JP2017057490A5 - - Google Patents

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Publication number
JP2017057490A5
JP2017057490A5 JP2016010266A JP2016010266A JP2017057490A5 JP 2017057490 A5 JP2017057490 A5 JP 2017057490A5 JP 2016010266 A JP2016010266 A JP 2016010266A JP 2016010266 A JP2016010266 A JP 2016010266A JP 2017057490 A5 JP2017057490 A5 JP 2017057490A5
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JP
Japan
Prior art keywords
less
particle size
amount
fine powder
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2016010266A
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English (en)
Japanese (ja)
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JP2017057490A (ja
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Publication date
Application filed filed Critical
Priority to EP16846625.8A priority Critical patent/EP3351655A4/en
Priority to SG10201913475PA priority patent/SG10201913475PA/en
Priority to US15/760,404 priority patent/US20180265963A1/en
Priority to SG11201802203UA priority patent/SG11201802203UA/en
Priority to PCT/JP2016/077459 priority patent/WO2017047754A1/ja
Priority to KR1020187006795A priority patent/KR102635337B1/ko
Priority to TW105130206A priority patent/TWI712698B/zh
Publication of JP2017057490A publication Critical patent/JP2017057490A/ja
Publication of JP2017057490A5 publication Critical patent/JP2017057490A5/ja
Priority to US16/986,331 priority patent/US11377726B2/en
Withdrawn legal-status Critical Current

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JP2016010266A 2015-09-18 2016-01-22 Co−Fe−B系合金ターゲット材 Withdrawn JP2017057490A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
EP16846625.8A EP3351655A4 (en) 2015-09-18 2016-09-16 sputter target
SG10201913475PA SG10201913475PA (en) 2015-09-18 2016-09-16 Sputtering target material
US15/760,404 US20180265963A1 (en) 2015-09-18 2016-09-16 Sputtering Target Material
SG11201802203UA SG11201802203UA (en) 2015-09-18 2016-09-16 Sputtering target material
PCT/JP2016/077459 WO2017047754A1 (ja) 2015-09-18 2016-09-16 スパッタリングターゲット材
KR1020187006795A KR102635337B1 (ko) 2015-09-18 2016-09-16 스퍼터링 타겟재
TW105130206A TWI712698B (zh) 2015-09-18 2016-09-19 濺鍍靶材
US16/986,331 US11377726B2 (en) 2015-09-18 2020-08-06 Sputtering target material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015184846 2015-09-18
JP2015184846 2015-09-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020074715A Division JP7084958B2 (ja) 2015-09-18 2020-04-20 Co-Fe-B系合金ターゲット材

Publications (2)

Publication Number Publication Date
JP2017057490A JP2017057490A (ja) 2017-03-23
JP2017057490A5 true JP2017057490A5 (enExample) 2019-12-05

Family

ID=58391141

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016010266A Withdrawn JP2017057490A (ja) 2015-09-18 2016-01-22 Co−Fe−B系合金ターゲット材
JP2020074715A Active JP7084958B2 (ja) 2015-09-18 2020-04-20 Co-Fe-B系合金ターゲット材

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020074715A Active JP7084958B2 (ja) 2015-09-18 2020-04-20 Co-Fe-B系合金ターゲット材

Country Status (6)

Country Link
US (2) US20180265963A1 (enExample)
EP (1) EP3351655A4 (enExample)
JP (2) JP2017057490A (enExample)
KR (1) KR102635337B1 (enExample)
SG (2) SG10201913475PA (enExample)
TW (1) TWI712698B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3391982B1 (en) * 2017-04-21 2023-08-16 Raytheon Technologies Corporation Systems, devices and methods for spark plasma sintering
TWI642800B (zh) * 2017-10-03 2018-12-01 光洋應用材料科技股份有限公司 鈷鉑錸基濺鍍靶材、其製法及磁記錄層
TWI658150B (zh) * 2018-02-05 2019-05-01 光洋應用材料科技股份有限公司 含鈷鉻鉑硼錸濺鍍靶材、含鈷鉻鉑硼錸層及其製法
JP7382142B2 (ja) * 2019-02-26 2023-11-16 山陽特殊製鋼株式会社 スパッタリングターゲット材に適した合金
JP7492831B2 (ja) * 2020-01-06 2024-05-30 山陽特殊製鋼株式会社 スパッタリングターゲット材
JP7506477B2 (ja) * 2020-01-06 2024-06-26 山陽特殊製鋼株式会社 スパッタリングターゲット材の製造方法
CN112371987A (zh) * 2020-11-13 2021-02-19 河南东微电子材料有限公司 一种铁钴硼铬铝合金粉末的制备方法
JP7205999B1 (ja) * 2021-09-09 2023-01-17 山陽特殊製鋼株式会社 スパッタリングターゲット材

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4127474B2 (ja) * 2002-02-04 2008-07-30 株式会社東芝 スパッタリングターゲット
JP4016399B2 (ja) 2003-04-30 2007-12-05 日立金属株式会社 Fe−Co−B合金ターゲット材の製造方法
US7141208B2 (en) 2003-04-30 2006-11-28 Hitachi Metals, Ltd. Fe-Co-B alloy target and its production method, and soft magnetic film produced by using such target, and magnetic recording medium and TMR device
JP2005320627A (ja) 2004-04-07 2005-11-17 Hitachi Metals Ltd Co合金ターゲット材の製造方法、Co合金ターゲット材および垂直磁気記録用軟磁性膜ならびに垂直磁気記録媒体
US20070017803A1 (en) 2005-07-22 2007-01-25 Heraeus, Inc. Enhanced sputter target manufacturing method
JP4331182B2 (ja) * 2006-04-14 2009-09-16 山陽特殊製鋼株式会社 軟磁性ターゲット材
CN102652184B (zh) 2009-12-11 2014-08-06 吉坤日矿日石金属株式会社 磁性材料溅射靶
JP5631659B2 (ja) 2010-08-24 2014-11-26 山陽特殊製鋼株式会社 垂直磁気記録媒体用軟磁性合金およびスパッタリングターゲット材並びに磁気記録媒体
JP5769059B2 (ja) * 2011-03-30 2015-08-26 日立金属株式会社 永久磁石薄膜用スパッタリングターゲット及びその製造方法
CN105102670B (zh) * 2013-03-22 2017-06-23 吉坤日矿日石金属株式会社 钨烧结体溅射靶及其制造方法
WO2015019513A1 (ja) * 2013-08-09 2015-02-12 Jx日鉱日石金属株式会社 ネオジム、鉄、ボロンを主成分とする希土類粉末又はスパッタリングターゲットの製造方法、同希土類元素からなる粉末又はスパッタリングターゲット及びネオジム、鉄、ボロンを主成分とする希土類磁石用薄膜又はその製造方法
KR20160075723A (ko) * 2013-11-28 2016-06-29 제이엑스금속주식회사 자성재 스퍼터링 타깃 및 그 제조 방법
JP6405261B2 (ja) 2014-05-01 2018-10-17 山陽特殊製鋼株式会社 磁気記録用軟磁性合金及びスパッタリングターゲット材並びに磁気記録媒体
SG11201704465WA (en) * 2015-03-04 2017-06-29 Jx Nippon Mining & Metals Corp Magnetic material sputtering target and method for producing same

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