JP4933114B2 - 液体吐出ヘッドの製造方法 - Google Patents
液体吐出ヘッドの製造方法 Download PDFInfo
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- JP4933114B2 JP4933114B2 JP2006053947A JP2006053947A JP4933114B2 JP 4933114 B2 JP4933114 B2 JP 4933114B2 JP 2006053947 A JP2006053947 A JP 2006053947A JP 2006053947 A JP2006053947 A JP 2006053947A JP 4933114 B2 JP4933114 B2 JP 4933114B2
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- multilayer wiring
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Images
Classifications
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
また、共通液室が多層配線基板により形成されているため、配線の多層化による高密度化、ヘッドを大型化することなく配線を形成することが可能であり、気密性が高く信頼性の高いヘッドを構成することができる。
また、電気配線が内部に形成されているため、ショート等の問題や断線等に対する信頼性が向上する。
また、違う層に形成された配線の接続部を露出させることができ、高密度で確実な接続が可能となる。
また、剛性が高くより気密性の高いセラミックス多層配線基板を用いることにより、ヘッドを安定保持可能であり、形状安定性の向上、気密性の向上をより一層図ることができる。
Claims (5)
- 電気配線が形成されている凹形状の構造を有する多層配線基板と、電気回路を搭載した平板状の部材と、圧電素子を含む液体吐出部と、により構成され、前記電気配線は前記多層配線基板内部に形成されており、前記凹形状の構造が共通液室の壁面の少なくとも一部を画成する液体吐出ヘッドの製造が、
前記凹形状の構造を有する多層配線基板と前記液体吐出部とを機械的に接合する工程と、
前記凹形状の構造を有する多層配線基板の電気配線と前記液体吐出部における電気配線とを電気的に接続する工程と、
前記凹形状の構造を有する多層配線基板と前記電気回路を搭載した平板状の部材とを機械的、電気的に接合する工程と、
を有することを特徴とする液体吐出ヘッドの製造方法。 - 少なくとも電気配線が形成されている凹形状の構造を有する多層配線基板と、圧電素子を含む液体吐出部と、からなり、前記電気配線は前記多層配線基板内部に形成されており、前記凹形状の構造が共通液室の壁面の少なくとも一部を画成する液体吐出ヘッドで、前記凹形状の構造を有する多層配線基板と前記液体吐出部とにより形成される電気接続穴の容積が均一でないものについて、
前記凹形状の構造を有する多層配線基板と前記液体吐出部とを機械的に接合する工程と、
前記凹形状の構造を有する多層配線基板と前記液体吐出部とにより形成される電気接続穴に導電性ペーストを注入する工程と、
により、前記凹形状の構造を有する多層配線基板における電気配線と前記液体吐出部における電気配線とを電気的に接続することを特徴とする液体吐出ヘッドの製造方法。 - 前記凹形状の構造を有する多層配線基板における電気配線と、前記液体吐出部における電気配線との電気的接続が、
機械的に接合された前記凹形状の構造を有する多層配線基板と前記液体吐出部とにより形成される電気接続穴に導電性ペーストを注入する工程と、
機械的に接合された前記凹形状の構造を有する多層配線基板と前記液体吐出部とを真空チャンバー内に入れる工程と、
前記真空チャンバー内を減圧にする工程と、
前記減圧にした真空チャンバー内を大気圧に戻す工程と、
により、おこなわれることを特徴とする請求項1又は2に記載の液体吐出ヘッドの製造方法。 - 前記凹形状の構造を有する多層配線基板と前記電気回路を搭載した平板状の部材とを機械的、電気的に接合する工程は、
前記凹形状の構造を有する多層配線基板の電気配線端面と、前記平面状の部材の前記電気回路に接続された電気配線端面との間に、異方性導電フィルム(ACF)、異方性導電ペースト(ACP)、又はノンコンダクティブペースト(NCP)を挿入あるいは塗布し、
熱圧着により行うことを特徴とする請求項1に記載の液体吐出ヘッドの製造方法。 - 前記凹形状の構造を有する多層配線基板が、セラミックス多層配線基板からなることを特徴とする請求項1〜4のいずれかに記載の液体吐出ヘッドの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006053947A JP4933114B2 (ja) | 2006-02-28 | 2006-02-28 | 液体吐出ヘッドの製造方法 |
US11/711,041 US20070211108A1 (en) | 2006-02-28 | 2007-02-27 | Liquid ejection head and image forming apparatus including liquid ejection head |
US13/193,174 US8579418B2 (en) | 2006-02-28 | 2011-07-28 | Liquid ejection head and image forming apparatus including liquid ejection head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006053947A JP4933114B2 (ja) | 2006-02-28 | 2006-02-28 | 液体吐出ヘッドの製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007230060A JP2007230060A (ja) | 2007-09-13 |
JP4933114B2 true JP4933114B2 (ja) | 2012-05-16 |
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Application Number | Title | Priority Date | Filing Date |
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JP2006053947A Expired - Fee Related JP4933114B2 (ja) | 2006-02-28 | 2006-02-28 | 液体吐出ヘッドの製造方法 |
