JP2018018972A - 光半導体装置 - Google Patents
光半導体装置 Download PDFInfo
- Publication number
- JP2018018972A JP2018018972A JP2016148506A JP2016148506A JP2018018972A JP 2018018972 A JP2018018972 A JP 2018018972A JP 2016148506 A JP2016148506 A JP 2016148506A JP 2016148506 A JP2016148506 A JP 2016148506A JP 2018018972 A JP2018018972 A JP 2018018972A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- waveguide
- active layer
- semiconductor device
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000005253 cladding Methods 0.000 claims description 28
- 210000001503 joint Anatomy 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/321—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures having intermediate bandgap layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32333—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm based on InGaAsP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34326—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on InGa(Al)P, e.g. red laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1017—Waveguide having a void for insertion of materials to change optical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2031—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers characterized by special waveguide layers, e.g. asymmetric waveguide layers or defined bandgap discontinuities
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
- Optical Integrated Circuits (AREA)
Abstract
【解決手段】n型半導体基板1の上にn型クラッド層2が設けられている。n型クラッド層2の上に半導体レーザの活性層3と導波路の導波路層4が設けられている。活性層3の側面は導波路層4の側面と対向している。活性層3及び導波路層4の上にp型クラッド層5が設けられている。中間層8が、活性層3の側面と導波路層4の側面との間、及びn型クラッド層2と導波路層4との間に設けられ、活性層3の上には設けられておらず、導波路層4のバンドギャップよりも大きいバンドギャップを有する。
【選択図】図1
Description
図1は、実施の形態1に係る光半導体装置を示す光の進行方向の断面図である。図の左側は半導体レーザであり、右側は導波路である。n型InP基板1の上にn型InPクラッド層2が設けられている。n型InPクラッド層2の上に半導体レーザの活性層3と導波路の導波路層4が設けられている。活性層3の側面は導波路層4の側面と対向している。両者の接合部分がバットジョイント界面である。活性層3及び導波路層4の上にp型InPクラッド層5が設けられている。
本実施の形態では、アンドープInP中間層8の代わりに、中間層としてp型InP層を用いる。図20は、実施の形態2のバットジョイント界面における電流密度のシミュレーション結果を示す図である。図19及び図20に示すように、本実施の形態では、比較例よりも界面での導波路層4側の電流密度を抑制することができ、実施の形態1よりも導波路層4への電子の流入を抑制することができる。
図21は、実施の形態3に係る光半導体装置を示す光の進行方向の断面図である。図の左側は半導体レーザであり、右側は導波路である。実施の形態1,2ではn型InP基板1を用いたが、本実施の形態ではp型半導体基板12を用いる。
Claims (6)
- n型半導体基板と、
前記n型半導体基板の上に設けられたn型クラッド層と、
前記n型クラッド層の上に設けられた半導体レーザの活性層と、
前記n型クラッド層の上に設けられ、前記活性層の側面と対向する側面を有する導波路の導波路層と、
前記活性層及び前記導波路層の上に設けられたp型クラッド層と、
前記活性層の前記側面と前記導波路層の前記側面との間、及び前記n型クラッド層と前記導波路層との間に設けられ、前記活性層の上には設けられておらず、前記導波路層のバンドギャップよりも大きいバンドギャップを有する中間層とを備えることを特徴とする光半導体装置。 - p型半導体基板と、
前記p型半導体基板の上に設けられたp型クラッド層と、
前記p型クラッド層の上に設けられた半導体レーザの活性層と、
前記p型クラッド層の上に設けられ、前記活性層の側面と対向する側面を有する導波路の導波路層と、
前記活性層及び前記導波路層の上に設けられたn型クラッド層と、
前記活性層の前記側面と前記導波路層の前記側面との間、前記p型クラッド層と前記導波路層との間、及び前記導波路層と前記n型クラッド層との間に設けられ、前記活性層の下には設けられておらず、前記導波路層のバンドギャップよりも大きいバンドギャップを有する中間層とを備えることを特徴とする光半導体装置。 - 前記活性層は多重量子井戸構造であり、前記導波路層はバルク構造又は量子井戸構造であることを特徴とする請求項1又は2に記載の光半導体装置。
- 前記中間層はアンドープ又はp型であることを特徴とする請求項1〜3の何れか1項に記載の光半導体装置。
- 前記中間層はInP、AlGaInAs又はInGaAsPであることを特徴とする請求項1〜4の何れか1項に記載の光半導体装置。
- 前記活性層及び前記導波路層はInGaAsP又はAlGaInAsであることを特徴とする請求項1〜5の何れか1項に記載の光半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016148506A JP6740780B2 (ja) | 2016-07-28 | 2016-07-28 | 光半導体装置 |
TW106104854A TWI670907B (zh) | 2016-07-28 | 2017-02-15 | 光半導體裝置 |
US15/454,202 US10374388B2 (en) | 2016-07-28 | 2017-03-09 | Optical semiconductor device |
CN201710633483.2A CN107666110B (zh) | 2016-07-28 | 2017-07-28 | 光半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016148506A JP6740780B2 (ja) | 2016-07-28 | 2016-07-28 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018018972A true JP2018018972A (ja) | 2018-02-01 |
