JP2017508285A5 - - Google Patents

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Publication number
JP2017508285A5
JP2017508285A5 JP2016551197A JP2016551197A JP2017508285A5 JP 2017508285 A5 JP2017508285 A5 JP 2017508285A5 JP 2016551197 A JP2016551197 A JP 2016551197A JP 2016551197 A JP2016551197 A JP 2016551197A JP 2017508285 A5 JP2017508285 A5 JP 2017508285A5
Authority
JP
Japan
Prior art keywords
notch
detection module
wafer
notch detection
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016551197A
Other languages
English (en)
Japanese (ja)
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JP6521988B2 (ja
JP2017508285A (ja
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Publication date
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Priority claimed from PCT/US2015/015270 external-priority patent/WO2015123222A1/en
Publication of JP2017508285A publication Critical patent/JP2017508285A/ja
Publication of JP2017508285A5 publication Critical patent/JP2017508285A5/ja
Application granted granted Critical
Publication of JP6521988B2 publication Critical patent/JP6521988B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016551197A 2014-02-12 2015-02-10 ウェハノッチの検出 Active JP6521988B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461939131P 2014-02-12 2014-02-12
US61/939,131 2014-02-12
PCT/US2015/015270 WO2015123222A1 (en) 2014-02-12 2015-02-10 Wafer notch detection

Publications (3)

Publication Number Publication Date
JP2017508285A JP2017508285A (ja) 2017-03-23
JP2017508285A5 true JP2017508285A5 (enExample) 2018-03-22
JP6521988B2 JP6521988B2 (ja) 2019-05-29

Family

ID=53800566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016551197A Active JP6521988B2 (ja) 2014-02-12 2015-02-10 ウェハノッチの検出

Country Status (6)

Country Link
US (1) US10366483B2 (enExample)
JP (1) JP6521988B2 (enExample)
KR (1) KR102175021B1 (enExample)
CN (1) CN106030772B (enExample)
TW (1) TWI649553B (enExample)
WO (1) WO2015123222A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354373B2 (en) * 2017-04-26 2019-07-16 Kla-Tencor Corporation System and method for photomask alignment and orientation characterization based on notch detection
US11929277B2 (en) * 2019-09-06 2024-03-12 Kabushiki Kaisha Yaskawa Denki Wafer pre-aligner and method of pre-aligning wafer

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381004A (en) 1993-08-31 1995-01-10 Applied Materials, Inc. Particle analysis of notched wafers
US5825913A (en) * 1995-07-18 1998-10-20 Cognex Corporation System for finding the orientation of a wafer
JPH11121589A (ja) * 1997-10-09 1999-04-30 Nikon Corp 搬送方法および搬送装置、および露光装置
JPH11317439A (ja) * 1998-05-01 1999-11-16 Nec Corp 位置決め装置
JP2000031245A (ja) * 1998-07-08 2000-01-28 Kobe Steel Ltd ウェーハノッチ位置検出装置
US6559457B1 (en) * 2000-03-23 2003-05-06 Advanced Micro Devices, Inc. System and method for facilitating detection of defects on a wafer
US20050174583A1 (en) 2000-07-06 2005-08-11 Chalmers Scott A. Method and apparatus for high-speed thickness mapping of patterned thin films
US6327517B1 (en) 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
US6992482B2 (en) 2000-11-08 2006-01-31 Jentek Sensors, Inc. Magnetic field sensor having a switchable drive current spatial distribution
US6440821B1 (en) 2001-02-14 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for aligning wafers
JP2002280287A (ja) 2001-03-19 2002-09-27 Nikon Corp 位置検出方法、位置検出装置、露光方法、露光装置、及びデバイス製造方法
JP4947248B2 (ja) 2001-09-14 2012-06-06 Ｄｏｗａエレクトロニクス株式会社 ノッチ付き化合物半導体ウエハ
US6784071B2 (en) 2003-01-31 2004-08-31 Taiwan Semiconductor Manufacturing Company, Ltd. Bonded SOI wafer with <100> device layer and <110> substrate for performance improvement
WO2005008735A2 (en) 2003-07-14 2005-01-27 August Technology Corporation Photoresist edge bead removal measurement
US7280200B2 (en) 2003-07-18 2007-10-09 Ade Corporation Detection of a wafer edge using collimated light
JP4296885B2 (ja) * 2003-09-17 2009-07-15 オムロン株式会社 円形物におけるマーク検出方法、ノッチ検出方法、半導体ウェーハの向き検査方法、および半導体ウェーハの向き検査装置
JP4522360B2 (ja) * 2005-12-02 2010-08-11 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
JP5093858B2 (ja) 2007-04-27 2012-12-12 芝浦メカトロニクス株式会社 半導体ウェーハ処理装置及び基準角度位置検出方法
JP5066393B2 (ja) * 2007-06-06 2012-11-07 株式会社日立ハイテクノロジーズ 異物・欠陥検査・観察システム
JP2009096698A (ja) 2007-10-19 2009-05-07 Toshiba Corp ウェーハ及びその製造方法
DE102008002753B4 (de) 2007-12-19 2010-03-25 Vistec Semiconductor Systems Gmbh Verfahren zur optischen Inspektion, Detektion und Visualisierung von Defekten auf scheibenförmigen Objekten
JP5469839B2 (ja) 2008-09-30 2014-04-16 株式会社日立ハイテクノロジーズ 物体表面の欠陥検査装置および方法
US8334520B2 (en) 2008-10-24 2012-12-18 Hitachi High-Technologies Corporation Charged particle beam apparatus
JP5477133B2 (ja) * 2010-04-09 2014-04-23 日新イオン機器株式会社 ウェーハハンドリング方法およびイオン注入装置
JP5534926B2 (ja) 2010-05-06 2014-07-02 リンテック株式会社 位置検出装置及びこれを用いたアライメント装置
CN102347224B (zh) * 2010-08-02 2015-08-26 北京中科信电子装备有限公司 一种注入机用晶片缺口定位装置

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