WO2018054383A1 - 晶圆传输装置 - Google Patents

晶圆传输装置 Download PDF

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Publication number
WO2018054383A1
WO2018054383A1 PCT/CN2017/103479 CN2017103479W WO2018054383A1 WO 2018054383 A1 WO2018054383 A1 WO 2018054383A1 CN 2017103479 W CN2017103479 W CN 2017103479W WO 2018054383 A1 WO2018054383 A1 WO 2018054383A1
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WIPO (PCT)
Prior art keywords
movable
clamping
wafer
assembly
base
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PCT/CN2017/103479
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English (en)
French (fr)
Inventor
王剑
许振杰
郑家旺
陈祥玉
王同庆
李昆
路新春
Original Assignee
清华大学
天津华海清科机电科技有限公司
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Publication of WO2018054383A1 publication Critical patent/WO2018054383A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the present invention relates to the field of wafer technology, and in particular, to a wafer transfer device.
  • a robot In the wafer manufacturing process, a robot is used to transfer between the process chambers of the various post-cleaning units.
  • the robot can be a joint robot or a Cartesian robot.
  • a joint robot or a Cartesian robot can transfer wafers from the side of the chamber, and the wafers enter and exit the chamber from the side.
  • the joint manipulator has several parts such as a slide rail, a body, an arm, and a claw.
  • the Cartesian robot can use the combination of the guide rail and the timing belt to realize the motion of the XYZ axis.
  • the above two robots have the following problems: (1) The joint robot or the Cartesian robot transports the wafer from the side of the process chamber, and the process chamber needs to be provided with a wafer access window on the side, which is prone to occur. Leakage or liquid spillage, which places high demands on the chamber seal. (2) The joint robot or the Cartesian coordinate robot transfers the wafer from the side of the chamber, which greatly increases the floor space of the equipment and increases the production cost.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent.
  • the present invention proposes a wafer transfer device that can avoid leakage and liquid detection, can reduce floor space, and reduce production costs.
  • a wafer transfer apparatus comprising: a wafer chucking assembly; a vertical moving component configured to drive the wafer chucking assembly to move vertically; a horizontally moving component, the horizontal movement The assembly is configured to drive the vertical movement assembly to move horizontally.
  • the wafer transfer apparatus of the present invention by providing the vertical moving component and the horizontal moving component, the wafer can be transported and outputted in the up and down direction, and the window can be prevented from being opened on the side of the process chamber, thereby avoiding leakage and liquid on the one hand.
  • Sputtering can reduce the sealing requirements of the process chamber, and on the other hand can reduce the footprint of the wafer transfer device and reduce the production cost of the wafer transfer device.
  • the vertical moving component and the horizontal moving component can also avoid the displacement error becoming larger and larger, and can ensure the working accuracy of the wafer transfer device.
  • the wafer transfer apparatus according to the present invention may further have the following technical features:
  • the vertical moving assembly includes: a first base, the first base is horizontally movably disposed on the horizontal moving assembly; a first driving member; a first movable lever, the a first movable rod is connected to the first driving member and mounted on the first base; a first movable member, the first movable member is connected to the wafer clamping assembly and disposed at the first activity a vertical portion of the rod to drive the first movable rod when the first driving member rotates Move to.
  • the first movable rod is a screw and the first movable rod is a threaded slider.
  • a first horizontal connecting arm is coupled between the first movable member and the wafer clamping assembly.
  • At least one side of the first base is provided with the first movable lever, and when the first movable lever is respectively disposed on two sides of the first base, each of the The first movable rods are correspondingly provided with the first driving member and the first movable member.
  • the horizontal movement assembly includes: a second base; a second drive member; a second movable lever, the second movable lever is mounted on the second base and coupled to the second drive
  • the second movable member is connected to the first base to drive the first base to move horizontally when the second driving member drives the second movable rod to rotate.
  • the second movable rod is a screw and the second movable rod is a threaded slider.
  • At least one of the second movable members is disposed on the second movable rod.
