JP2017520786A5 - - Google Patents

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Publication number
JP2017520786A5
JP2017520786A5 JP2016567854A JP2016567854A JP2017520786A5 JP 2017520786 A5 JP2017520786 A5 JP 2017520786A5 JP 2016567854 A JP2016567854 A JP 2016567854A JP 2016567854 A JP2016567854 A JP 2016567854A JP 2017520786 A5 JP2017520786 A5 JP 2017520786A5
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Japan
Prior art keywords
cells
integrated circuit
functional
array
lithography
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JP2016567854A
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Japanese (ja)
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JP2017520786A (ja
JP6415602B2 (ja
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Priority claimed from PCT/US2014/044105 external-priority patent/WO2015199682A1/en
Publication of JP2017520786A publication Critical patent/JP2017520786A/ja
Publication of JP2017520786A5 publication Critical patent/JP2017520786A5/ja
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JP2016567854A 2014-06-25 2014-06-25 機能セルのコンパクトアレイを形成するための技術 Active JP6415602B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/044105 WO2015199682A1 (en) 2014-06-25 2014-06-25 Techniques for forming a compacted array of functional cells

Publications (3)

Publication Number Publication Date
JP2017520786A JP2017520786A (ja) 2017-07-27
JP2017520786A5 true JP2017520786A5 (enExample) 2017-09-07
JP6415602B2 JP6415602B2 (ja) 2018-10-31

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JP2016567854A Active JP6415602B2 (ja) 2014-06-25 2014-06-25 機能セルのコンパクトアレイを形成するための技術

Country Status (7)

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US (1) US10217732B2 (enExample)
EP (1) EP3161854A4 (enExample)
JP (1) JP6415602B2 (enExample)
KR (1) KR20170026336A (enExample)
CN (1) CN106463354B (enExample)
TW (1) TWI565018B (enExample)
WO (1) WO2015199682A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106463354B (zh) 2014-06-25 2019-12-20 英特尔公司 用于形成功能单元的紧凑阵列的技术
KR102217246B1 (ko) * 2014-11-12 2021-02-18 삼성전자주식회사 집적회로 소자 및 그 제조 방법
US9577639B1 (en) * 2015-09-24 2017-02-21 Qualcomm Incorporated Source separated cell
US10109582B2 (en) * 2016-04-19 2018-10-23 Taiwan Semiconductor Manufacturing Company Limited Advanced metal connection with metal cut
KR101958518B1 (ko) * 2016-08-09 2019-03-15 매그나칩 반도체 유한회사 프로그래밍의 신뢰성이 개선된 otp 셀
CN107480359B (zh) * 2017-08-02 2021-04-30 复旦大学 先进纳米工艺下fpga面积建模方法
US10790395B2 (en) 2018-06-12 2020-09-29 International Business Machines Corporation finFET with improved nitride to fin spacing
CN110267186A (zh) * 2019-05-27 2019-09-20 深圳市中德听力技术有限公司 一种具有内置纯音信号发生器的自我验配助听器
CN110299356A (zh) * 2019-07-26 2019-10-01 宁波芯浪电子科技有限公司 一种用于mos管的静电保护方法

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH05298394A (ja) 1992-04-23 1993-11-12 Hitachi Ltd 自動配置方法
US6911730B1 (en) 2003-03-03 2005-06-28 Xilinx, Inc. Multi-chip module including embedded transistors within the substrate
US8658542B2 (en) * 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US20090255801A1 (en) * 2008-04-11 2009-10-15 Haas Alfred M Programmable Electrode Arrays and Methods for Manipulating and Sensing Cells and Substances Using Same
JP5167050B2 (ja) 2008-09-30 2013-03-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法およびマスクの製造方法
US8631374B2 (en) * 2011-03-30 2014-01-14 Synopsys, Inc. Cell architecture for increasing transistor size
JP2013149928A (ja) * 2012-01-23 2013-08-01 Canon Inc リソグラフィー装置および物品を製造する方法
JP6087506B2 (ja) * 2012-01-31 2017-03-01 キヤノン株式会社 描画方法及び物品の製造方法
US9012287B2 (en) 2012-11-14 2015-04-21 Taiwan Semiconductor Manufacturing Company, Ltd. Cell layout for SRAM FinFET transistors
US8839168B2 (en) * 2013-01-22 2014-09-16 Globalfoundries Inc. Self-aligned double patterning via enclosure design
CN106463354B (zh) 2014-06-25 2019-12-20 英特尔公司 用于形成功能单元的紧凑阵列的技术

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