JP2013058710A5 - - Google Patents

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Publication number
JP2013058710A5
JP2013058710A5 JP2011197644A JP2011197644A JP2013058710A5 JP 2013058710 A5 JP2013058710 A5 JP 2013058710A5 JP 2011197644 A JP2011197644 A JP 2011197644A JP 2011197644 A JP2011197644 A JP 2011197644A JP 2013058710 A5 JP2013058710 A5 JP 2013058710A5
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JP
Japan
Prior art keywords
electrode
substrate body
end surface
thickness direction
comb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011197644A
Other languages
English (en)
Japanese (ja)
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JP2013058710A (ja
JP5732357B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2011197644A priority Critical patent/JP5732357B2/ja
Priority claimed from JP2011197644A external-priority patent/JP5732357B2/ja
Priority to US13/592,547 priority patent/US8836138B2/en
Publication of JP2013058710A publication Critical patent/JP2013058710A/ja
Publication of JP2013058710A5 publication Critical patent/JP2013058710A5/ja
Application granted granted Critical
Publication of JP5732357B2 publication Critical patent/JP5732357B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011197644A 2011-09-09 2011-09-09 配線基板、及び半導体パッケージ Active JP5732357B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011197644A JP5732357B2 (ja) 2011-09-09 2011-09-09 配線基板、及び半導体パッケージ
US13/592,547 US8836138B2 (en) 2011-09-09 2012-08-23 Wiring substrate and semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011197644A JP5732357B2 (ja) 2011-09-09 2011-09-09 配線基板、及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2013058710A JP2013058710A (ja) 2013-03-28
JP2013058710A5 true JP2013058710A5 (enExample) 2014-08-07
JP5732357B2 JP5732357B2 (ja) 2015-06-10

Family

ID=47829127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011197644A Active JP5732357B2 (ja) 2011-09-09 2011-09-09 配線基板、及び半導体パッケージ

Country Status (2)

Country Link
US (1) US8836138B2 (enExample)
JP (1) JP5732357B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9384891B2 (en) * 2013-08-22 2016-07-05 Maxlinear, Inc. Method and system for a metal finger capacitor with a triplet repeating sequence incorporating a metal underpass
JP2016009844A (ja) 2014-06-26 2016-01-18 ソニー株式会社 半導体装置および半導体装置の製造方法
TWI542263B (zh) * 2014-07-31 2016-07-11 恆勁科技股份有限公司 中介基板及其製法
KR102349417B1 (ko) 2015-07-16 2022-01-10 삼성전자 주식회사 전압 강하를 개선할 수 있는 구조를 갖는 반도체 장치와 이를 포함하는 장치
CN109075130B (zh) 2016-05-24 2019-11-22 野田士克林股份有限公司 中间连接器、包括中间连接器的半导体装置和制造中间连接器的方法
KR102262073B1 (ko) * 2018-07-26 2021-06-08 교세라 가부시키가이샤 배선 기판
JP7017995B2 (ja) * 2018-07-26 2022-02-09 京セラ株式会社 配線基板
JP2023043038A (ja) 2021-09-15 2023-03-28 キオクシア株式会社 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878795B2 (ja) * 2000-05-30 2007-02-07 京セラ株式会社 多層配線基板
JP2002043762A (ja) * 2000-07-27 2002-02-08 Kyocera Corp 多層配線基板
TW525291B (en) * 2001-12-19 2003-03-21 Silicon Integrated Sys Corp Package with embedded capacitors in chip
JP4568039B2 (ja) 2004-06-30 2010-10-27 ルネサスエレクトロニクス株式会社 半導体装置およびそれを用いた半導体モジュール
US7022581B2 (en) * 2004-07-08 2006-04-04 Agere Systems Inc. Interdigitaded capacitors
JP4912992B2 (ja) * 2007-09-12 2012-04-11 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法
JP2010219425A (ja) * 2009-03-18 2010-09-30 Toshiba Corp 半導体装置
JP5014380B2 (ja) * 2009-05-27 2012-08-29 京セラ株式会社 多層基板および半導体装置

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