JP2015145097A5 - - Google Patents

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Publication number
JP2015145097A5
JP2015145097A5 JP2014018675A JP2014018675A JP2015145097A5 JP 2015145097 A5 JP2015145097 A5 JP 2015145097A5 JP 2014018675 A JP2014018675 A JP 2014018675A JP 2014018675 A JP2014018675 A JP 2014018675A JP 2015145097 A5 JP2015145097 A5 JP 2015145097A5
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JP
Japan
Prior art keywords
film
manufacturing
head according
discharge head
liquid discharge
Prior art date
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Application number
JP2014018675A
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English (en)
Japanese (ja)
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JP6234255B2 (ja
JP2015145097A (ja
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Priority to JP2014018675A priority Critical patent/JP6234255B2/ja
Priority claimed from JP2014018675A external-priority patent/JP6234255B2/ja
Priority to US14/604,957 priority patent/US9254661B2/en
Publication of JP2015145097A publication Critical patent/JP2015145097A/ja
Publication of JP2015145097A5 publication Critical patent/JP2015145097A5/ja
Application granted granted Critical
Publication of JP6234255B2 publication Critical patent/JP6234255B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014018675A 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド Active JP6234255B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014018675A JP6234255B2 (ja) 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド
US14/604,957 US9254661B2 (en) 2014-02-03 2015-01-26 Liquid ejecting head manufacturing method and liquid ejecting head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014018675A JP6234255B2 (ja) 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド

Publications (3)

Publication Number Publication Date
JP2015145097A JP2015145097A (ja) 2015-08-13
JP2015145097A5 true JP2015145097A5 (enExample) 2017-02-23
JP6234255B2 JP6234255B2 (ja) 2017-11-22

Family

ID=53754114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014018675A Active JP6234255B2 (ja) 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド

Country Status (2)

Country Link
US (1) US9254661B2 (enExample)
JP (1) JP6234255B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7098350B2 (ja) 2018-02-28 2022-07-11 キヤノン株式会社 接着シートを用いたインクジェット記録ヘッド及び製造方法
TWI814839B (zh) 2018-07-30 2023-09-11 瑞士商西克帕控股有限公司 多晶片模組(mcm)組合件和列印條
US10894423B2 (en) 2018-12-03 2021-01-19 Hewlett-Packard Development Company, L.P. Logic circuitry
KR20210087987A (ko) 2018-12-03 2021-07-13 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 로직 회로 패키지
CN113168457A (zh) 2018-12-03 2021-07-23 惠普发展公司,有限责任合伙企业 逻辑电路系统封装
AU2018452256B2 (en) 2018-12-03 2022-09-08 Hewlett-Packard Development Company, L.P. Logic circuitry
MX2021006229A (es) 2018-12-03 2021-08-11 Hewlett Packard Development Co Conjunto de circuitos logicos.
US11250146B2 (en) 2018-12-03 2022-02-15 Hewlett-Packard Development Company, L.P. Logic circuitry
US11338586B2 (en) 2018-12-03 2022-05-24 Hewlett-Packard Development Company, L.P. Logic circuitry
KR20210087983A (ko) 2018-12-03 2021-07-13 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 로직 회로
PT3681723T (pt) 2018-12-03 2021-08-27 Hewlett Packard Development Co Circuito lógico
EP3687815B1 (en) 2018-12-03 2021-11-10 Hewlett-Packard Development Company, L.P. Logic circuitry
JP2020116792A (ja) 2019-01-22 2020-08-06 東芝テック株式会社 液体吐出ヘッド、及び液体吐出装置
US11407229B2 (en) 2019-10-25 2022-08-09 Hewlett-Packard Development Company, L.P. Logic circuitry package
CN114514521A (zh) 2020-04-30 2022-05-17 惠普发展公司,有限责任合伙企业 用于打印装置的逻辑电路封装
US12400992B2 (en) * 2022-06-01 2025-08-26 Nanya Technology Corporation Semiconductor device with supporter against which bonding wire is disposed and method for preparing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1081007A (ja) * 1996-09-09 1998-03-31 Canon Inc インクジェット記録ヘッド
JP2004351754A (ja) * 2003-05-29 2004-12-16 Canon Inc インクジェット記録ヘッド
US7658470B1 (en) * 2005-04-28 2010-02-09 Hewlett-Packard Development Company, L.P. Method of using a flexible circuit
JP4939184B2 (ja) * 2005-12-15 2012-05-23 キヤノン株式会社 液体吐出ヘッドの製造方法

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