JP6043049B2 - 半導体装置の実装構造及び半導体装置の実装方法 - Google Patents

半導体装置の実装構造及び半導体装置の実装方法 Download PDF

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Publication number
JP6043049B2
JP6043049B2 JP2011076410A JP2011076410A JP6043049B2 JP 6043049 B2 JP6043049 B2 JP 6043049B2 JP 2011076410 A JP2011076410 A JP 2011076410A JP 2011076410 A JP2011076410 A JP 2011076410A JP 6043049 B2 JP6043049 B2 JP 6043049B2
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Japan
Prior art keywords
semiconductor device
bonding
bonding material
mounting structure
device mounting
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Active
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JP2011076410A
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English (en)
Japanese (ja)
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JP2012212712A (ja
JP2012212712A5 (enExample
Inventor
森　三樹
三樹 森
元 中島
元 中島
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Toshiba Corp
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Toshiba Corp
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Priority to JP2011076410A priority Critical patent/JP6043049B2/ja
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Publication of JP2012212712A5 publication Critical patent/JP2012212712A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2011076410A 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法 Active JP6043049B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011076410A JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011076410A JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Publications (3)

Publication Number Publication Date
JP2012212712A JP2012212712A (ja) 2012-11-01
JP2012212712A5 JP2012212712A5 (enExample) 2014-04-24
JP6043049B2 true JP6043049B2 (ja) 2016-12-14

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JP2011076410A Active JP6043049B2 (ja) 2011-03-30 2011-03-30 半導体装置の実装構造及び半導体装置の実装方法

Country Status (1)

Country Link
JP (1) JP6043049B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013179638A1 (ja) * 2012-05-29 2013-12-05 日本精工株式会社 半導体モジュール及びその製造方法
EP2916348B1 (en) * 2012-11-05 2020-05-13 NSK Ltd. Semiconductor module
US9402311B2 (en) 2012-11-05 2016-07-26 Nsk Ltd. Semiconductor module
US9609775B2 (en) 2012-11-05 2017-03-28 Nsk Ltd. Semiconductor module
EP3024024B1 (en) * 2013-10-21 2020-03-18 NSK Ltd. Semiconductor module
JP6566634B2 (ja) * 2014-12-09 2019-08-28 国立大学法人大阪大学 接合構造体、及び、接合構造体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4550503B2 (ja) * 2004-07-22 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2006344652A (ja) * 2005-06-07 2006-12-21 Toshiba Components Co Ltd 半導体装置及び半導体素子の搭載方法
JP5076440B2 (ja) * 2006-10-16 2012-11-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2010050364A (ja) * 2008-08-25 2010-03-04 Hitachi Ltd 半導体装置
JP5388661B2 (ja) * 2009-04-03 2014-01-15 三菱電機株式会社 半導体装置およびその製造方法
JP2012212713A (ja) * 2011-03-30 2012-11-01 Toshiba Corp 半導体装置の実装構造
JP2012217213A (ja) * 2012-08-01 2012-11-08 Toshiba Corp 画像処理装置および画像処理方法

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Publication number Publication date
JP2012212712A (ja) 2012-11-01

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