JP6740780B2 JP6740780B2 (ja) | 2020-08-19 |
Family
ID=61010209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016148506A Active JP6740780B2 (ja) | 2016-07-28 | 2016-07-28 | 光半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10374388B2 (ja) |
JP (1) | JP6740780B2 (ja) |
CN (1) | CN107666110B (ja) |
TW (1) | TWI670907B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020038905A (ja) * | 2018-09-04 | 2020-03-12 | ルネサスエレクトロニクス株式会社 | 半導体レーザおよび半導体レーザの製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111971861B (zh) * | 2018-08-31 | 2024-01-30 | 华为技术有限公司 | 一种光学集成芯片 |
US10718898B1 (en) * | 2019-01-23 | 2020-07-21 | Nexus Photonics Llc | Integrated active devices with improved optical coupling to dielectric waveguides |
CN111541149B (zh) * | 2020-05-15 | 2021-06-08 | 陕西源杰半导体技术有限公司 | 一种10g抗反射激光器及其制备工艺 |
CN112217097A (zh) * | 2020-09-28 | 2021-01-12 | 武汉云岭光电有限公司 | 光通信半导体激光器及其含铝量子阱有源层对接生长方法 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290969A (ja) * | 1985-10-17 | 1987-04-25 | Matsushita Electric Ind Co Ltd | 光集積回路の製造方法 |
JPS62229990A (ja) * | 1986-03-31 | 1987-10-08 | Nippon Telegr & Teleph Corp <Ntt> | 半導体発光素子の製造法 |
JPH05251812A (ja) * | 1992-03-06 | 1993-09-28 | Nippon Telegr & Teleph Corp <Ntt> | 量子井戸構造光変調器付き分布帰還型半導体レーザおよびその製造方法 |
JPH10326942A (ja) * | 1997-03-26 | 1998-12-08 | Mitsubishi Electric Corp | 複合光デバイスとその製造方法 |
JP2000150925A (ja) * | 1998-11-05 | 2000-05-30 | Furukawa Electric Co Ltd:The | 導波路型集積半導体装置の作製方法 |
US6282219B1 (en) * | 1998-08-12 | 2001-08-28 | Texas Instruments Incorporated | Substrate stack construction for enhanced coupling efficiency of optical couplers |
JP2002299752A (ja) * | 2001-04-02 | 2002-10-11 | Sumitomo Electric Ind Ltd | 光集積素子の製造方法および光集積素子 |
JP2002314192A (ja) * | 2001-04-10 | 2002-10-25 | Sumitomo Electric Ind Ltd | 半導体光集積素子及びその製造方法 |
US20040146236A1 (en) * | 2003-01-24 | 2004-07-29 | Ruiyu Fang | Method of manufacturing integrated semiconductor devices and related devices |
JP2008071906A (ja) * | 2006-09-13 | 2008-03-27 | Fujitsu Ltd | 光半導体集積装置およびその製造方法 |
JP2009054721A (ja) * | 2007-08-24 | 2009-03-12 | Fujitsu Ltd | 半導体素子及び半導体素子の製造方法 |
JP2009088242A (ja) * | 2007-09-28 | 2009-04-23 | Eudyna Devices Inc | 光半導体装置およびその製造方法 |
JP2011014712A (ja) * | 2009-07-02 | 2011-01-20 | Mitsubishi Electric Corp | 光導波路集積型半導体光素子およびその製造方法 |
JP2011134863A (ja) * | 2009-12-24 | 2011-07-07 | Mitsubishi Electric Corp | 半導体光素子および集積型半導体光素子 |
JP2016134522A (ja) * | 2015-01-20 | 2016-07-25 | 三菱電機株式会社 | 光半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182882A (ja) * | 1987-01-26 | 1988-07-28 | Toshiba Corp | 光集積素子の製造方法 |
CN1061478C (zh) * | 1994-09-09 | 2001-01-31 | 特尔科迪亚技术股份有限公司 | 高温不用冷却的二极管激光器 |
US6985646B2 (en) * | 2003-01-24 | 2006-01-10 | Xponent Photonics Inc | Etched-facet semiconductor optical component with integrated end-coupled waveguide and methods of fabrication and use thereof |
EP1845321B1 (en) * | 2006-01-30 | 2017-07-26 | Whirlpool Corporation | Refrigerator with moisture adsorbing device |
JP2009230261A (ja) * | 2008-03-19 | 2009-10-08 | Kenwood Corp | 配信システム及び車載器 |
CN105355670B (zh) * | 2015-11-19 | 2017-03-22 | 中山德华芯片技术有限公司 | 一种含dbr结构的五结太阳能电池 |
-
2016
- 2016-07-28 JP JP2016148506A patent/JP6740780B2/ja active Active
-
2017
- 2017-02-15 TW TW106104854A patent/TWI670907B/zh active
- 2017-03-09 US US15/454,202 patent/US10374388B2/en active Active