  • the wafer clamping assembly includes: a first clamping member having a first clamping end and a first movable end; a second clamping member, the The second clamping member has a second clamping end and a second movable end; the third driving member is configured to synchronously drive the first movable end and the second movable end to move in opposite or opposite directions, Wherein the first clamping end is opposite to the second clamping end for clamping the wafer.
  • the first clamping member and the second clamping member each include: a cantilever and a jaw, one end of the cantilever being configured as a movable end and the other end being mounted with a jaw,
  • the jaws are configured as grip ends.
  • the wafer clamping assembly includes: a first clamping member having a first clamping end and a first fixed end; a second clamping member, the The second clamping member has a second clamping end and a second movable end; the third driving member is configured to drive the second movable end to move axially, wherein the first clamping end Opposite the second clamping end for clamping the wafer.
  • FIG. 1 is a schematic view of a wafer transfer apparatus in accordance with an embodiment of the present invention.
  • FIG. 2 is a schematic view showing an operation state of a wafer transfer apparatus according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a wafer clamping assembly of a wafer transfer apparatus in accordance with an embodiment of the present invention.
  • Wafer transfer device 100 Wafer transfer device 100;
  • Wafer clamping assembly 10 Wafer clamping assembly 10; first clamping member 11; first clamping end 111; first movable end 112; second clamping member 12; second clamping end 121; second movable end 122; Piece 13;
  • Horizontal moving assembly 30 second base 31; second driving member 32; second movable rod 33; second movable member 34;
  • a wafer transfer apparatus 100 according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings. As shown in FIG. 2, the wafer transfer apparatus 100 is adapted to transfer wafers 200 between process chambers 300 to enable wafers. 200 is processed through multiple processes.
  • a wafer transfer apparatus 100 may include a wafer chucking assembly 10, a vertical moving assembly 20, and a horizontal moving assembly 30.
  • the wafer clamping assembly 10 is used to clamp the wafer 200, and the wafer clamping assembly 10 can maintain the mobile reliability of the wafer 200.
  • the vertical moving assembly 20 is configured to drive the wafer clamping assembly 10 to move vertically.
  • the window 310 of the process chamber 300 can be disposed on the upper side of the process chamber 300, and the vertical moving assembly 20 can drive the crystal.
  • the circular clamping assembly 10 is moved up and down so that the wafer 200 can be transported and output to the process chamber 300.
  • the horizontal moving assembly 30 is configured to drive the vertical moving assembly 20 to move horizontally. As shown in FIG. 3, a plurality of process chambers 300 are evenly spaced apart in the left-right direction, and the horizontal moving assembly 30 can drive the vertical moving assembly 20 to move in the left-right direction, since the wafer clamping assembly 10 is disposed in a vertical movement. On assembly 20, wafer chuck assembly 10 moves in the left and right direction with vertical moving assembly 20.
  • the vertical moving assembly 20 can drive the wafer clamping assembly 10 upward to enable the wafer 200 and wafer.
  • the clamping assembly 10 is disengaged from the process chamber 300, at which time the horizontal moving assembly 30 drives the vertical moving assembly 20 to move in the direction of the next process chamber 300 until the wafer 200 and wafer holder assembly 10 are in the next process.
  • the last vertical moving assembly 20 drives the wafer clamping assembly 10 to move vertically downwards to cause the wafer 200 to enter the next process chamber 300 for processing.
  • the wafer chuck assembly 10 includes a first clamp member 11, a second clamp member 12, and a third drive member 13.
  • the first clamping member 11 has a first clamping end 111 and a first movable end 112.
  • the second clamping member 12 has a second clamping end 121 and a second movable end 122.
  • the third driving member 13 is arranged to be synchronously driven.
  • a movable end 112 and a second movable end 122 move in opposite or opposite directions, wherein the first clamping end 111 and the second clamping end 121 are disposed opposite to each other for clamping the wafer 200.
  • the third driving member 13 moves the first movable end 112 and the second movable end 122 synchronously, so that the first clamping end 111 and the second clamping end 121 can be brought close to or away from the wafer 200.
