JP2018088531A5 - - Google Patents

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Publication number
JP2018088531A5
JP2018088531A5 JP2017250549A JP2017250549A JP2018088531A5 JP 2018088531 A5 JP2018088531 A5 JP 2018088531A5 JP 2017250549 A JP2017250549 A JP 2017250549A JP 2017250549 A JP2017250549 A JP 2017250549A JP 2018088531 A5 JP2018088531 A5 JP 2018088531A5
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JP
Japan
Prior art keywords
electrode pad
wiring pattern
main electrode
electrically connected
input wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017250549A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018088531A (ja
JP6907931B2 (ja
Filing date
Publication date
Priority claimed from JP2017558040A external-priority patent/JP6274380B1/ja
Application filed filed Critical
Publication of JP2018088531A publication Critical patent/JP2018088531A/ja
Publication of JP2018088531A5 publication Critical patent/JP2018088531A5/ja
Application granted granted Critical
Publication of JP6907931B2 publication Critical patent/JP6907931B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017250549A 2016-11-24 2017-12-27 半導体モジュール Active JP6907931B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016227744 2016-11-24
JP2016227744 2016-11-24
JP2017558040A JP6274380B1 (ja) 2016-11-24 2017-08-07 半導体モジュール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017558040A Division JP6274380B1 (ja) 2016-11-24 2017-08-07 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2018088531A JP2018088531A (ja) 2018-06-07
JP2018088531A5 true JP2018088531A5 (enExample) 2020-08-13
JP6907931B2 JP6907931B2 (ja) 2021-07-21

Family

ID=62194840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017250549A Active JP6907931B2 (ja) 2016-11-24 2017-12-27 半導体モジュール

Country Status (3)

Country Link
US (1) US10916531B2 (enExample)
JP (1) JP6907931B2 (enExample)
WO (1) WO2018096734A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021005690A (ja) * 2019-06-27 2021-01-14 住友電気工業株式会社 半導体モジュール
US11495551B2 (en) 2019-07-09 2022-11-08 Hitachi Energy Switzerland Ag Power semiconductor module with integrated surge arrester
JP6979997B2 (ja) * 2019-12-04 2021-12-15 三菱電機株式会社 電力用半導体装置
EP3855488A1 (en) 2020-01-22 2021-07-28 Delta Electronics (Shanghai) Co., Ltd. Power module
US11350519B2 (en) * 2020-01-22 2022-05-31 Delta Electronics (Shanghai) Co., Ltd. Power module
JP6952834B1 (ja) * 2020-06-04 2021-10-27 三菱電機株式会社 パワーモジュール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
JP5287359B2 (ja) * 2009-03-04 2013-09-11 株式会社デンソー 半導体モジュール
JP2011036016A (ja) * 2009-07-31 2011-02-17 Daikin Industries Ltd 電力変換装置
CN103238269B (zh) 2010-12-01 2015-06-24 株式会社安川电机 电力变换装置
CN104081646A (zh) * 2012-01-31 2014-10-01 株式会社安川电机 电力变换装置和用于制造电力变换装置的方法
JP6097013B2 (ja) * 2012-02-29 2017-03-15 ローム株式会社 パワーモジュール半導体装置
JP2015135895A (ja) 2014-01-17 2015-07-27 パナソニックIpマネジメント株式会社 半導体モジュール
JP6181136B2 (ja) 2015-11-09 2017-08-16 日立オートモティブシステムズ株式会社 電力変換装置
JP6583072B2 (ja) * 2016-03-15 2019-10-02 住友電気工業株式会社 半導体モジュール

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