TWI649553B - 晶圓缺口偵測 - Google Patents

晶圓缺口偵測 Download PDF

Info

Publication number
TWI649553B
TWI649553B TW104104793A TW104104793A TWI649553B TW I649553 B TWI649553 B TW I649553B TW 104104793 A TW104104793 A TW 104104793A TW 104104793 A TW104104793 A TW 104104793A TW I649553 B TWI649553 B TW I649553B
Authority
TW
Taiwan
Prior art keywords
wafer
image
gap
axis
notch
Prior art date
Application number
TW104104793A
Other languages
English (en)
Chinese (zh)
Other versions
TW201534895A (zh
Inventor
波瑞斯 伊佛瑞堤
Boris EFRATY
納辛 畢夏瑞
Nassim BISHARA
艾卡狄 西姆金
Arkadi SIMKIN
雪倫 亞若恩 伊許
Yaron Ish-Shalom
Original Assignee
美商克萊譚克公司
Kla-Tencor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商克萊譚克公司, Kla-Tencor Corporation filed Critical 美商克萊譚克公司
Publication of TW201534895A publication Critical patent/TW201534895A/zh
Application granted granted Critical
Publication of TWI649553B publication Critical patent/TWI649553B/zh

Links

Classifications

    • H10P72/53—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/20—Linear translation of whole images or parts thereof, e.g. panning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/42—Global feature extraction by analysis of the whole pattern, e.g. using frequency domain transformations or autocorrelation
    • H10P74/203—
    • H10P74/238—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20048—Transform domain processing
    • G06T2207/20056—Discrete and fast Fourier transform, [DFT, FFT]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
TW104104793A 2014-02-12 2015-02-12 晶圓缺口偵測 TWI649553B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461939131P 2014-02-12 2014-02-12
US61/939,131 2014-02-12

Publications (2)

Publication Number Publication Date
TW201534895A TW201534895A (zh) 2015-09-16
TWI649553B true TWI649553B (zh) 2019-02-01

Family

ID=53800566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104793A TWI649553B (zh) 2014-02-12 2015-02-12 晶圓缺口偵測

Country Status (6)

Country Link
US (1) US10366483B2 (enExample)
JP (1) JP6521988B2 (enExample)
KR (1) KR102175021B1 (enExample)
CN (1) CN106030772B (enExample)
TW (1) TWI649553B (enExample)
WO (1) WO2015123222A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354373B2 (en) 2017-04-26 2019-07-16 Kla-Tencor Corporation System and method for photomask alignment and orientation characterization based on notch detection
US11929277B2 (en) * 2019-09-06 2024-03-12 Kabushiki Kaisha Yaskawa Denki Wafer pre-aligner and method of pre-aligning wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090161097A1 (en) * 2007-12-19 2009-06-25 Vistec Semiconductor Systems Gmbh Method for optical inspection, detection and visualization of defects on disk-shaped Objects
US20110260057A1 (en) * 2008-10-24 2011-10-27 Tadashi Otaka Charged particle beam apparatus