  • the first movable end 112 and the second movable end 122 move toward each other, the first clamping end 111 and the second clamping end 121 are respectively adjacent to the wafer 200 until the first clamping end 111 and the second clamping end 121 are synchronized.
  • the wafer 200 is held.
  • the first clamping end 111 and the second clamping end 121 are respectively away from the wafer 200 until the first clamping end 111 and the second clamping end 121 are synchronized.
  • the wafer 200 is released.
  • the first clamping member 11 and the second clamping member 12 may each include: a cantilever and a clamping jaw, one end of the cantilever is configured as a movable end, and the other end of the cantilever is mounted with a clamping jaw.
  • the jaws are configured as grip ends.
  • the movable ends of the two cantilevers are respectively connected to the third driving member 13.
  • the third drive member 13 may be a gripper, a cylinder or a motor.
  • the wafer clamping assembly 10 can include a first clamping member, a second clamping member, and a third driving member.
  • the first clamping member has a first clamping end and a first fixed end
  • the second clamping member has a second clamping end and a second movable end
  • the third driving member is configured to drive the second movable end movement, wherein A clamping end is disposed opposite the second clamping end for holding the wafer 200. It can be understood that, in the process of clamping the wafer 200, the first fixed end is in a fixed position, and the third driving member drives the second movable end to move, so that the second clamping end gradually approaches the wafer 200 and drives the wafer.
  • the 200 is gradually approached to the first clamping end until the first clamping end and the second clamping end simultaneously clamp the wafer 200.
  • the third driving member drives the second movable end to gradually move away from the wafer 200, thereby implementing the loosening process of the wafer 200.
  • the vertical moving assembly 20 may include a first base 21, a first driving member 22, a first movable lever, and a first movable member.
  • the first base 21 is horizontally movable on the horizontal moving assembly 30, the first movable lever is connected to the first driving member 22, and the first movable lever is mounted on the first base 21, and the first movable member and the wafer are clamped.
  • the assembly 10 is coupled and the first movable member is disposed on the first movable lever to move in a vertical direction when the first drive member 22 drives the first movable lever to rotate. As shown in FIG.
  • the first base 21 extends in the up and down direction
  • the first movable lever extends in the up and down direction.
  • the first movable rod may be a screw and the first movable rod may be a threaded slider.
  • the first drive member 22 can be a motor or a cylinder.
  • a first horizontal connecting arm 23 may be connected between the first movable member and the wafer clamping assembly 10.
  • both the vertical moving assembly 20 and the horizontal moving assembly 30 are disposed obliquely above the process chamber 300 so that In order to prevent the particles or lubricating oil on the vertical moving component 20 and the horizontal moving component 30 from falling into the process chamber 300, the wafer 200 is contaminated, thereby ensuring the safety of the wafer 200 process.
  • the number of the vertical moving components 20 can be set according to actual conditions.
  • at least one side of the first base 21 is provided with a first movable lever.
  • first movable lever When the first movable lever is respectively disposed on two sides of the first base 21, each of the first movable levers is correspondingly disposed.
  • first drive member 22 There is a first drive member 22 and a first movable member. It can be understood that when the first movable rods are respectively disposed on both sides of the first base 21, the two vertical moving components 20 share one first base 21, which can make the wafer transfer apparatus 100 simple and reliable in structure.
  • the horizontal moving assembly 30 may include a second base 31, a second driving member 32, a second movable lever 33, and a second movable member 34.
  • the second movable rod 33 is mounted on the second base 31, and the second movable rod 33 is coupled to the second driving member 32, and the second movable member 34 is coupled to the first base 21 to drive the second movable rod at the second driving member 32.
  • the rotation 33 rotates, the first base 21 is horizontally moved.
  • the second base 31 extends in the horizontal direction
  • the second movable lever 33 is disposed on the second base 31, and the second movable lever 33 extends in the horizontal direction.
