SG10201913707UA - Method for cleaning semiconductor wafer - Google Patents

Method for cleaning semiconductor wafer

Info

Publication number
SG10201913707UA
SG10201913707UA SG10201913707UA SG10201913707UA SG10201913707UA SG 10201913707U A SG10201913707U A SG 10201913707UA SG 10201913707U A SG10201913707U A SG 10201913707UA SG 10201913707U A SG10201913707U A SG 10201913707UA SG 10201913707U A SG10201913707U A SG 10201913707UA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
cleaning semiconductor
cleaning
wafer
semiconductor
Prior art date
Application number
SG10201913707UA
Inventor
Kensaku Igarashi
Tatsuo Abe
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of SG10201913707UA publication Critical patent/SG10201913707UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
SG10201913707UA 2017-01-23 2017-12-20 Method for cleaning semiconductor wafer SG10201913707UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017009295A JP6575538B2 (en) 2017-01-23 2017-01-23 Semiconductor wafer cleaning method

Publications (1)

Publication Number Publication Date
SG10201913707UA true SG10201913707UA (en) 2020-03-30

Family

ID=62907914

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201913707UA SG10201913707UA (en) 2017-01-23 2017-12-20 Method for cleaning semiconductor wafer

Country Status (8)

Country Link
US (1) US11094525B2 (en)
EP (1) EP3573090B1 (en)
JP (1) JP6575538B2 (en)
KR (1) KR102509323B1 (en)
CN (1) CN110140197B (en)
SG (1) SG10201913707UA (en)
TW (1) TWI778004B (en)
WO (1) WO2018135226A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069195B2 (en) * 1989-05-06 1994-02-02 大日本スクリーン製造株式会社 Substrate surface treatment method
JP2002368067A (en) * 2001-06-08 2002-12-20 Tokyo Electron Ltd Rotating substrate processing device and rotating substrate processing method
JP4089809B2 (en) * 2002-03-13 2008-05-28 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Equipment for removing oxide film at edge of semiconductor wafer
JP2005327936A (en) * 2004-05-14 2005-11-24 Canon Inc Cleaning method and manufacturing method of substrate
CN100524639C (en) * 2005-02-07 2009-08-05 株式会社荏原制作所 Substrate processing method, substrate processing apparatus and control program
JP2007165366A (en) * 2005-12-09 2007-06-28 Ebara Corp Apparatus and method for processing substrate
JP4832201B2 (en) * 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 Substrate processing equipment
JP2009147038A (en) * 2007-12-13 2009-07-02 Dainippon Screen Mfg Co Ltd Substrate treating method
JP5317529B2 (en) 2008-05-02 2013-10-16 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer processing method and processing apparatus
JP2010177543A (en) * 2009-01-30 2010-08-12 Ebara Corp Method and apparatus for processing substrate
JP5795917B2 (en) * 2010-09-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP5061229B2 (en) * 2010-10-18 2012-10-31 東京エレクトロン株式会社 Substrate cleaning apparatus and substrate cleaning method.
JP5589968B2 (en) * 2011-06-17 2014-09-17 信越半導体株式会社 Semiconductor wafer cleaning method
JP6379400B2 (en) * 2013-09-26 2018-08-29 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP6256828B2 (en) * 2013-10-10 2018-01-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP2015220284A (en) * 2014-05-15 2015-12-07 信越半導体株式会社 Wafer cleaning method

Also Published As

Publication number Publication date
TW201841240A (en) 2018-11-16
WO2018135226A1 (en) 2018-07-26
EP3573090B1 (en) 2024-05-01
CN110140197A (en) 2019-08-16
JP2018120886A (en) 2018-08-02
US11094525B2 (en) 2021-08-17
CN110140197B (en) 2023-04-28
KR102509323B1 (en) 2023-03-13
EP3573090A1 (en) 2019-11-27
JP6575538B2 (en) 2019-09-18
US20200105517A1 (en) 2020-04-02
EP3573090A4 (en) 2020-11-04
TWI778004B (en) 2022-09-21
KR20190105581A (en) 2019-09-17

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