JP2016540374A5 - - Google Patents

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Publication number
JP2016540374A5
JP2016540374A5 JP2016523293A JP2016523293A JP2016540374A5 JP 2016540374 A5 JP2016540374 A5 JP 2016540374A5 JP 2016523293 A JP2016523293 A JP 2016523293A JP 2016523293 A JP2016523293 A JP 2016523293A JP 2016540374 A5 JP2016540374 A5 JP 2016540374A5
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JP
Japan
Prior art keywords
processing apparatus
semiconductor processing
carriage
transfer
sealable chamber
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JP2016523293A
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English (en)
Japanese (ja)
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JP2016540374A (ja
JP6594304B2 (ja
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Priority claimed from PCT/US2014/060893 external-priority patent/WO2015057959A1/en
Publication of JP2016540374A publication Critical patent/JP2016540374A/ja
Publication of JP2016540374A5 publication Critical patent/JP2016540374A5/ja
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Publication of JP6594304B2 publication Critical patent/JP6594304B2/ja
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JP2016523293A 2013-10-18 2014-10-16 処理装置 Active JP6594304B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361892849P 2013-10-18 2013-10-18
US61/892,849 2013-10-18
US201361904908P 2013-11-15 2013-11-15
US61/904,908 2013-11-15
PCT/US2014/060893 WO2015057959A1 (en) 2013-10-18 2014-10-16 Processing apparatus

Publications (3)

Publication Number Publication Date
JP2016540374A JP2016540374A (ja) 2016-12-22
JP2016540374A5 true JP2016540374A5 (enExample) 2017-11-24
JP6594304B2 JP6594304B2 (ja) 2019-10-23

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Family Applications (1)

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JP2016523293A Active JP6594304B2 (ja) 2013-10-18 2014-10-16 処理装置

Country Status (5)

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US (1) US10777438B2 (enExample)
JP (1) JP6594304B2 (enExample)
KR (1) KR102316440B1 (enExample)
CN (1) CN105814677B (enExample)
WO (1) WO2015057959A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10256142B2 (en) 2009-08-04 2019-04-09 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US9653353B2 (en) 2009-08-04 2017-05-16 Novellus Systems, Inc. Tungsten feature fill
US12444651B2 (en) 2009-08-04 2025-10-14 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US10381266B2 (en) 2012-03-27 2019-08-13 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US11437269B2 (en) 2012-03-27 2022-09-06 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US9997405B2 (en) 2014-09-30 2018-06-12 Lam Research Corporation Feature fill with nucleation inhibition
WO2016069731A1 (en) * 2014-10-28 2016-05-06 Festo Corporation Universal end of arm robot tool
US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US10170320B2 (en) 2015-05-18 2019-01-01 Lam Research Corporation Feature fill with multi-stage nucleation inhibition
US9978605B2 (en) 2015-05-27 2018-05-22 Lam Research Corporation Method of forming low resistivity fluorine free tungsten film without nucleation
US9972504B2 (en) 2015-08-07 2018-05-15 Lam Research Corporation Atomic layer etching of tungsten for enhanced tungsten deposition fill
US9978610B2 (en) 2015-08-21 2018-05-22 Lam Research Corporation Pulsing RF power in etch process to enhance tungsten gapfill performance
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
JP6663774B2 (ja) * 2016-03-30 2020-03-13 東京エレクトロン株式会社 基板搬送方法及び基板処理システム
US10573522B2 (en) 2016-08-16 2020-02-25 Lam Research Corporation Method for preventing line bending during metal fill process
US10566211B2 (en) 2016-08-30 2020-02-18 Lam Research Corporation Continuous and pulsed RF plasma for etching metals
KR102650824B1 (ko) * 2016-10-18 2024-03-26 매슨 테크놀로지 인크 워크피스 처리를 위한 시스템 및 방법
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
CN106671090B (zh) * 2016-11-15 2023-09-05 宁波中科莱恩机器人有限公司 双夹具型二次元模内机器人
US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
DE102017100507B4 (de) * 2017-01-12 2021-11-25 Ald Vacuum Technologies Gmbh Vorrichtung und Verfahren zur Beschichtung von Werkstücken
SG10202110040SA (en) * 2017-03-15 2021-10-28 Lam Res Corp Reduced footprint platform architecture with linear vacuum transfer module
DE112017007397B4 (de) * 2017-04-04 2021-09-30 Mujin, Inc. Steuervorrichtung, Greifsystem, Verteilersystem, Programm, Steuerverfahren und Herstellungsverfahren
DE112017007392B4 (de) 2017-04-04 2021-11-04 Mujin, Inc. Steuervorrichtung, Greifsystem, Verteilersystem, Programm, Steuerverfahren und Herstellungsverfahren
CN110520259B (zh) 2017-04-04 2021-09-21 牧今科技 控制装置、拾取系统、物流系统、存储介质以及控制方法
CN110621451B (zh) 2017-04-04 2021-07-06 牧今科技 信息处理装置、拾取系统、物流系统、程序以及信息处理方法
JP6258556B1 (ja) 2017-04-04 2018-01-10 株式会社Ｍｕｊｉｎ 制御装置、ピッキングシステム、物流システム、プログラム、制御方法、及び、生産方法
CN107009354B (zh) * 2017-04-24 2020-05-12 上海宇航系统工程研究所 用于板块拼接的2sps+rrprr机器人抓取机构
US10903107B2 (en) * 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
WO2019036292A1 (en) 2017-08-14 2019-02-21 Lam Research Corporation METHOD FOR METAL CASTING FOR THREE-DIMENSIONAL NAND AND VERTICAL WORDS LINE
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
KR102655137B1 (ko) * 2018-03-20 2024-04-04 도쿄엘렉트론가부시키가이샤 계측 통합형 기판 프로세싱 툴 및 그 이용 방법
WO2019213604A1 (en) 2018-05-03 2019-11-07 Lam Research Corporation Method of depositing tungsten and other metals in 3d nand structures
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
CN112840447B (zh) * 2018-10-04 2025-11-21 应用材料公司 运输系统
JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
CN113166929A (zh) 2018-12-05 2021-07-23 朗姆研究公司 无空隙低应力填充
JP7649741B2 (ja) 2018-12-14 2025-03-21 ラム リサーチ コーポレーション ３ｄ ｎａｎｄ構造上の原子層堆積
US12261081B2 (en) 2019-02-13 2025-03-25 Lam Research Corporation Tungsten feature fill with inhibition control
US12103176B2 (en) * 2019-02-14 2024-10-01 Persimmon Technologies Corporation Linear robot with two-link arm
KR20210141762A (ko) 2019-04-11 2021-11-23 램 리써치 코포레이션 고 단차 커버리지 (step coverage) 텅스텐 증착
KR102673033B1 (ko) * 2019-05-14 2024-06-07 매슨 테크놀로지 인크 포커스 링 조정 조립체를 갖는 플라즈마 처리 장치
US12237221B2 (en) 2019-05-22 2025-02-25 Lam Research Corporation Nucleation-free tungsten deposition
US12077858B2 (en) 2019-08-12 2024-09-03 Lam Research Corporation Tungsten deposition
JP7511380B2 (ja) * 2020-05-01 2024-07-05 東京エレクトロン株式会社 処理システム
US12255089B2 (en) 2020-07-02 2025-03-18 Applied Materials, Inc. Robot apparatus, systems, and methods for transporting substrates in electronic device manufacturing
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
EP4306260A4 (en) * 2021-03-24 2025-01-22 DMG Mori Co., Ltd. SUPPORT SYSTEM
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
JP7766480B2 (ja) * 2021-12-02 2025-11-10 東京エレクトロン株式会社 剥離システムおよび剥離方法
EP4272244B1 (en) * 2022-03-08 2024-07-10 Applied Materials Italia S.R.L. Processing line for processing a substrate used for the manufacture of a solar cell and method of operating a processing line for processing a substrate used for the manufacture of a solar cell
CN114553058A (zh) * 2022-03-11 2022-05-27 史帅涛 一种多重磁悬浮装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
JPH10335413A (ja) * 1997-05-29 1998-12-18 Dainippon Screen Mfg Co Ltd 基板処理装置
DE19725527A1 (de) * 1997-06-17 1998-12-24 Philips Patentverwaltung Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP2004090186A (ja) * 2002-09-02 2004-03-25 Aitec Corp クリーン搬送ロボット
JP2004106105A (ja) * 2002-09-18 2004-04-08 Seiko Instruments Inc 搬送ロボット
JP4283559B2 (ja) * 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
JP2004349503A (ja) 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
JP4023543B2 (ja) * 2003-05-29 2007-12-19 東京エレクトロン株式会社 基板搬送装置および基板搬送方法ならびに真空処理装置
JP2005317656A (ja) * 2004-04-27 2005-11-10 Tokyo Electron Ltd 真空処理装置
US20060156979A1 (en) 2004-11-22 2006-07-20 Applied Materials, Inc. Substrate processing apparatus using a batch processing chamber
JP4841183B2 (ja) 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
US20080107507A1 (en) 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
JP2011199121A (ja) 2010-03-23 2011-10-06 Ulvac Japan Ltd 搬送装置
CN104011845B (zh) * 2011-10-26 2018-05-11 布鲁克斯自动化公司 半导体晶片搬运和运输
TWI623994B (zh) * 2013-07-08 2018-05-11 布魯克斯自動機械公司 具有即時基板定心的處理裝置
JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US10134621B2 (en) * 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus

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