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JP (1) | JP4933114B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070296767A1 (en) * | 2006-06-27 | 2007-12-27 | Anderson Frank E | Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embedded Conductive Material |
KR100962040B1 (ko) * | 2008-04-07 | 2010-06-08 | 삼성전기주식회사 | 잉크젯 헤드 및 그 제조방법 |
JP2012532772A (ja) | 2009-07-10 | 2012-12-20 | フジフィルム ディマティックス, インコーポレイテッド | 高密度実装のためのmemsジェット射出構造 |
US9046426B1 (en) * | 2012-06-15 | 2015-06-02 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Modular apparatus and method for attaching multiple devices |
JP2015174386A (ja) * | 2014-03-17 | 2015-10-05 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
JP6613580B2 (ja) | 2015-03-10 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体噴射ヘッド、及び、液体噴射装置 |
WO2018150830A1 (en) * | 2017-02-17 | 2018-08-23 | Canon Kabushiki Kaisha | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
JP7037334B2 (ja) * | 2017-02-17 | 2022-03-16 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
US10654269B2 (en) * | 2017-06-28 | 2020-05-19 | Canon Kabushiki Kaisha | Liquid ejection head |
JP6481740B2 (ja) * | 2017-10-31 | 2019-03-13 | ブラザー工業株式会社 | 液体吐出装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3346689A (en) * | 1965-01-29 | 1967-10-10 | Philco Ford Corp | Multilayer circuit board suing epoxy cards and silver epoxy connectors |
JPH11126968A (ja) * | 1997-10-22 | 1999-05-11 | Hitachi Chem Co Ltd | 多層プリント配線板の製造法 |
JPH11291493A (ja) * | 1998-04-06 | 1999-10-26 | Seiko Epson Corp | インクジェット式記録ヘッド |
US6631981B2 (en) * | 2000-07-06 | 2003-10-14 | Brother Kogyo Kabushiki Kaisha | Piezoelectric actuator of ink jet printer head |
JP2002264335A (ja) * | 2001-03-09 | 2002-09-18 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
US6431683B1 (en) * | 2001-03-20 | 2002-08-13 | Hewlett-Packard Company | Hybrid carrier for wide-array inkjet printhead assembly |
JP2003159800A (ja) * | 2001-09-13 | 2003-06-03 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2003182076A (ja) | 2001-12-21 | 2003-07-03 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2005259845A (ja) * | 2004-03-10 | 2005-09-22 | Sharp Corp | 導電性ペーストによるビア充填方法 |
JP2005254616A (ja) | 2004-03-11 | 2005-09-22 | Seiko Epson Corp | 液体噴射ヘッドおよびこれを備えた液体噴射装置 |
JP4586427B2 (ja) * | 2004-06-10 | 2010-11-24 | 富士ゼロックス株式会社 | インクジェット記録ヘッド |
US7448732B2 (en) * | 2004-09-30 | 2008-11-11 | Fujifilm Corporation | Liquid ejection head and manufacturing method thereof |
US7524024B2 (en) * | 2005-03-15 | 2009-04-28 | Fuji Xerox Co., Ltd. | Electrical connection substrate, droplet discharge head, and droplet discharge apparatus |
-
2006
- 2006-02-28 JP JP2006053947A patent/JP4933114B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-27 US US11/711,041 patent/US20070211108A1/en not_active Abandoned
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2011
- 2011-07-28 US US13/193,174 patent/US8579418B2/en not_active Expired - Fee Related
Also Published As
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US20110277319A1 (en) | 2011-11-17 |
JP2007230060A (ja) | 2007-09-13 |
US8579418B2 (en) | 2013-11-12 |
US20070211108A1 (en) | 2007-09-13 |
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