JP2018130951A5 - - Google Patents
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- Publication number
- JP2018130951A5 JP2018130951A5 JP2017219330A JP2017219330A JP2018130951A5 JP 2018130951 A5 JP2018130951 A5 JP 2018130951A5 JP 2017219330 A JP2017219330 A JP 2017219330A JP 2017219330 A JP2017219330 A JP 2017219330A JP 2018130951 A5 JP2018130951 A5 JP 2018130951A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid discharge
- wiring structure
- forming
- substrate
- discharge element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims 59
- 239000000758 substrate Substances 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 21
- 239000010410 layer Substances 0.000 claims 19
- 230000001681 protective effect Effects 0.000 claims 12
- 239000000463 material Substances 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 5
- 230000020169 heat generation Effects 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201880011541.0A CN110290927B (zh) | 2017-02-17 | 2018-01-25 | 排液头基板、制造排液头基板的方法、排液头和排液设备 |
| EP18753582.8A EP3582972B1 (en) | 2017-02-17 | 2018-01-25 | Method of manufacturing a liquid discharge head |
| PCT/JP2018/002188 WO2018150830A1 (en) | 2017-02-17 | 2018-01-25 | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
| US16/342,097 US10899129B2 (en) | 2017-02-17 | 2018-01-25 | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
| US17/100,260 US11465417B2 (en) | 2017-02-17 | 2020-11-20 | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
| JP2022033787A JP7223185B2 (ja) | 2017-02-17 | 2022-03-04 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017028421 | 2017-02-17 | ||
| JP2017028421 | 2017-02-17 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022033787A Division JP7223185B2 (ja) | 2017-02-17 | 2022-03-04 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018130951A JP2018130951A (ja) | 2018-08-23 |
| JP2018130951A5 true JP2018130951A5 (enExample) | 2021-01-07 |
| JP7037334B2 JP7037334B2 (ja) | 2022-03-16 |
Family
ID=63249385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017219330A Active JP7037334B2 (ja) | 2017-02-17 | 2017-11-14 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US10899129B2 (enExample) |
| EP (1) | EP3582972B1 (enExample) |
| JP (1) | JP7037334B2 (enExample) |
| CN (1) | CN110290927B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7163134B2 (ja) * | 2018-10-18 | 2022-10-31 | キヤノン株式会社 | 液体吐出ヘッド、液体吐出ヘッドの製造方法および液体吐出装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3618965B2 (ja) * | 1997-06-19 | 2005-02-09 | キヤノン株式会社 | 液体噴射記録ヘッド用基板およびその製造方法ならびに液体噴射記録装置 |
| US6123410A (en) * | 1997-10-28 | 2000-09-26 | Hewlett-Packard Company | Scalable wide-array inkjet printhead and method for fabricating same |
| JP2001341316A (ja) | 2000-06-02 | 2001-12-11 | Sony Corp | インクジェットヘッド及びその製造方法 |
| US6905196B2 (en) | 2002-05-08 | 2005-06-14 | Xerox Corporation | Polysilicon feed-through fluid drop ejector |
| JP4483738B2 (ja) | 2005-08-19 | 2010-06-16 | セイコーエプソン株式会社 | デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置 |
| JP4933114B2 (ja) | 2006-02-28 | 2012-05-16 | 富士フイルム株式会社 | 液体吐出ヘッドの製造方法 |
| US7926909B2 (en) * | 2007-01-09 | 2011-04-19 | Canon Kabushiki Kaisha | Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device |
| JP2010260188A (ja) | 2009-04-30 | 2010-11-18 | Brother Ind Ltd | 液滴吐出ヘッド |
| JP6160119B2 (ja) * | 2013-02-26 | 2017-07-12 | セイコーエプソン株式会社 | 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
| JP6335436B2 (ja) | 2013-04-26 | 2018-05-30 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| DE112013007584T5 (de) | 2013-11-27 | 2016-08-18 | Hewlett-Packard Development Company, L.P. | Druckkopf mit von einer Abtrennung umgebenes Bondpad |
| JP6330819B2 (ja) * | 2013-11-29 | 2018-05-30 | コニカミノルタ株式会社 | 配線基板及びインクジェットヘッド |
| JP6289234B2 (ja) | 2014-04-15 | 2018-03-07 | キヤノン株式会社 | 記録素子基板及び液体吐出装置 |
| JP6345006B2 (ja) * | 2014-07-08 | 2018-06-20 | キヤノン株式会社 | インクジェット記録ヘッド用基板の製造方法 |
| JP6598658B2 (ja) | 2015-01-27 | 2019-10-30 | キヤノン株式会社 | 液体吐出ヘッドの素子基板及び液体吐出ヘッド |
| US10035346B2 (en) | 2015-01-27 | 2018-07-31 | Canon Kabushiki Kaisha | Element substrate and liquid ejection head |
| JP6604035B2 (ja) * | 2015-05-27 | 2019-11-13 | ブラザー工業株式会社 | 液体吐出装置、及び液体吐出装置の製造方法 |
| JP6613717B2 (ja) | 2015-08-25 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体噴射ヘッド、および、電子デバイスの製造方法 |
-
2017
- 2017-11-14 JP JP2017219330A patent/JP7037334B2/ja active Active
-
2018
- 2018-01-25 US US16/342,097 patent/US10899129B2/en active Active
- 2018-01-25 EP EP18753582.8A patent/EP3582972B1/en active Active
- 2018-01-25 CN CN201880011541.0A patent/CN110290927B/zh active Active
-
2020
- 2020-11-20 US US17/100,260 patent/US11465417B2/en active Active
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