JP2016540374A5 - - Google Patents

Download PDF

Info

Publication number
JP2016540374A5
JP2016540374A5 JP2016523293A JP2016523293A JP2016540374A5 JP 2016540374 A5 JP2016540374 A5 JP 2016540374A5 JP 2016523293 A JP2016523293 A JP 2016523293A JP 2016523293 A JP2016523293 A JP 2016523293A JP 2016540374 A5 JP2016540374 A5 JP 2016540374A5
Authority
JP
Japan
Prior art keywords
processing apparatus
semiconductor processing
carriage
transfer
sealable chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016523293A
Other languages
English (en)
Japanese (ja)
Other versions
JP6594304B2 (ja
JP2016540374A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/060893 external-priority patent/WO2015057959A1/en
Publication of JP2016540374A publication Critical patent/JP2016540374A/ja
Publication of JP2016540374A5 publication Critical patent/JP2016540374A5/ja
Application granted granted Critical
Publication of JP6594304B2 publication Critical patent/JP6594304B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016523293A 2013-10-18 2014-10-16 処理装置 Active JP6594304B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361892849P 2013-10-18 2013-10-18
US61/892,849 2013-10-18
US201361904908P 2013-11-15 2013-11-15
US61/904,908 2013-11-15
PCT/US2014/060893 WO2015057959A1 (en) 2013-10-18 2014-10-16 Processing apparatus

Publications (3)

Publication Number Publication Date
JP2016540374A JP2016540374A (ja) 2016-12-22
JP2016540374A5 true JP2016540374A5 (enExample) 2017-11-24
JP6594304B2 JP6594304B2 (ja) 2019-10-23

Family

ID=52828696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016523293A Active JP6594304B2 (ja) 2013-10-18 2014-10-16 処理装置

Country Status (5)

