排液头基板的方法、排液头和排液设备
EP18753582.8A EP3582972B1 (en) 2017-02-17 2018-01-25 Method of manufacturing a liquid discharge head
PCT/JP2018/002188 WO2018150830A1 (en) 2017-02-17 2018-01-25 Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus
US16/342,097 US10899129B2 (en) 2017-02-17 2018-01-25 Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus
US17/100,260 US11465417B2 (en) 2017-02-17 2020-11-20 Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus
JP2022033787A JP7223185B2 (ja) 2017-02-17 2022-03-04 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017028421 2017-02-17
JP2017028421 2017-02-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022033787A Division JP7223185B2 (ja) 2017-02-17 2022-03-04 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置

Publications (3)

Publication Number Publication Date
JP2018130951A JP2018130951A (ja) 2018-08-23
JP2018130951A5 true JP2018130951A5 (enExample) 2021-01-07
JP7037334B2 JP7037334B2 (ja) 2022-03-16

Family

ID=63249385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017219330A Active JP7037334B2 (ja) 2017-02-17 2017-11-14 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置

Country Status (4)

Country Link
US (2) US10899129B2 (enExample)
EP (1) EP3582972B1 (enExample)
JP (1) JP7037334B2 (enExample)
CN (1) CN110290927B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7163134B2 (ja) * 2018-10-18 2022-10-31 キヤノン株式会社 液体吐出ヘッド、液体吐出ヘッドの製造方法および液体吐出装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3618965B2 (ja) * 1997-06-19 2005-02-09 キヤノン株式会社 液体噴射記録ヘッド用基板およびその製造方法ならびに液体噴射記録装置
US6123410A (en) * 1997-10-28 2000-09-26 Hewlett-Packard Company Scalable wide-array inkjet printhead and method for fabricating same
JP2001341316A (ja) 2000-06-02 2001-12-11 Sony Corp インクジェットヘッド及びその製造方法
US6905196B2 (en) 2002-05-08 2005-06-14 Xerox Corporation Polysilicon feed-through fluid drop ejector
JP4483738B2 (ja) 2005-08-19 2010-06-16 セイコーエプソン株式会社 デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置
JP4933114B2 (ja) 2006-02-28 2012-05-16 富士フイルム株式会社 液体吐出ヘッドの製造方法
US7926909B2 (en) * 2007-01-09 2011-04-19 Canon Kabushiki Kaisha Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device
JP2010260188A (ja) 2009-04-30 2010-11-18 Brother Ind Ltd 液滴吐出ヘッド
JP6160119B2 (ja) * 2013-02-26 2017-07-12 セイコーエプソン株式会社 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置
JP6335436B2 (ja) 2013-04-26 2018-05-30 キヤノン株式会社 液体吐出ヘッドの製造方法
DE112013007584T5 (de) 2013-11-27 2016-08-18 Hewlett-Packard Development Company, L.P. Druckkopf mit von einer Abtrennung umgebenes Bondpad
JP6330819B2 (ja) * 2013-11-29 2018-05-30 コニカミノルタ株式会社 配線基板及びインクジェットヘッド
JP6289234B2 (ja) 2014-04-15 2018-03-07 キヤノン株式会社 記録素子基板及び液体吐出装置
JP6345006B2 (ja) * 2014-07-08 2018-06-20 キヤノン株式会社 インクジェット記録ヘッド用基板の製造方法
JP6598658B2 (ja) 2015-01-27 2019-10-30 キヤノン株式会社 液体吐出ヘッドの素子基板及び液体吐出ヘッド
US10035346B2 (en) 2015-01-27 2018-07-31 Canon Kabushiki Kaisha Element substrate and liquid ejection head
JP6604035B2 (ja) * 2015-05-27 2019-11-13 ブラザー工業株式会社 液体吐出装置、及び液体吐出装置の製造方法
JP6613717B2 (ja) 2015-08-25 2019-12-04 セイコーエプソン株式会社 電子デバイス、液体噴射ヘッド、および、電子デバイスの製造方法

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