  • the second driving member 32 drives the second movable lever 33 to rotate
  • the second movable member 34 moves in the longitudinal direction of the second movable lever 33 (ie, the left-right direction shown in FIG. 1), and vertically moves the assembly 20 and the wafer.
  • the wafer 200 and the wafer chucking assembly 10 are moved in the left-right direction in synchronization with the second movable member 34, so that the wafer 200 can be moved directly above the window 310 of the next process chamber 300.
  • the second movable rod 33 may be a screw and the second movable rod 33 may be a threaded slider.
  • the second movable rod 33 is provided with at least one second movable member 34.
  • the number of the second movable members 34 can be set according to actual conditions.
  • the plurality of second movable members 34 are spaced apart on the second movable rods 33, and the plurality of second movable members 34 are
  • the plurality of vertical moving components 20 are in one-to-one correspondence, and the plurality of vertical moving components 20 and the plurality of wafer clamping components 10 are in one-to-one correspondence.
  • the plurality of second movable members 34 do not interfere with each other, and the operational reliability of the wafer transfer device 100 can be ensured.
  • the wafer transfer apparatus 100 of the embodiment of the present invention by providing the vertical moving component 20 and the horizontal moving component 30, the wafer 200 can be transported and outputted in the up and down direction, thereby avoiding opening a window on the side of the process chamber 300, thereby On the one hand, leakage and liquid sputtering can be avoided, the sealing requirement of the process chamber 300 can be reduced, and on the other hand, the footprint of the wafer transfer apparatus 100 can be reduced, and the production cost of the wafer transfer apparatus 100 can be reduced.