Country Link
US (1) US10777438B2 (enExample)
JP (1) JP6594304B2 (enExample)
KR (1) KR102316440B1 (enExample)
CN (1) CN105814677B (enExample)
WO (1) WO2015057959A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12444651B2 (en) 2009-08-04 2025-10-14 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US9653353B2 (en) * 2009-08-04 2017-05-16 Novellus Systems, Inc. Tungsten feature fill
US10256142B2 (en) 2009-08-04 2019-04-09 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US11437269B2 (en) 2012-03-27 2022-09-06 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US10381266B2 (en) 2012-03-27 2019-08-13 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
WO2015057959A1 (en) * 2013-10-18 2015-04-23 Brooks Automation, Inc. Processing apparatus
US9997405B2 (en) 2014-09-30 2018-06-12 Lam Research Corporation Feature fill with nucleation inhibition
WO2016069731A1 (en) * 2014-10-28 2016-05-06 Festo Corporation Universal end of arm robot tool
US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US10170320B2 (en) 2015-05-18 2019-01-01 Lam Research Corporation Feature fill with multi-stage nucleation inhibition
US9978605B2 (en) 2015-05-27 2018-05-22 Lam Research Corporation Method of forming low resistivity fluorine free tungsten film without nucleation
US9972504B2 (en) 2015-08-07 2018-05-15 Lam Research Corporation Atomic layer etching of tungsten for enhanced tungsten deposition fill
US9978610B2 (en) 2015-08-21 2018-05-22 Lam Research Corporation Pulsing RF power in etch process to enhance tungsten gapfill performance
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
JP6663774B2 (ja) * 2016-03-30 2020-03-13 東京エレクトロン株式会社 基板搬送方法及び基板処理システム
US10573522B2 (en) 2016-08-16 2020-02-25 Lam Research Corporation Method for preventing line bending during metal fill process
US10566211B2 (en) 2016-08-30 2020-02-18 Lam Research Corporation Continuous and pulsed RF plasma for etching metals
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
WO2018075262A1 (en) * 2016-10-18 2018-04-26 Mattson Technology, Inc. Systems and methods for workpiece processing
CN106671090B (zh) * 2016-11-15 2023-09-05 宁波中科莱恩机器人有限公司 双夹具型二次元模内机器人
US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
DE102017100507B4 (de) * 2017-01-12 2021-11-25 Ald Vacuum Technologies Gmbh Vorrichtung und Verfahren zur Beschichtung von Werkstücken
EP3596752B1 (en) 2017-03-15 2025-01-08 Lam Research Corporation Reduced footprint platform architecture with linear vacuum transfer module
JP6325174B1 (ja) 2017-04-04 2018-05-16 株式会社Ｍｕｊｉｎ 制御装置、ピッキングシステム、物流システム、プログラム、制御方法、及び、生産方法
CN110494257B (zh) 2017-04-04 2020-12-18 牧今科技 控制装置、拾取系统、物流系统、程序、控制方法以及生产方法
DE112017007394B4 (de) 2017-04-04 2020-12-03 Mujin, Inc. Informationsverarbeitungsvorrichtung, Greifsystem, Verteilersystem, Programm und Informationsverarbeitungsverfahren
CN115385039A (zh) 2017-04-04 2022-11-25 牧今科技 控制装置、信息处理装置、控制方法以及信息处理方法
CN110520259B (zh) 2017-04-04 2021-09-21 牧今科技 控制装置、拾取系统、物流系统、存储介质以及控制方法
CN107009354B (zh) * 2017-04-24 2020-05-12 上海宇航系统工程研究所 用于板块拼接的2sps+rrprr机器人抓取机构
US10903107B2 (en) 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
JP7609636B2 (ja) 2017-08-14 2025-01-07 ラム リサーチ コーポレーション ３次元垂直ｎａｎｄワード線用の金属充填プロセス
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
JP7295359B2 (ja) * 2018-03-20 2023-06-21 東京エレクトロン株式会社 統合的な計測を伴う基板処理ツール並びに使用方法
US11549175B2 (en) 2018-05-03 2023-01-10 Lam Research Corporation Method of depositing tungsten and other metals in 3D NAND structures
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
JP7231721B2 (ja) * 2018-10-04 2023-03-01 アプライド マテリアルズ インコーポレイテッド 搬送システム
JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
SG11202106002VA (en) 2018-12-05 2021-07-29 Lam Res Corp Void free low stress fill
WO2020123987A1 (en) 2018-12-14 2020-06-18 Lam Research Corporation Atomic layer deposition on 3d nand structures
US12261081B2 (en) 2019-02-13 2025-03-25 Lam Research Corporation Tungsten feature fill with inhibition control
US12103176B2 (en) * 2019-02-14 2024-10-01 Persimmon Technologies Corporation Linear robot with two-link arm
KR20210141762A (ko) 2019-04-11 2021-11-23 램 리써치 코포레이션 고 단차 커버리지 (step coverage) 텅스텐 증착
WO2020232074A1 (en) * 2019-05-14 2020-11-19 Mattson Technology, Inc. Plasma processing apparatus having a focus ring adjustment assembly
US12237221B2 (en) 2019-05-22 2025-02-25 Lam Research Corporation Nucleation-free tungsten deposition
KR20220047333A (ko) 2019-08-12 2022-04-15 램 리써치 코포레이션 텅스텐 증착
JP7511380B2 (ja) * 2020-05-01 2024-07-05 東京エレクトロン株式会社 処理システム
US12255089B2 (en) * 2020-07-02 2025-03-18 Applied Materials, Inc. Robot apparatus, systems, and methods for transporting substrates in electronic device manufacturing
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
EP4306260A4 (en) * 2021-03-24 2025-01-22 DMG Mori Co., Ltd. SUPPORT SYSTEM
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
JP7766480B2 (ja) * 2021-12-02 2025-11-10 東京エレクトロン株式会社 剥離システムおよび剥離方法
ES2989410T3 (es) * 2022-03-08 2024-11-26 Applied Mat Italia Srl Línea de procesamiento para procesar un sustrato utilizado para la fabricación de una celda solar y procedimiento de explotación de una línea de procesamiento para procesar un sustrato utilizado para la fabricación de una celda solar
CN114553058A (zh) * 2022-03-11 2022-05-27 史帅涛 一种多重磁悬浮装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
JPH10335413A (ja) * 1997-05-29 1998-12-18 Dainippon Screen Mfg Co Ltd 基板処理装置
DE19725527A1 (de) * 1997-06-17 1998-12-24 Philips Patentverwaltung Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
JP2004090186A (ja) * 2002-09-02 2004-03-25 Aitec Corp クリーン搬送ロボット
JP2004106105A (ja) * 2002-09-18 2004-04-08 Seiko Instruments Inc 搬送ロボット
JP4283559B2 (ja) 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
JP2004349503A (ja) * 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
JP4023543B2 (ja) * 2003-05-29 2007-12-19 東京エレクトロン株式会社 基板搬送装置および基板搬送方法ならびに真空処理装置
JP2005317656A (ja) 2004-04-27 2005-11-10 Tokyo Electron Ltd 真空処理装置
KR20070089197A (ko) * 2004-11-22 2007-08-30 어플라이드 머티어리얼스, 인코포레이티드 배치 처리 챔버를 사용한 기판 처리 기기
JP4841183B2 (ja) 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
US20080107507A1 (en) 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
JP2011199121A (ja) 2010-03-23 2011-10-06 Ulvac Japan Ltd 搬送装置
US9862554B2 (en) * 2011-10-26 2018-01-09 Brooks Automation, Inc. Semiconductor wafer handling and transport
TWI684229B (zh) * 2013-07-08 2020-02-01 美商布魯克斯自動機械公司 具有即時基板定心的處理裝置
WO2015057959A1 (en) * 2013-10-18 2015-04-23 Brooks Automation, Inc. Processing apparatus
US10134621B2 (en) * 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus

Similar Documents

Publication Publication Date Title
JP2016540374A5 (enExample)
KR102277372B1 (ko) 산업용 로봇
US9929034B2 (en) Substrate transfer device
KR102143966B1 (ko) 모듈식 수직 노 처리 시스템
US8788089B2 (en) Unloading system
KR102186668B1 (ko) 기판 처리 장치
TW201722811A (zh) 物品搬送設備
JP2004265947A (ja) 搬送装置及び真空処理装置並びに常圧搬送装置
JP2015508236A5 (enExample)
TWI544993B (zh) 具有可變機械手的四臂搬運機器人
WO2018054383A1 (zh) 晶圆传输装置
JP6628603B2 (ja) 水平多関節ロボットおよび製造システム
US20180182658A1 (en) Horizontal articulated robot
TWI521633B (zh) 工件搬送系統
TWI583607B (zh) Conveyor base and conveyor system
CN105398794A (zh) 流水线流出产品位置-角度调整设备
TWI656003B (zh) Substrate transfer system and method
TW201314827A (zh) 搬送車
ES2646219T3 (es) Aparato para procesar componentes de mobiliario, muebles y similares
WO2016167029A1 (ja) ワーク着脱装置
KR101692699B1 (ko) 웨이퍼 이송장치
KR20140122493A (ko) 이송장치를 지닌 병렬형 머니퓰레이터
JP2012164716A5 (enExample)
JP2014233817A (ja) 同心２軸ロボット
JP2011240456A (ja) 部品供給装置および組立システム