JP2017500394A5 - - Google Patents
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- Publication number
- JP2017500394A5 JP2017500394A5 JP2016535257A JP2016535257A JP2017500394A5 JP 2017500394 A5 JP2017500394 A5 JP 2017500394A5 JP 2016535257 A JP2016535257 A JP 2016535257A JP 2016535257 A JP2016535257 A JP 2016535257A JP 2017500394 A5 JP2017500394 A5 JP 2017500394A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- silicone rubber
- group
- room temperature
- rubber composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002379 silicone rubber Polymers 0.000 claims 13
- 239000004945 silicone rubber Substances 0.000 claims 13
- 239000000203 mixture Substances 0.000 claims 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 5
- 239000000843 powder Substances 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 125000005370 alkoxysilyl group Chemical group 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 229920001296 polysiloxane Polymers 0.000 claims 3
- 239000002318 adhesion promoter Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 239000012763 reinforcing filler Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 229910004283 SiO 4 Inorganic materials 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 239000007809 chemical reaction catalyst Substances 0.000 claims 1
- 239000007859 condensation product Substances 0.000 claims 1
- 238000006482 condensation reaction Methods 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 claims 1
- 229910021485 fumed silica Inorganic materials 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011541 reaction mixture Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013272669 | 2013-12-27 | ||
| JP2013272669 | 2013-12-27 | ||
| PCT/JP2014/006473 WO2015098118A1 (en) | 2013-12-27 | 2014-12-25 | Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017500394A JP2017500394A (ja) | 2017-01-05 |
| JP2017500394A5 true JP2017500394A5 (enExample) | 2018-02-01 |
| JP6574771B2 JP6574771B2 (ja) | 2019-09-11 |
Family
ID=53478014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016535257A Active JP6574771B2 (ja) | 2013-12-27 | 2014-12-25 | 室温硬化性シリコーンゴム組成物、その用途、および電子機器の補修方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10066138B2 (enExample) |
| EP (1) | EP3087143B1 (enExample) |
| JP (1) | JP6574771B2 (enExample) |
| KR (2) | KR102224557B1 (enExample) |
| CN (2) | CN113773505A (enExample) |
| TW (1) | TWI671360B (enExample) |
| WO (1) | WO2015098118A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102465009B1 (ko) * | 2016-08-19 | 2022-11-09 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 전기/전자 부품을 보호하기 위한 실온 경화성 유기폴리실록산 조성물 |
| WO2018151450A1 (en) * | 2017-02-20 | 2018-08-23 | Dow Silicones Corporation | Room-temperature-curable silicone composition and electric/electronic apparatus |
| KR20190013091A (ko) | 2017-07-31 | 2019-02-11 | 다우 실리콘즈 코포레이션 | 이중 경화성 수지 조성물, 그로부터 형성된 경화물, 및 그러한 경화물을 포함하는 전자 장치 |
| CA3091354A1 (en) * | 2018-02-22 | 2019-08-29 | Henkel IP & Holding GmbH | Moisture curable silicone polymer and uses thereof |
| TWI794401B (zh) * | 2018-03-21 | 2023-03-01 | 美商陶氏有機矽公司 | 可室溫固化有機聚矽氧烷組成物及電氣/電子設備 |
| TWI816787B (zh) | 2018-06-06 | 2023-10-01 | 美商陶氏有機矽公司 | 可濕氣固化有機聚矽氧烷組成物及電氣/電子設備 |
| WO2020226076A1 (ja) * | 2019-05-09 | 2020-11-12 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物、シリコーンゴム及び物品 |
| CN111437202A (zh) * | 2020-03-23 | 2020-07-24 | 点铂医疗科技（常州）有限公司 | 一种纤维增强聚合物义齿垫片材料及其制备方法 |
| WO2024210000A1 (ja) * | 2023-04-06 | 2024-10-10 | 株式会社寺岡製作所 | シリコーン組成物および粘着部材 |
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| US4687829A (en) * | 1986-03-03 | 1987-08-18 | Dow Corning Corporation | Method of adjusting physical properties in silicone elastomeric sealant |
| US4871827A (en) | 1986-03-03 | 1989-10-03 | Dow Corning Corporation | Method of improving shelf life of silicone elastomeric sealant |
| US4888404A (en) * | 1986-03-03 | 1989-12-19 | Dow Corning Corporation | Method of improving shelf life of silicone elastomeric sealant |
| US4711928A (en) * | 1986-03-03 | 1987-12-08 | Dow Corning Corporation | Moisture cured one-part RTV silicone sealant |
| JPH07113086B2 (ja) * | 1988-06-02 | 1995-12-06 | 東レ・ダウコーニング・シリコーン株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| US4898910A (en) * | 1988-09-26 | 1990-02-06 | Dow Corning Corporation | Modulus control in silicone sealant |
| GB8902183D0 (en) * | 1989-02-01 | 1989-03-22 | Perennator Gmbh | Elastomer-forming compositions |
| US5053442A (en) * | 1990-01-16 | 1991-10-01 | Dow Corning Corporation | Low modulus silicone sealants |
