JP2012212712A5 - - Google Patents

Download PDF

Info

Publication number
JP2012212712A5
JP2012212712A5 JP2011076410A JP2011076410A JP2012212712A5 JP 2012212712 A5 JP2012212712 A5 JP 2012212712A5 JP 2011076410 A JP2011076410 A JP 2011076410A JP 2011076410 A JP2011076410 A JP 2011076410A JP 2012212712 A5 JP2012212712 A5 JP 2012212712A5
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding
bonding material
material provided
pad portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011076410A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012212712A (ja
JP6043049B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011076410A priority Critical patent/JP6043049B2/ja
Priority claimed from JP2011076410A external-priority patent/JP6043049B2/ja
Publication of JP2012212712A publication Critical patent/JP2012212712A/ja
Publication of JP2012212712A5 publication Critical patent/JP2012212712A5/ja
Application granted granted Critical
Publication of JP6043049B2 publication Critical patent/JP6043049B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011076410A 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法 Active JP6043049B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011076410A JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011076410A JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Publications (3)

Publication Number Publication Date
JP2012212712A JP2012212712A (ja) 2012-11-01
JP2012212712A5 true JP2012212712A5 (enExample) 2014-04-24
JP6043049B2 JP6043049B2 (ja) 2016-12-14

Family

ID=47266464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011076410A Active JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Country Status (1)

Country Link
JP (1) JP6043049B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013179638A1 (ja) * 2012-05-29 2013-12-05 日本精工株式会社 半導体モジュール及びその製造方法
CN103930981B (zh) * 2012-11-05 2016-07-13 日本精工株式会社 半导体模块
US9402311B2 (en) 2012-11-05 2016-07-26 Nsk Ltd. Semiconductor module
JP5807721B2 (ja) 2012-11-05 2015-11-10 日本精工株式会社 半導体モジュール
BR112016001171A2 (pt) * 2013-10-21 2017-12-12 Nsk Ltd módulo semicondutor.
JP6566634B2 (ja) * 2014-12-09 2019-08-28 国立大学法人大阪大学 接合構造体、及び、接合構造体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4550503B2 (ja) * 2004-07-22 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2006344652A (ja) * 2005-06-07 2006-12-21 Toshiba Components Co Ltd 半導体装置及び半導体素子の搭載方法
JP5076440B2 (ja) * 2006-10-16 2012-11-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2010050364A (ja) * 2008-08-25 2010-03-04 Hitachi Ltd 半導体装置
JP5388661B2 (ja) * 2009-04-03 2014-01-15 三菱電機株式会社 半導体装置およびその製造方法
JP2012212713A (ja) * 2011-03-30 2012-11-01 Toshiba Corp 半導体装置の実装構造
JP2012217213A (ja) * 2012-08-01 2012-11-08 Toshiba Corp 画像処理装置および画像処理方法

Similar Documents

Publication Publication Date Title
JP2012212712A5 (enExample)
JP2009192309A5 (enExample)
JP2009194322A5 (enExample)
JP2013084960A5 (enExample)
JP2008160160A5 (enExample)
JP2013186030A5 (enExample)
JP2015055896A5 (enExample)
JP2012054578A5 (enExample)
JP2008028361A5 (enExample)
JP2011009514A5 (enExample)
JP2013069807A5 (enExample)
JP2012069952A5 (enExample)
JP2010165840A5 (enExample)
ATE532215T1 (de) Halbleiterkapselung und deren herstellung
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
JP2012015504A5 (enExample)
JP2009110983A5 (enExample)
JP2012089724A5 (ja) 半導体装置の製造方法
JP2009239261A5 (enExample)
JP2011014892A5 (enExample)
JP2009182272A5 (enExample)
JP2011023528A5 (enExample)
JP2009044136A5 (enExample)
WO2012116157A3 (en) Chip module embedded in pcb substrate
JP2010278425A5 (enExample)