JP2007230060A - 液体吐出ヘッド及びこれを備えた画像形成装置 - Google Patents
液体吐出ヘッド及びこれを備えた画像形成装置 Download PDFInfo
- Publication number
- JP2007230060A JP2007230060A JP2006053947A JP2006053947A JP2007230060A JP 2007230060 A JP2007230060 A JP 2007230060A JP 2006053947 A JP2006053947 A JP 2006053947A JP 2006053947 A JP2006053947 A JP 2006053947A JP 2007230060 A JP2007230060 A JP 2007230060A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer wiring
- liquid discharge
- concave structure
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 163
- 238000007599 discharging Methods 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 26
- 239000000919 ceramic Substances 0.000 claims description 52
- 238000009429 electrical wiring Methods 0.000 claims description 37
- 238000005304 joining Methods 0.000 claims description 11
- 239000000976 ink Substances 0.000 description 120
- 239000000758 substrate Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 27
- 238000007639 printing Methods 0.000 description 27
- 238000004140 cleaning Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 12
- 238000004891 communication Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000003086 colorant Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000001041 dye based ink Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【解決手段】 ノズルから液体を吐出する液体吐出ヘッドであって、前記ノズルに連通する圧力室と、前記圧力室の前記ノズルとは反対側に設けられた前記圧力室に連通する共通液室とを備え、前記共通液室を形成する部材が凹形状の構造を有し、前記凹形状の部材の囲む縁の上面に接続電極が設けられた多層配線基板であることを特徴とする液体吐出ヘッドを提供することにより、上記課題を解決する。
【選択図】 図3
Description
Claims (10)
- ノズルから液体を吐出する液体吐出ヘッドであって、
前記ノズルに連通する圧力室と、
前記圧力室の前記ノズルとは反対側に設けられた前記圧力室に連通する共通液室とを備え、
前記共通液室を形成する部材が凹形状の構造を有し、前記凹形状の部材の囲む縁の上面に接続電極が設けられた多層配線基板であることを特徴とする液体吐出ヘッド。 - 電気配線が全て前記凹形状の構造を有する多層配線基板の内部に形成されていることを特徴とする請求項1に記載の液体吐出ヘッド。
- 前記凹形状の多層配線基板に、容積の異なる電気接続用の孔が複数設けられたことを特徴とする請求項1又は2に記載の液体吐出ヘッド。
- 前記凹形状の構造を有する多層配線基板が、セラミックス多層配線基板であることを特徴とする請求項1から3のいずれかに記載の液体吐出ヘッド。
- 電気配線が形成されている凹形状の構造を有する多層配線基板と、電気回路を搭載した平板状の部材と、圧電素子を含む液体吐出部により構成される液体吐出ヘッドの製造が、
前記凹形状の構造を有する多層配線基板と前記液体吐出部とを機械的に接合する工程と、
前記凹形状の構造を有する多層配線基板の電気配線と前記液体吐出部における電気配線とを電気的に接続する工程と、
前記凹形状の構造を有する多層配線基板と前記電気回路を搭載した平板状の部材とを機械的、電気的に接合する工程と、
を有することを特徴とする液体吐出ヘッドの製造方法。 - 少なくとも電気配線が形成されている凹形状の構造を有する多層配線基板と、圧電素子を含む液体吐出部からなる液体吐出ヘッドで、前記凹形状の構造を有する多層配線基板と前記液体吐出部とにより形成される電気接続穴の容積が均一でないものについて、
前記凹形状の構造を有する多層配線基板と前記液体吐出部とを機械的に接合する工程と、
前記凹形状の構造を有する多層配線基板と前記液体吐出部とにより形成される電気接続穴に導電性ペーストを注入する工程と、
により、前記凹形状の構造を有する多層配線基板における電気配線と前記液体吐出部における電気配線とを電気的に接続することを特徴とする液体吐出ヘッドの製造方法。 - 前記凹形状の構造を有する多層配線基板における電気配線と、前記液体吐出部における電気配線との電気的接続が、
機械的に接合された前記凹形状の構造を有する多層配線基板と前記液体吐出部とにより形成される電気接続穴に導電性ペーストを注入する工程と、
機械的に接合された前記凹形状の構造を有する多層配線基板と前記液体吐出部とを真空チャンバー内に入れる工程と、
前記真空チャンバー内を減圧にする工程と、
前記減圧にした真空チャンバー内を大気圧に戻す工程と、
により、おこなわれることを特徴とする請求項5又は6に記載の液体吐出ヘッドの製造方法。 - 共通液室が少なくとも電気配線を有し、凹形状の構造を有する多層配線基板と、電気配線を有する平板状の部材により構成される液体吐出ヘッドの製造が、
前記凹形状の構造を有する多層配線基板の電気配線端面と、前記平面状部材の電気配線端面との間に、異方性導電フィルム(ACF)、異方性導電ペースト(ACP)、又はノンコンダクティブペースト(NCP)を挿入あるいは塗布し、
熱圧着を行うことを特徴とする液体吐出ヘッドの製造方法。 - 前記凹形状の構造を有する多層配線基板が、セラミックス多層配線基板からなることを特徴とする請求項5〜8のいずれかに記載の液体吐出ヘッドの製造方法。
- 請求項1〜4のいずれかに記載の液体吐出ヘッドを備えたことを特徴とする画像形成装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006053947A JP4933114B2 (ja) | 2006-02-28 | 2006-02-28 | 液体吐出ヘッドの製造方法 |
US11/711,041 US20070211108A1 (en) | 2006-02-28 | 2007-02-27 | Liquid ejection head and image forming apparatus including liquid ejection head |