| US4962174A (en) * | 1990-01-18 | 1990-10-09 | Dow Corning Corporation | Preparation of alkoxysilethylene endblocked polydiorganosiloxane |
| US5210156A (en) * | 1991-08-22 | 1993-05-11 | Dow Corning Corporation | Stable, moisture-curable silicone pressure sensitive adhesives |
| US5281455A (en) * | 1991-08-22 | 1994-01-25 | Dow Corning Corporation | Laminate article comprising moisture-curable silicone pressure sensitive adhesive and release liner |
| US5208300A (en) * | 1991-08-22 | 1993-05-04 | Dow Corning Corporation | Solution-stable, moisture-curable silicone pressure sensitive adhesives |
| US5302671A (en) * | 1993-06-11 | 1994-04-12 | Dow Corning Corporation | Moisture-curable compositions containing aminoalkoxy-functional silicone |
| JPH07113083A (ja) | 1993-10-15 | 1995-05-02 | Nippon Steel Chem Co Ltd | コ−クス製造方法およびコ−クス炉の炉蓋 |
| US5340899A (en) | 1993-11-22 | 1994-08-23 | Dow Corning Corporation | Method for the preparation of polydimethylsiloxanes having low reactivity endgroups and high reactivity endgroups wherein the polydimethylsiloxanes contain ethylene chain linkages |
| DE69637190T2 (de) * | 1995-06-08 | 2008-04-30 | Dow Corning S.A. | Verfahren zum Abdichten von Fugen mit feuchthärtenden Organosiloxanzusammensetzungen |
| US5840794A (en) * | 1997-01-10 | 1998-11-24 | Dow Corning Corporation | Alkoxy functional sealants with rapid development of green strength |
| US5948854A (en) * | 1997-09-25 | 1999-09-07 | Dow Corning S.A. | Alkoxy-functional RTV compositions with increased green strength and increased storage stability |
| US6132664A (en) * | 1997-12-23 | 2000-10-17 | Dow Corning Corporation | Method of forming a seal in a confined configuration with an alkoxy-functional RTV composition |
| JP4494543B2 (ja) * | 1998-11-20 | 2010-06-30 | 東レ・ダウコーニング株式会社 | 室温硬化性シリコーンゴム組成物 |
| US6235832B1 (en) * | 1998-12-21 | 2001-05-22 | Dow Corning Corporation | RTV silicone compositions with rapid development of green strength |
| US6512072B1 (en) * | 2000-06-12 | 2003-01-28 | Dow Corning Corporation | Fast cure film forming formulation |
| JP4823431B2 (ja) * | 2001-01-30 | 2011-11-24 | 東レ・ダウコーニング株式会社 | 室温硬化性シリコーンゴム組成物 |
| US7271233B2 (en) * | 2001-05-30 | 2007-09-18 | Dow Corning Toray Silicone Co., Ltd. | Room-temperature-curable silicone rubber composition |
| JP2003049072A (ja) * | 2001-05-30 | 2003-02-21 | Dow Corning Toray Silicone Co Ltd | 室温硬化性シリコーンゴム組成物 |
| JP3824071B2 (ja) * | 2001-12-25 | 2006-09-20 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP3900267B2 (ja) * | 2002-05-09 | 2007-04-04 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP4088764B2 (ja) * | 2002-07-01 | 2008-05-21 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
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| JP4285108B2 (ja) | 2003-06-25 | 2009-06-24 | 東京エレクトロン株式会社 | トラップ装置、処理システム及び不純物除去方法 |
| JP4733937B2 (ja) | 2004-07-09 | 2011-07-27 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 |
| JP4799835B2 (ja) | 2004-07-09 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 |
| JP4803342B2 (ja) * | 2004-10-19 | 2011-10-26 | 信越化学工業株式会社 | 耐擦傷性表面被膜形成用シリコーンコーティング組成物及びそれを用いた被覆物品 |
| JP4811562B2 (ja) * | 2005-05-13 | 2011-11-09 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP5025917B2 (ja) * | 2005-06-15 | 2012-09-12 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物 |
| JP5015476B2 (ja) | 2006-03-01 | 2012-08-29 | 東レ・ダウコーニング株式会社 | 電極・電気回路の保護剤組成物 |
| JP2009007553A (ja) * | 2007-05-25 | 2009-01-15 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP4775600B2 (ja) * | 2008-11-26 | 2011-09-21 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP2012219113A (ja) * | 2011-04-04 | 2012-11-12 | Dow Corning Toray Co Ltd | 室温硬化性シリコーンゴム組成物 |
| CN102304323B (zh) * | 2011-07-22 | 2013-05-22 | 绵阳惠利电子材料有限公司 | 一种可室温固化的苯基硅树脂敷形涂料 |
| JP5930826B2 (ja) * | 2012-04-18 | 2016-06-08 | 株式会社Adeka | ポリシロキサン化合物および湿気硬化性樹脂組成物 |
-
2014
- 2014-12-25 EP EP14873670.5A patent/EP3087143B1/en active Active
- 2014-12-25 CN CN202111199371.3A patent/CN113773505A/zh active Pending
- 2014-12-25 KR KR1020187005498A patent/KR102224557B1/ko not_active Expired - Fee Related
- 2014-12-25 JP JP2016535257A patent/JP6574771B2/ja active Active
- 2014-12-25 CN CN201480070411.6A patent/CN105849201A/zh active Pending
- 2014-12-25 US US15/106,538 patent/US10066138B2/en active Active
- 2014-12-25 KR KR1020167020234A patent/KR20160103069A/ko not_active Ceased
- 2014-12-25 WO PCT/JP2014/006473 patent/WO2015098118A1/en not_active Ceased
- 2014-12-27 TW TW103145954A patent/TWI671360B/zh not_active IP Right Cessation
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