- 2017-07-28 CN CN201710633483.2A patent/CN107666110B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290969A (ja) * | 1985-10-17 | 1987-04-25 | Matsushita Electric Ind Co Ltd | 光集積回路の製造方法 |
JPS62229990A (ja) * | 1986-03-31 | 1987-10-08 | Nippon Telegr & Teleph Corp <Ntt> | 半導体発光素子の製造法 |
JPH05251812A (ja) * | 1992-03-06 | 1993-09-28 | Nippon Telegr & Teleph Corp <Ntt> | 量子井戸構造光変調器付き分布帰還型半導体レーザおよびその製造方法 |
JPH10326942A (ja) * | 1997-03-26 | 1998-12-08 | Mitsubishi Electric Corp | 複合光デバイスとその製造方法 |
US6282219B1 (en) * | 1998-08-12 | 2001-08-28 | Texas Instruments Incorporated | Substrate stack construction for enhanced coupling efficiency of optical couplers |
JP2000150925A (ja) * | 1998-11-05 | 2000-05-30 | Furukawa Electric Co Ltd:The | 導波路型集積半導体装置の作製方法 |
JP2002299752A (ja) * | 2001-04-02 | 2002-10-11 | Sumitomo Electric Ind Ltd | 光集積素子の製造方法および光集積素子 |
JP2002314192A (ja) * | 2001-04-10 | 2002-10-25 | Sumitomo Electric Ind Ltd | 半導体光集積素子及びその製造方法 |
US20040146236A1 (en) * | 2003-01-24 | 2004-07-29 | Ruiyu Fang | Method of manufacturing integrated semiconductor devices and related devices |
JP2008071906A (ja) * | 2006-09-13 | 2008-03-27 | Fujitsu Ltd | 光半導体集積装置およびその製造方法 |
JP2009054721A (ja) * | 2007-08-24 | 2009-03-12 | Fujitsu Ltd | 半導体素子及び半導体素子の製造方法 |
JP2009088242A (ja) * | 2007-09-28 | 2009-04-23 | Eudyna Devices Inc | 光半導体装置およびその製造方法 |
JP2011014712A (ja) * | 2009-07-02 | 2011-01-20 | Mitsubishi Electric Corp | 光導波路集積型半導体光素子およびその製造方法 |
JP2011134863A (ja) * | 2009-12-24 | 2011-07-07 | Mitsubishi Electric Corp | 半導体光素子および集積型半導体光素子 |
JP2016134522A (ja) * | 2015-01-20 | 2016-07-25 | 三菱電機株式会社 | 光半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020038905A (ja) * | 2018-09-04 | 2020-03-12 | ルネサスエレクトロニクス株式会社 | 半導体レーザおよび半導体レーザの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6740780B2 (ja) | 2020-08-19 |
CN107666110A (zh) | 2018-02-06 |
CN107666110B (zh) | 2019-11-01 |
US20180034238A1 (en) | 2018-02-01 |
TWI670907B (zh) | 2019-09-01 |
US10374388B2 (en) | 2019-08-06 |
TW201817106A (zh) | 2018-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6740780B2 (ja) | 光半導体装置 | |
JP2009081249A (ja) | 半導体レーザ装置 | |
JP2015015396A (ja) | 光半導体素子 | |
JPH05243669A (ja) | 半導体レーザ素子 | |
JP5170869B2 (ja) | 光半導体素子及び光半導体素子の製造方法 | |
JP4472278B2 (ja) | 半導体レーザ素子 | |
JP5314435B2 (ja) | 集積光デバイス及びその製造方法 | |
JPH06181363A (ja) | 半導体レーザ及びその製造方法 | |
JPS61164287A (ja) | 半導体レ−ザ | |
CN111937260B (zh) | 半导体激光器及其制造方法 | |
JPS59145590A (ja) | 半導体レ−ザ装置 | |
WO2020245866A1 (ja) | 光デバイス | |
JPS61176181A (ja) | 半導体発光装置 | |
JPH03133189A (ja) | 高抵抗半導体層埋め込み型半導体レーザ | |
WO2020090078A1 (ja) | 光半導体装置、および光半導体装置の製造方法 | |
JP2008027952A (ja) | 半導体レーザ素子 | |
JPS6392078A (ja) | 半導体レ−ザ素子 | |
JP2001077475A (ja) | 半導体レーザ | |
JPH05226775A (ja) | 半導体レーザ素子 | |
JPH06283800A (ja) | 半導体レーザ | |
JP2001053385A (ja) | 半導体レーザ素子 | |
JP2000269606A (ja) | 半導体レーザ素子とその製造方法 | |
JP2007012851A (ja) | 半導体レーザ素子の製造方法 | |
JPH0582900A (ja) | 半導体レーザの製造方法 | |
JPH03116991A (ja) | 半導体レーザ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190228 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200121 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200204 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200323 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200623 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200706 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6740780 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |