JP2018120886A5 - - Google Patents
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- Publication number
- JP2018120886A5 JP2018120886A5 JP2017009295A JP2017009295A JP2018120886A5 JP 2018120886 A5 JP2018120886 A5 JP 2018120886A5 JP 2017009295 A JP2017009295 A JP 2017009295A JP 2017009295 A JP2017009295 A JP 2017009295A JP 2018120886 A5 JP2018120886 A5 JP 2018120886A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- oxide film
- cleaning
- rpm
- rotational speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 19
- 238000004140 cleaning Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical group F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017009295A JP6575538B2 (ja) | 2017-01-23 | 2017-01-23 | 半導体ウェーハの洗浄方法 |
| SG10201913707UA SG10201913707UA (en) | 2017-01-23 | 2017-12-20 | Method for cleaning semiconductor wafer |
| US16/471,609 US11094525B2 (en) | 2017-01-23 | 2017-12-20 | Method for cleaning semiconductor wafer |
| CN201780082034.1A CN110140197B (zh) | 2017-01-23 | 2017-12-20 | 半导体晶圆的洗净方法 |
| KR1020197019648A KR102509323B1 (ko) | 2017-01-23 | 2017-12-20 | 반도체 웨이퍼의 세정방법 |
| PCT/JP2017/045831 WO2018135226A1 (ja) | 2017-01-23 | 2017-12-20 | 半導体ウェーハの洗浄方法 |
| EP17892697.8A EP3573090B1 (en) | 2017-01-23 | 2017-12-20 | Semiconductor wafer cleaning method |
| TW107100403A TWI778004B (zh) | 2017-01-23 | 2018-01-05 | 半導體晶圓的洗淨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017009295A JP6575538B2 (ja) | 2017-01-23 | 2017-01-23 | 半導体ウェーハの洗浄方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018120886A JP2018120886A (ja) | 2018-08-02 |
| JP2018120886A5 true JP2018120886A5 (https=) | 2019-07-18 |
| JP6575538B2 JP6575538B2 (ja) | 2019-09-18 |
Family
ID=62907914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017009295A Active JP6575538B2 (ja) | 2017-01-23 | 2017-01-23 | 半導体ウェーハの洗浄方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11094525B2 (https=) |
| EP (1) | EP3573090B1 (https=) |
| JP (1) | JP6575538B2 (https=) |
| KR (1) | KR102509323B1 (https=) |
| CN (1) | CN110140197B (https=) |
| SG (1) | SG10201913707UA (https=) |
| TW (1) | TWI778004B (https=) |
| WO (1) | WO2018135226A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI128613B (en) * | 2019-06-19 | 2020-08-31 | Comptek Solutions Oy | Optoelectronic device |
| KR20240121053A (ko) * | 2023-02-01 | 2024-08-08 | 에스케이실트론 주식회사 | 반도체 기판 및 반도체 기판의 세정 방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH069195B2 (ja) * | 1989-05-06 | 1994-02-02 | 大日本スクリーン製造株式会社 | 基板の表面処理方法 |
| JP2002368067A (ja) * | 2001-06-08 | 2002-12-20 | Tokyo Electron Ltd | 回転式基板処理装置及び回転式基板処理方法 |
| JP4089809B2 (ja) * | 2002-03-13 | 2008-05-28 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 半導体ウェーハのエッジ部の酸化膜除去装置 |
| JP2005327936A (ja) * | 2004-05-14 | 2005-11-24 | Canon Inc | 基板の洗浄方法及びその製造方法 |
| CN100524639C (zh) * | 2005-02-07 | 2009-08-05 | 株式会社荏原制作所 | 基板处理方法、基板处理装置及控制程序 |
| JP2007165366A (ja) * | 2005-12-09 | 2007-06-28 | Ebara Corp | 基板処理装置および基板処理方法 |
| JP4832201B2 (ja) * | 2006-07-24 | 2011-12-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2009147038A (ja) * | 2007-12-13 | 2009-07-02 | Dainippon Screen Mfg Co Ltd | 基板処理方法 |
| JP5317529B2 (ja) | 2008-05-02 | 2013-10-16 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 半導体ウェーハの処理方法及び処理装置 |
| JP2010177543A (ja) * | 2009-01-30 | 2010-08-12 | Ebara Corp | 基板処理方法及び基板処理装置 |
| JP5795917B2 (ja) * | 2010-09-27 | 2015-10-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP5061229B2 (ja) * | 2010-10-18 | 2012-10-31 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法。 |
| JP5589968B2 (ja) * | 2011-06-17 | 2014-09-17 | 信越半導体株式会社 | 半導体ウェーハの洗浄方法 |
| JP6379400B2 (ja) * | 2013-09-26 | 2018-08-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP6256828B2 (ja) * | 2013-10-10 | 2018-01-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP2015220284A (ja) * | 2014-05-15 | 2015-12-07 | 信越半導体株式会社 | ウエーハの洗浄方法 |
-
2017
- 2017-01-23 JP JP2017009295A patent/JP6575538B2/ja active Active
- 2017-12-20 CN CN201780082034.1A patent/CN110140197B/zh active Active
- 2017-12-20 KR KR1020197019648A patent/KR102509323B1/ko active Active
- 2017-12-20 SG SG10201913707UA patent/SG10201913707UA/en unknown
- 2017-12-20 WO PCT/JP2017/045831 patent/WO2018135226A1/ja not_active Ceased
- 2017-12-20 US US16/471,609 patent/US11094525B2/en active Active
- 2017-12-20 EP EP17892697.8A patent/EP3573090B1/en active Active
-
2018
- 2018-01-05 TW TW107100403A patent/TWI778004B/zh active
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