TWI778004B - 半導體晶圓的洗淨方法 - Google Patents

半導體晶圓的洗淨方法 Download PDF

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Publication number
TWI778004B
TWI778004B TW107100403A TW107100403A TWI778004B TW I778004 B TWI778004 B TW I778004B TW 107100403 A TW107100403 A TW 107100403A TW 107100403 A TW107100403 A TW 107100403A TW I778004 B TWI778004 B TW I778004B
Authority
TW
Taiwan
Prior art keywords
oxide film
semiconductor wafer
rpm
cleaning
rotational speed
Prior art date
Application number
TW107100403A
Other languages
English (en)
Chinese (zh)
Other versions
TW201841240A (zh
Inventor
五十嵐健作
阿部達夫
Original Assignee
日商信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW201841240A publication Critical patent/TW201841240A/zh
Application granted granted Critical
Publication of TWI778004B publication Critical patent/TWI778004B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW107100403A 2017-01-23 2018-01-05 半導體晶圓的洗淨方法 TWI778004B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2017-009295 2017-01-23
JP2017009295A JP6575538B2 (ja) 2017-01-23 2017-01-23 半導体ウェーハの洗浄方法

Publications (2)

Publication Number Publication Date
TW201841240A TW201841240A (zh) 2018-11-16
TWI778004B true TWI778004B (zh) 2022-09-21

Family

ID=62907914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107100403A TWI778004B (zh) 2017-01-23 2018-01-05 半導體晶圓的洗淨方法

Country Status (8)

Country Link
US (1) US11094525B2 (https=)
EP (1) EP3573090B1 (https=)
JP (1) JP6575538B2 (https=)
KR (1) KR102509323B1 (https=)
CN (1) CN110140197B (https=)
SG (1) SG10201913707UA (https=)
TW (1) TWI778004B (https=)
WO (1) WO2018135226A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI128613B (en) * 2019-06-19 2020-08-31 Comptek Solutions Oy Optoelectronic device
KR20240121053A (ko) * 2023-02-01 2024-08-08 에스케이실트론 주식회사 반도체 기판 및 반도체 기판의 세정 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147038A (ja) * 2007-12-13 2009-07-02 Dainippon Screen Mfg Co Ltd 基板処理方法
JP2015076558A (ja) * 2013-10-10 2015-04-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2015220284A (ja) * 2014-05-15 2015-12-07 信越半導体株式会社 ウエーハの洗浄方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069195B2 (ja) * 1989-05-06 1994-02-02 大日本スクリーン製造株式会社 基板の表面処理方法
JP2002368067A (ja) * 2001-06-08 2002-12-20 Tokyo Electron Ltd 回転式基板処理装置及び回転式基板処理方法
JP4089809B2 (ja) * 2002-03-13 2008-05-28 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハのエッジ部の酸化膜除去装置
JP2005327936A (ja) * 2004-05-14 2005-11-24 Canon Inc 基板の洗浄方法及びその製造方法
CN100524639C (zh) * 2005-02-07 2009-08-05 株式会社荏原制作所 基板处理方法、基板处理装置及控制程序
JP2007165366A (ja) * 2005-12-09 2007-06-28 Ebara Corp 基板処理装置および基板処理方法
JP4832201B2 (ja) * 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 基板処理装置
JP5317529B2 (ja) 2008-05-02 2013-10-16 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの処理方法及び処理装置
JP2010177543A (ja) * 2009-01-30 2010-08-12 Ebara Corp 基板処理方法及び基板処理装置
JP5795917B2 (ja) * 2010-09-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5061229B2 (ja) * 2010-10-18 2012-10-31 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
JP5589968B2 (ja) * 2011-06-17 2014-09-17 信越半導体株式会社 半導体ウェーハの洗浄方法
JP6379400B2 (ja) * 2013-09-26 2018-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147038A (ja) * 2007-12-13 2009-07-02 Dainippon Screen Mfg Co Ltd 基板処理方法
JP2015076558A (ja) * 2013-10-10 2015-04-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2015220284A (ja) * 2014-05-15 2015-12-07 信越半導体株式会社 ウエーハの洗浄方法

Also Published As

Publication number Publication date
US11094525B2 (en) 2021-08-17
WO2018135226A1 (ja) 2018-07-26
EP3573090A1 (en) 2019-11-27
EP3573090B1 (en) 2024-05-01
JP2018120886A (ja) 2018-08-02
CN110140197B (zh) 2023-04-28
KR20190105581A (ko) 2019-09-17
KR102509323B1 (ko) 2023-03-13
JP6575538B2 (ja) 2019-09-18
CN110140197A (zh) 2019-08-16
SG10201913707UA (en) 2020-03-30
US20200105517A1 (en) 2020-04-02
EP3573090A4 (en) 2020-11-04
TW201841240A (zh) 2018-11-16

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