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381004A (en) 1993-08-31 1995-01-10 Applied Materials, Inc. Particle analysis of notched wafers
US5825913A (en) * 1995-07-18 1998-10-20 Cognex Corporation System for finding the orientation of a wafer
JPH11121589A (ja) * 1997-10-09 1999-04-30 Nikon Corp 搬送方法および搬送装置、および露光装置
JPH11317439A (ja) * 1998-05-01 1999-11-16 Nec Corp 位置決め装置
JP2000031245A (ja) * 1998-07-08 2000-01-28 Kobe Steel Ltd ウェーハノッチ位置検出装置
US6559457B1 (en) * 2000-03-23 2003-05-06 Advanced Micro Devices, Inc. System and method for facilitating detection of defects on a wafer
US20050174583A1 (en) 2000-07-06 2005-08-11 Chalmers Scott A. Method and apparatus for high-speed thickness mapping of patterned thin films
US6327517B1 (en) 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
US6992482B2 (en) * 2000-11-08 2006-01-31 Jentek Sensors, Inc. Magnetic field sensor having a switchable drive current spatial distribution
US6440821B1 (en) 2001-02-14 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for aligning wafers
JP2002280287A (ja) 2001-03-19 2002-09-27 Nikon Corp 位置検出方法、位置検出装置、露光方法、露光装置、及びデバイス製造方法
JP4947248B2 (ja) 2001-09-14 2012-06-06 Ｄｏｗａエレクトロニクス株式会社 ノッチ付き化合物半導体ウエハ
US6784071B2 (en) 2003-01-31 2004-08-31 Taiwan Semiconductor Manufacturing Company, Ltd. Bonded SOI wafer with <100> device layer and <110> substrate for performance improvement
WO2005008735A2 (en) * 2003-07-14 2005-01-27 August Technology Corporation Photoresist edge bead removal measurement
US7280200B2 (en) 2003-07-18 2007-10-09 Ade Corporation Detection of a wafer edge using collimated light
JP4296885B2 (ja) * 2003-09-17 2009-07-15 オムロン株式会社 円形物におけるマーク検出方法、ノッチ検出方法、半導体ウェーハの向き検査方法、および半導体ウェーハの向き検査装置
JP4522360B2 (ja) * 2005-12-02 2010-08-11 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
KR101164310B1 (ko) 2007-04-27 2012-07-09 시바우라 메카트로닉스 가부시키가이샤 반도체 웨이퍼 처리 장치 및 기준각도 위치 검출 방법
JP5066393B2 (ja) * 2007-06-06 2012-11-07 株式会社日立ハイテクノロジーズ 異物・欠陥検査・観察システム
JP2009096698A (ja) 2007-10-19 2009-05-07 Toshiba Corp ウェーハ及びその製造方法
JP5469839B2 (ja) 2008-09-30 2014-04-16 株式会社日立ハイテクノロジーズ 物体表面の欠陥検査装置および方法
JP5477133B2 (ja) * 2010-04-09 2014-04-23 日新イオン機器株式会社 ウェーハハンドリング方法およびイオン注入装置
JP5534926B2 (ja) 2010-05-06 2014-07-02 リンテック株式会社 位置検出装置及びこれを用いたアライメント装置
CN102347224B (zh) * 2010-08-02 2015-08-26 北京中科信电子装备有限公司 一种注入机用晶片缺口定位装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090161097A1 (en) * 2007-12-19 2009-06-25 Vistec Semiconductor Systems Gmbh Method for optical inspection, detection and visualization of defects on disk-shaped Objects
US20110260057A1 (en) * 2008-10-24 2011-10-27 Tadashi Otaka Charged particle beam apparatus

Also Published As

Publication number Publication date
TW201534895A (zh) 2015-09-16
CN106030772B (zh) 2020-04-14
JP2017508285A (ja) 2017-03-23
KR20160120309A (ko) 2016-10-17
CN106030772A (zh) 2016-10-12
KR102175021B1 (ko) 2020-11-06
JP6521988B2 (ja) 2019-05-29
US20160086325A1 (en) 2016-03-24
WO2015123222A1 (en) 2015-08-20
US10366483B2 (en) 2019-07-30

Similar Documents

Publication Publication Date Title
JP5699788B2 (ja) スクリーン領域検知方法及びシステム
US8649593B2 (en) Image processing apparatus, image processing method, and program
WO2015014111A1 (zh) 一种光流跟踪方法和装置
JP6138861B2 (ja) 距離算出装置
JP2017528731A5 (enExample)
JPWO2014061372A1 (ja) 画像処理装置、画像処理方法および画像処理プログラム
WO2015037178A1 (ja) 姿勢推定方法及びロボット
KR101850835B1 (ko) 광선추적법을 이용한 이동 로봇의 실내 위치 추정방법
KR100951309B1 (ko) 광학식 모션 캡처 장비를 위한 다중 카메라 보정 방법
CN102956532B (zh) 用于对齐晶片以用于制造的系统和方法
JP2013186042A (ja) 距離算出装置及び距離算出方法
JP2016091053A (ja) 情報処理装置および容器形状の推定方法、ワークピッキングシステム、プログラム
KR102173244B1 (ko) Surf 특징점 추적 기반 영상 안정화 시스템
JP2014170368A (ja) 画像処理装置、方法及びプログラム並びに移動体
WO2009096520A1 (ja) 対応点探索装置および対応点探索方法
TWI649553B (zh) 晶圓缺口偵測
WO2019058487A1 (ja) ３次元復元画像処理装置、３次元復元画像処理方法及び３次元復元画像処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
CN112053401B (zh) 一种芯片拼接方法、装置、设备及存储介质
US20110085699A1 (en) Method and apparatus for tracking image patch considering scale
JP6165513B2 (ja) ハンドジェスチャトラッキングシステム
Miksch et al. Automatic extrinsic camera self-calibration based on homography and epipolar geometry
CN104937608A (zh) 道路区域检测
JP2012248004A (ja) 画像処理装置、画像認識装置及び方法
JP6080424B2 (ja) 対応点探索装置、そのプログラムおよびカメラパラメータ推定装置
TW201445509A (zh) 對位裝置及其方法