  • the vertical movement assembly 20 and the horizontal movement assembly 30 can also prevent the displacement error from increasing, and the operational accuracy of the wafer transfer apparatus 100 can be ensured.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种晶圆传输装置（100），晶圆传输装置（100）包括：晶圆夹持组件（10）；竖直移动组件（20），所述竖直移动组件（20）设置成驱动所述晶圆夹持组件（10）竖直移动；水平移动组件（30），所述水平移动组件（30）设置成驱动所述竖直移动组件（20）水平移动。通过设置竖直移动组件（20）和水平移动组件（30），可以在上下方向上输送和输出晶圆（200），可以避免在工艺腔室的侧面开设窗口，从而一方面可以避免泄露以及液体溅射，可以降低工艺腔室的密封要求，另一方面可以减小晶圆传输装置的占地面积，降低晶圆传输装置的生产成本。

Description

晶圆传输装置 技术领域
本发明涉及晶圆技术领域，尤其涉及一种晶圆传输装置。
背景技术
在晶圆生产制造过程中，采用机械手在各个后清洗单元的工艺腔室之间进行传输。机械手可以为关节机械手或直角坐标机械手，关节机械手或直角坐标机械手可以从腔室侧面传输晶圆，晶圆从侧面进出腔室。其中，关节机械手具有滑轨、本体、手臂、手爪等几部分。直角坐标机械手可采用导轨与同步带组合实现XYZ轴的运动。
但是，上述两种机械手在传输晶圆过程中，存在以下问题：(1)关节机械手或直角坐标机械手从工艺腔室侧面传输晶圆，需要工艺腔室在侧面设置晶圆进出的窗口，容易出现泄漏或液体溅出，这样对腔室密封具有很高的要求。(2)关节机械手或直角坐标机械手从腔室侧面传输晶圆，大大增加设备的占地面积，增大了生产成本。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明提出一种具晶圆传输装置，该晶圆传输装置可以避免泄露和液体检出，可以减小占地面积，降低生产成本。
根据本发明的晶圆传输装置，包括：晶圆夹持组件；竖直移动组件，所述竖直移动组件设置成驱动所述晶圆夹持组件竖直移动；水平移动组件，所述水平移动组件设置成驱动所述竖直移动组件水平移动。
根据本发明的晶圆传输装置，通过设置竖直移动组件和水平移动组件，可以在上下方向上输送和输出晶圆，可以避免在工艺腔室的侧面开设窗口，从而一方面可以避免泄露以及液体溅射，可以降低工艺腔室的密封要求，另一方面可以减小晶圆传输装置的占地面积，降低晶圆传输装置的生产成本。另外，竖直移动组件和水平移动组件还可以避免位移误差的不断变大，可以保证晶圆传输装置的工作准确性。
另外，根据本发明的晶圆传输装置还可以具有以下技术特征：
在本发明的一些示例中，所述竖直移动组件包括：第一底座，所述第一底座可水平移动地设置在所述水平移动组件上；第一驱动件；第一活动杆，所述第一活动杆与所述第一驱动件相连且安装在所述第一底座上；第一活动件，所述第一活动件与所述晶圆夹持组件相连且设置在所述第一活动杆上以在所述第一驱动件驱动所述第一活动杆转动时沿竖直方 向移动。
在本发明的一些示例中，所述第一活动杆为螺杆，所述第一活动杆为带有螺纹的滑块。
在本发明的一些示例中，所述第一活动件和所述晶圆夹持组件之间连接有第一水平连接臂。
在本发明的一些示例中，所述第一底座的至少一侧设置有所述第一活动杆，当所述第一底座的两侧分别设置有所述第一活动杆时，每个所述第一活动杆均对应设置有所述第一驱动件和所述第一活动件。
在本发明的一些示例中，所述水平移动组件包括：第二底座；第二驱动件；第二活动杆，所述第二活动杆安装在所述第二底座上且与所述第二驱动件相连；第二活动件，所述第二活动件与所述第一底座相连以在所述第二驱动件驱动所述第二活动杆转动时带动所述第一底座水平移动。
在本发明的一些示例中，所述第二活动杆为螺杆，所述第二活动杆为带有螺纹的滑块。
在本发明的一些示例中，所述第二活动杆上设置有至少一个所述第二活动件。
在本发明的一些示例中，所述晶圆夹持组件包括：第一夹持件，所述第一夹持件具有第一夹持端和第一活动端；第二夹持件，所述第二夹持件具有第二夹持端和第二活动端；第三驱动件，所述第三驱动件设置成同步驱动所述第一活动端和所述第二活动端相向或相反运动，其中，所述第一夹持端与所述第二夹持端相对设置以用于夹持晶圆。
在本发明的一些示例中，所述第一夹持件和所述第二夹持件均包括：悬臂和夹爪，所述悬臂的一端构造为活动端且另一端安装有夹爪，所述夹爪构造为夹持端。
在本发明的一些示例中，所述晶圆夹持组件包括：第一夹持件，所述第一夹持件具有第一夹持端和第一固定端；第二夹持件，所述第二夹持件具有第二夹持端和第二活动端；第三驱动件，所述第三驱动件设置成驱动所述第二活动端轴向移动，其中，所述第一夹持端与所述第二夹持端相对设置以用于夹持晶圆。
附图说明
图1是根据本发明实施例的晶圆传输装置的示意图；
图2是根据本发明实施例的晶圆传输装置的工作状态示意图；
图3是根据本发明实施例的晶圆传输装置的晶圆夹持组件的示意图。
附图标记：
晶圆传输装置100；
晶圆夹持组件10；第一夹持件11；第一夹持端111；第一活动端112；第二夹持件12；第二夹持端121；第二活动端122；第三驱动件13；
竖直移动组件20；第一底座21；第一驱动件22；第一水平连接臂23；
水平移动组件30；第二底座31；第二驱动件32；第二活动杆33；第二活动件34；
晶圆200；工艺腔室300；窗口310。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
下面参考附图详细描述根据本发明实施例的晶圆传输装置100，如图2所示，该晶圆传输装置100适于将晶圆200在各个工艺腔室300之间传输，以使得晶圆200经过多个工艺流程处理。
如图1和图2所示，根据本发明实施例的晶圆传输装置100可以包括：晶圆夹持组件10、竖直移动组件20和水平移动组件30。其中，晶圆夹持组件10用于夹持晶圆200，晶圆夹持组件10可以保持晶圆200的移动可靠性。竖直移动组件20设置成驱动晶圆夹持组件10竖直移动，如图3所示，工艺腔室300的窗口310可以设置在工艺腔室300的上侧，竖直移动组件20可以驱动晶圆夹持组件10上下移动，从而可以将晶圆200输送和输出该工艺腔室300的过程。由此，通过在上下方向上输送和输出晶圆200，可以避免在工艺腔室300的侧面开设窗口，从而一方面可以避免泄露以及液体溅射，可以降低工艺腔室300的密封要求，另一方面可以减小晶圆传输装置100的占地面积，降低晶圆传输装置100的生产成本。
水平移动组件30设置成驱动竖直移动组件20水平移动。如图3所示，多个工艺腔室300在左右方向上均匀间隔开设置，水平移动组件30可以驱动竖直移动组件20在左右方向上移动，由于晶圆夹持组件10设置在竖直移动组件20上，晶圆夹持组件10随竖直移动组件20在左右方向上移动。
当晶圆200在一个工艺腔室300内完成工艺处理后，需要进入到下一个工艺腔室300时，竖直移动组件20可以向上驱动晶圆夹持组件10，以使得晶圆200和晶圆夹持组件10脱离该工艺腔室300，此时，水平移动组件30驱动竖直移动组件20向下一个工艺腔室300的方向移动，直至晶圆200和晶圆夹持组件10位于下一个工艺腔室300的窗口310的正上方，最后竖直移动组件20驱动晶圆夹持组件10竖直向下移动，以使得晶圆200进入到下一个工艺腔室300内进行工艺处理。
其中，通过设置竖直移动组件20和水平移动组件30，还可以防止位移误差的不断变大，可以提高晶圆传输装置100的工作准确性。
下面详细描述晶圆夹持组件10的两种可选的布置形式。
根据本发明的一种优选实施例，如图3所示，晶圆夹持组件10包括：第一夹持件11、第二夹持件12和第三驱动件13。第一夹持件11具有第一夹持端111和第一活动端112，第二夹持件12具有第二夹持端121和第二活动端122，第三驱动件13设置成同步驱动第一活动端112和第二活动端122相向或相反运动，其中，第一夹持端111与第二夹持端121相对设置以用于夹持晶圆200。可以理解的是，第三驱动件13通过同步驱动第一活动端112和第二活动端122移动，可以使得第一夹持端111和第二夹持端121同步靠近或者远离晶圆200。当第一活动端112和第二活动端122相向运动时，第一夹持端111和第二夹持端121分别靠近晶圆200，直至第一夹持端111和第二夹持端121同步夹持住晶圆200。当第一活动端112和第二活动端122相反运动时，第一夹持端111和第二夹持端121分别远离晶圆200，直至第一夹持端111和第二夹持端121同步松开晶圆200。通过设置第一夹持件11和第二夹持件12，可以有效避免晶圆200表面在晶圆夹持组件10夹持晶圆200的过程中出现磨损，可以提高晶圆200的品质。
可选地，如图3所示，第一夹持件11和第二夹持件12均可以包括：悬臂和夹爪，悬臂的一端构造为活动端，而且悬臂的另一端安装有夹爪，夹爪构造为夹持端。两个悬臂的活动端分别与第三驱动件13相连。可选地，第三驱动件13可以气爪、气缸或者电机。