US13/193,174 US8579418B2 (en) | 2006-02-28 | 2011-07-28 | Liquid ejection head and image forming apparatus including liquid ejection head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006053947A JP4933114B2 (ja) | 2006-02-28 | 2006-02-28 | 液体吐出ヘッドの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007230060A true JP2007230060A (ja) | 2007-09-13 |
JP4933114B2 JP4933114B2 (ja) | 2012-05-16 |
Family
ID=38478496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006053947A Expired - Fee Related JP4933114B2 (ja) | 2006-02-28 | 2006-02-28 | 液体吐出ヘッドの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US20070211108A1 (ja) |
JP (1) | JP4933114B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009248568A (ja) * | 2008-04-07 | 2009-10-29 | Samsung Electro Mech Co Ltd | インクジェットヘッド及びその製造方法 |
JP2018030374A (ja) * | 2017-10-31 | 2018-03-01 | ブラザー工業株式会社 | 液体吐出装置 |
JP2018130951A (ja) * | 2017-02-17 | 2018-08-23 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
JP2022066423A (ja) * | 2017-02-17 | 2022-04-28 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070296767A1 (en) * | 2006-06-27 | 2007-12-27 | Anderson Frank E | Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embedded Conductive Material |
EP2451647B1 (en) * | 2009-07-10 | 2019-04-24 | Fujifilm Dimatix, Inc. | Mems jetting structure for dense packing |
US9046426B1 (en) * | 2012-06-15 | 2015-06-02 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Modular apparatus and method for attaching multiple devices |
JP2015174386A (ja) * | 2014-03-17 | 2015-10-05 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
JP6613580B2 (ja) | 2015-03-10 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体噴射ヘッド、及び、液体噴射装置 |
US10654269B2 (en) * | 2017-06-28 | 2020-05-19 | Canon Kabushiki Kaisha | Liquid ejection head |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126968A (ja) * | 1997-10-22 | 1999-05-11 | Hitachi Chem Co Ltd | 多層プリント配線板の製造法 |
JPH11291493A (ja) * | 1998-04-06 | 1999-10-26 | Seiko Epson Corp | インクジェット式記録ヘッド |
JP2002264335A (ja) * | 2001-03-09 | 2002-09-18 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2002321352A (ja) * | 2001-03-20 | 2002-11-05 | Hewlett Packard Co <Hp> | インクジェットプリントヘッド・アセンブリおよびその形成方法ならびにインクジェットプリントヘッド・アセンブリ用の複合キャリア |
JP2003159800A (ja) * | 2001-09-13 | 2003-06-03 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2005259845A (ja) * | 2004-03-10 | 2005-09-22 | Sharp Corp | 導電性ペーストによるビア充填方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3346689A (en) * | 1965-01-29 | 1967-10-10 | Philco Ford Corp | Multilayer circuit board suing epoxy cards and silver epoxy connectors |
US6631981B2 (en) * | 2000-07-06 | 2003-10-14 | Brother Kogyo Kabushiki Kaisha | Piezoelectric actuator of ink jet printer head |
JP2003182076A (ja) | 2001-12-21 | 2003-07-03 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2005254616A (ja) | 2004-03-11 | 2005-09-22 | Seiko Epson Corp | 液体噴射ヘッドおよびこれを備えた液体噴射装置 |
JP4586427B2 (ja) * | 2004-06-10 | 2010-11-24 | 富士ゼロックス株式会社 | インクジェット記録ヘッド |
US7448732B2 (en) * | 2004-09-30 | 2008-11-11 | Fujifilm Corporation | Liquid ejection head and manufacturing method thereof |
US7524024B2 (en) * | 2005-03-15 | 2009-04-28 | Fuji Xerox Co., Ltd. | Electrical connection substrate, droplet discharge head, and droplet discharge apparatus |
-
2006
- 2006-02-28 JP JP2006053947A patent/JP4933114B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-27 US US11/711,041 patent/US20070211108A1/en not_active Abandoned
-
2011
- 2011-07-28 US US13/193,174 patent/US8579418B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126968A (ja) * | 1997-10-22 | 1999-05-11 | Hitachi Chem Co Ltd | 多層プリント配線板の製造法 |
JPH11291493A (ja) * | 1998-04-06 | 1999-10-26 | Seiko Epson Corp | インクジェット式記録ヘッド |
JP2002264335A (ja) * | 2001-03-09 | 2002-09-18 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2002321352A (ja) * | 2001-03-20 | 2002-11-05 | Hewlett Packard Co <Hp> | インクジェットプリントヘッド・アセンブリおよびその形成方法ならびにインクジェットプリントヘッド・アセンブリ用の複合キャリア |
JP2003159800A (ja) * | 2001-09-13 | 2003-06-03 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JP2005259845A (ja) * | 2004-03-10 | 2005-09-22 | Sharp Corp | 導電性ペーストによるビア充填方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009248568A (ja) * | 2008-04-07 | 2009-10-29 | Samsung Electro Mech Co Ltd | インクジェットヘッド及びその製造方法 |
JP2018130951A (ja) * | 2017-02-17 | 2018-08-23 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
JP7037334B2 (ja) | 2017-02-17 | 2022-03-16 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
JP2022066423A (ja) * | 2017-02-17 | 2022-04-28 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
US11465417B2 (en) | 2017-02-17 | 2022-10-11 | Canon Kabushiki Kaisha | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
JP7223185B2 (ja) | 2017-02-17 | 2023-02-15 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
JP2018030374A (ja) * | 2017-10-31 | 2018-03-01 | ブラザー工業株式会社 | 液体吐出装置 |
Also Published As
Publication number | Publication date |
---|---|
US20070211108A1 (en) | 2007-09-13 |
US20110277319A1 (en) | 2011-11-17 |
US8579418B2 (en) | 2013-11-12 |
JP4933114B2 (ja) | 2012-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4933114B2 (ja) | 液体吐出ヘッドの製造方法 | |
JP4682678B2 (ja) | 液体吐出ヘッドの製造方法 | |
JP4096318B2 (ja) | 液体吐出ヘッド及びその製造方法 | |
US7815294B2 (en) | Liquid ejection head, image forming apparatus and method of manufacturing liquid ejection head | |
WO2015125865A1 (ja) | 液体吐出ヘッド、およびそれを用いた記録装置 | |
JP4822840B2 (ja) | 液体吐出ヘッド及びその製造方法並びに画像形成装置 | |
US7815292B2 (en) | Liquid ejection head | |
JP4890963B2 (ja) | 液体吐出ヘッドの製造方法 | |
US7819502B2 (en) | Liquid ejection head and image forming apparatus | |
US7651198B2 (en) | Liquid droplet ejection head and image forming apparatus | |
JP2006111000A (ja) | 液体吐出ヘッド及びこれを備えた画像形成装置 | |
JP4964538B2 (ja) | 液体吐出ヘッド及びその製造方法 | |
JP4678241B2 (ja) | 樹脂配線基板 | |
US7625070B2 (en) | Liquid ejection head and image forming apparatus | |
JP2009234087A (ja) | 配線構造体及び接合方法並びに液体吐出ヘッドの製造方法、液体吐出ヘッド | |
JP4257842B2 (ja) | 液滴吐出ヘッド及びその製造方法 | |
JP2006240296A (ja) | 液体吐出ヘッド及びその製造方法並びに画像形成装置 | |
JP3791532B2 (ja) | インクジェットヘッド及びインクジェット記録装置 | |
JP2005288916A (ja) | 吐出ヘッド及び吐出ヘッド製造方法 | |
JP2006306066A (ja) | 液体吐出ヘッド | |
JP2006116951A (ja) | 液滴吐出ヘッド及び画像形成装置 | |
JP2006192787A (ja) | 液体吐出ヘッド | |
JP2006247958A (ja) | 液体吐出装置及び液体吐出ヘッド | |
JP2006095877A (ja) | 液体吐出ヘッド及び画像形成装置 | |
JP2006082498A (ja) | 液体吐出ヘッド及びその製造方法並びにこれを備えた画像形成装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080707 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110131 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110401 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120213 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120216 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150224 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |