JP6234255B2 - 液体吐出ヘッドの製造方法および液体吐出ヘッド - Google Patents

液体吐出ヘッドの製造方法および液体吐出ヘッド Download PDF

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Publication number
JP6234255B2
JP6234255B2 JP2014018675A JP2014018675A JP6234255B2 JP 6234255 B2 JP6234255 B2 JP 6234255B2 JP 2014018675 A JP2014018675 A JP 2014018675A JP 2014018675 A JP2014018675 A JP 2014018675A JP 6234255 B2 JP6234255 B2 JP 6234255B2
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JP
Japan
Prior art keywords
film
manufacturing
head according
discharge head
liquid discharge
Prior art date
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Active
Application number
JP2014018675A
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English (en)
Japanese (ja)
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JP2015145097A5 (enExample
JP2015145097A (ja
Inventor
新平 大▲高▼
新平 大▲高▼
今村　功
功 今村
弘幸 下山
弘幸 下山
知広 高橋
知広 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014018675A priority Critical patent/JP6234255B2/ja
Priority to US14/604,957 priority patent/US9254661B2/en
Publication of JP2015145097A publication Critical patent/JP2015145097A/ja
Publication of JP2015145097A5 publication Critical patent/JP2015145097A5/ja
Application granted granted Critical
Publication of JP6234255B2 publication Critical patent/JP6234255B2/ja
Active legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2014018675A 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド Active JP6234255B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014018675A JP6234255B2 (ja) 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド
US14/604,957 US9254661B2 (en) 2014-02-03 2015-01-26 Liquid ejecting head manufacturing method and liquid ejecting head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014018675A JP6234255B2 (ja) 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド

Publications (3)

Publication Number Publication Date
JP2015145097A JP2015145097A (ja) 2015-08-13
JP2015145097A5 JP2015145097A5 (enExample) 2017-02-23
JP6234255B2 true JP6234255B2 (ja) 2017-11-22

Family

ID=53754114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014018675A Active JP6234255B2 (ja) 2014-02-03 2014-02-03 液体吐出ヘッドの製造方法および液体吐出ヘッド

Country Status (2)

Country Link
US (1) US9254661B2 (enExample)
JP (1) JP6234255B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7098350B2 (ja) 2018-02-28 2022-07-11 キヤノン株式会社 接着シートを用いたインクジェット記録ヘッド及び製造方法
TWI814839B (zh) 2018-07-30 2023-09-11 瑞士商西克帕控股有限公司 多晶片模組(mcm)組合件和列印條
EP3682359B1 (en) 2018-12-03 2021-01-06 Hewlett-Packard Development Company, L.P. Logic circuitry
EP3695334A1 (en) 2018-12-03 2020-08-19 Hewlett Packard Enterprise Development Company LP Logic circuitry
US10894423B2 (en) 2018-12-03 2021-01-19 Hewlett-Packard Development Company, L.P. Logic circuitry
EP3687820B1 (en) 2018-12-03 2022-03-23 Hewlett-Packard Development Company, L.P. Logic circuitry
US11338586B2 (en) 2018-12-03 2022-05-24 Hewlett-Packard Development Company, L.P. Logic circuitry
CA3121146C (en) 2018-12-03 2024-05-28 Hewlett-Packard Development Company, L.P. Logic circuitry package for controlling ic2 traffic
MX2021005988A (es) 2018-12-03 2021-07-06 Hewlett Packard Development Co Conjunto de circuitos logicos.
EP3681723B1 (en) 2018-12-03 2021-07-28 Hewlett-Packard Development Company, L.P. Logic circuitry
CN113165389A (zh) 2018-12-03 2021-07-23 惠普发展公司，有限责任合伙企业 逻辑电路系统封装
WO2020117303A1 (en) 2018-12-03 2020-06-11 Hewlett-Packard Development Company, L.P. Logic circuitry
JP2020116792A (ja) 2019-01-22 2020-08-06 東芝テック株式会社 液体吐出ヘッド、及び液体吐出装置
EP3844000B1 (en) 2019-10-25 2023-04-12 Hewlett-Packard Development Company, L.P. Logic circuitry package
EP4031997A1 (en) 2020-04-30 2022-07-27 Hewlett-Packard Development Company, L.P. Logic circuitry package for print apparatus
US12400992B2 (en) * 2022-06-01 2025-08-26 Nanya Technology Corporation Semiconductor device with supporter against which bonding wire is disposed and method for preparing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1081007A (ja) * 1996-09-09 1998-03-31 Canon Inc インクジェット記録ヘッド
JP2004351754A (ja) * 2003-05-29 2004-12-16 Canon Inc インクジェット記録ヘッド
US7658470B1 (en) * 2005-04-28 2010-02-09 Hewlett-Packard Development Company, L.P. Method of using a flexible circuit
JP4939184B2 (ja) * 2005-12-15 2012-05-23 キヤノン株式会社 液体吐出ヘッドの製造方法

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Publication number Publication date
US9254661B2 (en) 2016-02-09
US20150217569A1 (en) 2015-08-06
JP2015145097A (ja) 2015-08-13

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