JP2017094580A - 配線構造、memsデバイス、液体噴射ヘッド、液体噴射装置、memsデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法 - Google Patents
配線構造、memsデバイス、液体噴射ヘッド、液体噴射装置、memsデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法 Download PDFInfo
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- 239000007788 liquid Substances 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000002347 injection Methods 0.000 title abstract description 9
- 239000007924 injection Substances 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 209
- 239000002245 particle Substances 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 28
- 239000000243 solution Substances 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 23
- 230000001681 protective effect Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000002788 crimping Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- -1 etc. Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/052—Ink-jet print cartridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/057—Micropipets, dropformers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/05—Arrays
- B81B2207/056—Arrays of static structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
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- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】第1の基板(12)に形成された接続端子列(22)に、第2の基板(30)の被接続端子列(57)が電気的に接続されてなる配線構造であって、接続端子列の両端部の端子並設方向側に、電気信号の送受に使用されないダミー端子(24)がそれぞれ設けられ、第1の基板と第2の基板との間に設けられた導電性粒子を含む異方性導電膜(9)は、ダミー端子に向かって延在し、異方性導電膜の端がダミー端子の表面上に設けられていることを特徴とする。
【選択図】図13
Description
第1の基板に形成された接続端子列に、第2の基板の被接続端子列が電気的に接続されてなる配線構造であって、
前記接続端子列の両端部の端子並設方向側に、電気信号の送受に使用されないダミー端子がそれぞれ設けられ、
前記第1の基板と前記第2の基板との間に設けられた導電性粒子を含む異方性導電膜は、前記ダミー端子に向かって延在し、前記異方性導電膜の端が前記ダミー端子の表面上に設けられていることを特徴とする。
前記異方性導電膜が、熱圧着治具によって前記剥離フィルムと前記第1の基板との間で加熱および押圧されて前記接続端子列および前記ダミー端子に仮圧着される工程と、
前記接続端子列および前記ダミー端子に仮圧着された異方性導電膜から前記剥離フィルムが剥離される工程と、
前記接続端子列の各接続端子と前記被接続端子列の各被接続端子とがそれぞれ対応するように前記第1の基板と前記第2の基板との相対位置が規定された状態で、前記第1の基板と前記第2の基板とが前記異方性導電膜を介在させて貼り合わされる工程と、
前記第1の基板と前記第2の基板とが、熱圧着治具により前記異方性導電膜を挟む方向に加熱および加圧されて圧着される工程と、
を経ることを特徴とする。
Claims (9)
- 第1の基板に形成された接続端子列に、第2の基板の被接続端子列が電気的に接続されてなる配線構造であって、
前記接続端子列の両端部の端子並設方向側に、電気信号の送受に使用されないダミー端子がそれぞれ設けられ、
前記第1の基板と前記第2の基板との間に設けられた導電性粒子を含む異方性導電膜は、前記ダミー端子に向かって延在し、前記異方性導電膜の端が前記ダミー端子の表面上に設けられていることを特徴とする配線構造。 - 前記端子並設方向に垂直な方向において、前記異方性導電膜の幅が前記ダミー端子の幅よりも小さく、前記異方性導電膜の少なくとも一方の端が前記ダミー端子の表面上に設けられていることを特徴とする請求項1に記載の配線構造。
- 前記ダミー端子の面積は、前記接続端子列を構成する複数の接続端子のうち最も大きい接続端子の面積に揃えられていることを特徴とする請求項1または請求項2に記載の配線構造。
- 請求項1から請求項3の何れか一項に記載の配線構造により電気的に接続された第1の基板および第2の基板を備えることを特徴とするMEMSデバイス。
- 請求項4に記載のMEMSデバイスを備えることを特徴とする液体噴射ヘッド。
- 請求項5に記載の液体噴射ヘッドを備えることを特徴とする液体噴射装置。
- 請求項4に記載のMEMSデバイスの製造方法であって、
可撓性を有する剥離フィルム上に形成された前記異方性導電膜が、前記接続端子列の端子並設方向における当該異方性導電膜の両端がそれぞれ接続端子列の両側のダミー端子の表面に位置する状態で前記第1の基板に貼着される工程と、
前記異方性導電膜が、熱圧着治具によって前記剥離フィルムと前記第1の基板との間で加熱および押圧されて前記接続端子列および前記ダミー端子に仮圧着される工程と、
前記接続端子列および前記ダミー端子に仮圧着された異方性導電膜から前記剥離フィルムが剥離される工程と、
前記接続端子列の各接続端子と前記被接続端子列の各被接続端子とがそれぞれ対応するように前記第1の基板と前記第2の基板との相対位置が規定された状態で、前記第1の基板と前記第2の基板とが前記異方性導電膜を介在させて貼り合わされる工程と、
前記第1の基板と前記第2の基板とが、熱圧着治具により前記異方性導電膜を挟む方向に加熱および加圧されて圧着される工程と、
を有することを特徴とするMEMSデバイスの製造方法。 - 請求項7に記載のMEMSデバイスの製造方法を含む液体噴射ヘッドの製造方法。
- 請求項8に記載の液体噴射ヘッドの製造方法を含む液体噴射装置の製造方法。
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JP2015228460A JP2017094580A (ja) | 2015-11-24 | 2015-11-24 | 配線構造、memsデバイス、液体噴射ヘッド、液体噴射装置、memsデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法 |
US15/354,864 US20170144438A1 (en) | 2015-11-24 | 2016-11-17 | Wiring structure, mems device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing mems device, method for manufacturing liquid ejecting head and method for manufacturing liquid ejecting apparatus |
CN201611038117.4A CN107020842A (zh) | 2015-11-24 | 2016-11-23 | Mems装置、喷射头、喷射装置及它们的制造方法、配线结构 |
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JP7147319B2 (ja) * | 2018-07-20 | 2022-10-05 | セイコーエプソン株式会社 | 液体噴射装置および液体噴射ヘッド |
CN109278409B (zh) * | 2018-08-16 | 2019-07-23 | 西安微电子技术研究所 | 一种mems压电打印喷头组件集成结构 |
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CN107020842A (zh) | 2017-08-08 |
US20170144438A1 (en) | 2017-05-25 |
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