JP2009246175A5 - - Google Patents

Download PDF

Info

Publication number
JP2009246175A5
JP2009246175A5 JP2008091664A JP2008091664A JP2009246175A5 JP 2009246175 A5 JP2009246175 A5 JP 2009246175A5 JP 2008091664 A JP2008091664 A JP 2008091664A JP 2008091664 A JP2008091664 A JP 2008091664A JP 2009246175 A5 JP2009246175 A5 JP 2009246175A5
Authority
JP
Japan
Prior art keywords
resin layer
insulating resin
backing member
substrate according
element mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008091664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009246175A (ja
JP5061010B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008091664A priority Critical patent/JP5061010B2/ja
Priority claimed from JP2008091664A external-priority patent/JP5061010B2/ja
Priority to US12/345,019 priority patent/US20090168391A1/en
Publication of JP2009246175A publication Critical patent/JP2009246175A/ja
Priority to US12/900,175 priority patent/US8438724B2/en
Publication of JP2009246175A5 publication Critical patent/JP2009246175A5/ja
Application granted granted Critical
Publication of JP5061010B2 publication Critical patent/JP5061010B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008091664A 2007-12-27 2008-03-31 半導体モジュール Expired - Fee Related JP5061010B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008091664A JP5061010B2 (ja) 2008-03-31 2008-03-31 半導体モジュール
US12/345,019 US20090168391A1 (en) 2007-12-27 2008-12-29 Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
US12/900,175 US8438724B2 (en) 2007-12-27 2010-10-07 Method for producing substrate for mounting device and method for producing a semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008091664A JP5061010B2 (ja) 2008-03-31 2008-03-31 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2009246175A JP2009246175A (ja) 2009-10-22
JP2009246175A5 true JP2009246175A5 (enExample) 2011-05-12
JP5061010B2 JP5061010B2 (ja) 2012-10-31

Family

ID=41307734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008091664A Expired - Fee Related JP5061010B2 (ja) 2007-12-27 2008-03-31 半導体モジュール

Country Status (1)

Country Link
JP (1) JP5061010B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2299702B1 (en) 1996-02-28 2013-12-11 Panasonic Corporation High-resulution optocal disk for recording stereoscopic video, optical disk reproducing device and optical disk recording device
JP5431232B2 (ja) * 2010-03-31 2014-03-05 三洋電機株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118210A (ja) * 2000-10-10 2002-04-19 Hitachi Cable Ltd 半導体装置用インタポーザ及びこれを用いた半導体装置
JP2007173749A (ja) * 2005-12-26 2007-07-05 Sony Corp 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
JP2017134382A5 (ja) 半導体装置
JP2010283236A5 (enExample)
JP2010147281A5 (ja) 半導体装置
JP2008160160A5 (enExample)
JP2007241999A5 (enExample)
JP2010021534A5 (enExample)
JP2008544540A5 (enExample)
JP2007059916A5 (enExample)
JP2008028361A5 (enExample)
RU2009138474A (ru) Сенсорная панель и способ ее производства
WO2009044698A1 (ja) 半導体発光素子および半導体発光素子の製造方法
JP2010103502A5 (ja) 半導体装置
JP2020522117A5 (enExample)
JP2009044154A5 (enExample)
WO2009033728A3 (en) Sensor matrix with semiconductor components
JP2013058710A5 (enExample)
JP2016045371A5 (enExample)
TW200744180A (en) Stack structure of circuit board having embedded with semiconductor component
JP2009246174A5 (enExample)
JP2009109472A5 (enExample)
JP2012212712A5 (enExample)
JP2015095489A5 (enExample)
JP2016510513A5 (enExample)
JP2009246175A5 (enExample)
JP2013062296A5 (enExample)