CN109997223B - 功率半导体模块 - Google Patents
功率半导体模块 Download PDFInfo
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- CN109997223B CN109997223B CN201780073003.XA CN201780073003A CN109997223B CN 109997223 B CN109997223 B CN 109997223B CN 201780073003 A CN201780073003 A CN 201780073003A CN 109997223 B CN109997223 B CN 109997223B
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- power semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 148
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L23/492—Bases or plates or solder therefor
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/1306—Field-effect transistor [FET]
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- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inverter Devices (AREA)
- Rectifiers (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16200714.0 | 2016-11-25 | ||
EP16200714 | 2016-11-25 | ||
PCT/EP2017/080529 WO2018096147A1 (en) | 2016-11-25 | 2017-11-27 | Power semiconductor module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109997223A CN109997223A (zh) | 2019-07-09 |
CN109997223B true CN109997223B (zh) | 2023-06-30 |
Family
ID=57406127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780073003.XA Active CN109997223B (zh) | 2016-11-25 | 2017-11-27 | 功率半导体模块 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11127671B2 (zh) |
EP (1) | EP3545552A1 (zh) |
JP (1) | JP7210446B2 (zh) |
CN (1) | CN109997223B (zh) |
WO (1) | WO2018096147A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3088138B1 (fr) * | 2018-11-07 | 2022-01-21 | Inst Vedecom | Module electronique de puissance |
US11569815B1 (en) * | 2019-10-15 | 2023-01-31 | Zhong Chen | High electric-thermal performance and high-power density power module |
EP3859774B1 (en) * | 2020-01-29 | 2022-05-04 | Hitachi Energy Switzerland AG | Power semiconductor module |
EP4095900B1 (en) * | 2021-05-28 | 2024-01-31 | Hitachi Energy Ltd | Clamping element and method for producing a power semiconductor device |
CN113834527A (zh) * | 2021-09-18 | 2021-12-24 | 重庆大学 | 一种压接型功率半导体结构及其内部压力在线测量方法 |
DE102022205514A1 (de) | 2022-05-31 | 2023-11-30 | Vitesco Technologies GmbH | Halbbrückenmodul mit parallel geführten Versorgungs-Zuleitungen verbunden mit isolierten Anschlussflächen zwischen zwei Streifenabschnitten sowie mit einem der Streifenabschnitte einer Leiterbahnschicht |
Citations (1)
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CN102110680A (zh) * | 2009-10-30 | 2011-06-29 | 通用电气公司 | 具有降低电感的功率模块组件 |
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DE3937045A1 (de) * | 1989-11-07 | 1991-05-08 | Abb Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
JP3053298B2 (ja) * | 1992-08-19 | 2000-06-19 | 株式会社東芝 | 半導体装置 |
US6054765A (en) * | 1998-04-27 | 2000-04-25 | Delco Electronics Corporation | Parallel dual switch module |
US6845017B2 (en) * | 2000-09-20 | 2005-01-18 | Ballard Power Systems Corporation | Substrate-level DC bus design to reduce module inductance |
US7505294B2 (en) * | 2003-05-16 | 2009-03-17 | Continental Automotive Systems Us, Inc. | Tri-level inverter |
US6987670B2 (en) * | 2003-05-16 | 2006-01-17 | Ballard Power Systems Corporation | Dual power module power system architecture |
JP2009512994A (ja) * | 2005-06-24 | 2009-03-26 | インターナショナル レクティファイアー コーポレイション | 低インダクタンスの半導体ハーフブリッジモジュール |
JP4513770B2 (ja) | 2006-02-28 | 2010-07-28 | 株式会社豊田自動織機 | 半導体装置 |
JP5637944B2 (ja) | 2011-06-29 | 2014-12-10 | 株式会社 日立パワーデバイス | パワー半導体モジュール |
JP5555206B2 (ja) | 2011-07-11 | 2014-07-23 | 株式会社 日立パワーデバイス | 半導体パワーモジュール |
US8675379B2 (en) * | 2011-08-08 | 2014-03-18 | General Electric Company | Power converting apparatus having improved electro-thermal characteristics |
DE102013017085A1 (de) * | 2012-10-15 | 2014-04-17 | Wixpress Ltd. | System für eine tiefe Verknüpfung und Suchmaschinenunterstützung für Webseiten, in die eine Drittanwendung und Komponenten integriert sind |
KR101890752B1 (ko) * | 2012-11-01 | 2018-08-22 | 삼성전자 주식회사 | 균일한 병렬 스위치 특성을 갖는 파워모듈용 기판 및 이를 포함하는 파워모듈 |
KR102034717B1 (ko) * | 2013-02-07 | 2019-10-21 | 삼성전자주식회사 | 파워모듈용 기판, 파워모듈용 터미널 및 이들을 포함하는 파워모듈 |
CN111900156A (zh) | 2014-05-15 | 2020-11-06 | 克利公司 | 高电流、低切换损耗SiC功率模块 |
WO2015176985A1 (en) * | 2014-05-20 | 2015-11-26 | Abb Technology Ag | Semiconductor power module with low stray inductance |
JP6166701B2 (ja) * | 2014-08-22 | 2017-07-19 | 株式会社東芝 | 半導体装置 |
CN106415834B (zh) | 2014-11-28 | 2019-09-13 | 富士电机株式会社 | 半导体装置 |
JP6739453B2 (ja) * | 2015-05-22 | 2020-08-12 | アーベーベー・シュバイツ・アーゲーABB Schweiz AG | パワー半導体モジュール |
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US10749443B2 (en) * | 2017-01-13 | 2020-08-18 | Cree Fayetteville, Inc. | High power multilayer module having low inductance and fast switching for paralleling power devices |
WO2018202620A1 (en) * | 2017-05-02 | 2018-11-08 | Abb Schweiz Ag | Half-bridge module with coaxial arrangement of the dc terminals |
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2017
- 2017-11-27 JP JP2019528107A patent/JP7210446B2/ja active Active
- 2017-11-27 WO PCT/EP2017/080529 patent/WO2018096147A1/en unknown
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EP3545552A1 (en) | 2019-10-02 |
CN109997223A (zh) | 2019-07-09 |
US11127671B2 (en) | 2021-09-21 |
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