根据本发明的另一个优选实施例，晶圆夹持组件10可以包括：第一夹持件、第二夹持件和第三驱动件。第一夹持件具有第一夹持端和第一固定端，第二夹持件具有第二夹持端和第二活动端，第三驱动件设置成驱动第二活动端移动，其中，第一夹持端与第二夹持端相对设置以用于夹持晶圆200。可以理解的是，在夹持晶圆200的过程中，第一固定端处于固定位置，第三驱动件驱动第二活动端移动，从而第二夹持端逐渐靠近晶圆200，并且驱动晶圆200逐渐靠近第一夹持端，直至第一夹持端和第二夹持端同步夹持住晶圆200。在松开晶圆200的过程中，第三驱动件驱动第二活动端逐渐远离晶圆200，从而实现晶圆200的松开过程。
下面详细描述竖直移动组件20的一种可选的布置形式。如图1所示，竖直移动组件20可以包括：第一底座21、第一驱动件22、第一活动杆和第一活动件。第一底座21可以水平移动地设置在水平移动组件30上，第一活动杆与第一驱动件22相连，而且第一活动杆安装在第一底座21上，第一活动件与晶圆夹持组件10相连，而且第一活动件设置在第一活动杆上以在第一驱动件22驱动第一活动杆转动时沿竖直方向移动。如图1所示，第一底座21在上下方向上延伸，第一活动杆在上下方向上延伸。优选地，第一活动杆可以为螺杆，第一活动杆可以为带有螺纹的滑块。可选地，第一驱动件22可以为电机或者气缸。
优选地，如图1所示，第一活动件和晶圆夹持组件10之间可以连接有第一水平连接臂23。由此，竖直移动组件20和水平移动组件30均设置在工艺腔室300的斜上方，从而可 以避免竖直移动组件20和水平移动组件30上的零件颗粒或润滑油落入到工艺腔室300内，导致晶圆200受到污染，进而可以保证晶圆200工艺处理的安全性。
其中，竖直移动组件20的设置数量可以根据实际情况设定。根据本发明的一个优选实施例，第一底座21的至少一侧设置有第一活动杆，当第一底座21的两侧分别设置有第一活动杆时，每个第一活动杆均对应设置有第一驱动件22和第一活动件。可以理解的是，当第一底座21的两侧分别设置有第一活动杆时，两个竖直移动组件20共用一个第一底座21，可以使得晶圆传输装置100结构简单且可靠。
下面详细描述水平移动组件30的一种可选的布置形式。如图1所示，水平移动组件30可以包括：第二底座31、第二驱动件32、第二活动杆33和第二活动件34。第二活动杆33安装在第二底座31上，而且第二活动杆33与第二驱动件32相连，第二活动件34与第一底座21相连以在第二驱动件32驱动第二活动杆33转动时带动第一底座21水平移动。如图1所示，第二底座31在水平方向上延伸，第二活动杆33设置在第二底座31上，而且第二活动杆33沿水平方向延伸。当第二驱动件32驱动第二活动杆33转动时，第二活动件34在第二活动杆33的长度方向(即图1所示的左右方向)上移动，竖直移动组件20、晶圆200和晶圆夹持组件10同步随第二活动件34在左右方向上移动，从而可以使得晶圆200移动至下一个工艺腔室300的窗口310的正上方。可选地，第二活动杆33可以为螺杆，第二活动杆33可以为带有螺纹的滑块。
优选地，第二活动杆33上设置有至少一个第二活动件34。第二活动件34的数量可以根据实际情况设置，当第二活动件34为多个时，多个第二活动件34在第二活动杆33上间隔开设置，多个第二活动件34与多个竖直移动组件20一一对应，多个竖直移动组件20和多个晶圆夹持组件10一一对应。其中，多个第二活动件34彼此互不干涉，可以保证晶圆传输装置100的工作可靠性。
根据本发明实施例的晶圆传输装置100，通过设置竖直移动组件20和水平移动组件30，可以在上下方向上输送和输出晶圆200，可以避免在工艺腔室300的侧面开设窗口，从而一方面可以避免泄露以及液体溅射，可以降低工艺腔室300的密封要求，另一方面可以减小晶圆传输装置100的占地面积，降低晶圆传输装置100的生产成本。另外，竖直移动组件20和水平移动组件30还可以避免位移误差的不断变大，可以保证晶圆传输装置100的工作准确性。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以 在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (11)

  1. 一种晶圆传输装置，其特征在于，包括：
    晶圆夹持组件；
    竖直移动组件，所述竖直移动组件设置成驱动所述晶圆夹持组件竖直移动；
    水平移动组件，所述水平移动组件设置成驱动所述竖直移动组件水平移动。
  2. 根据权利要求1所述的晶圆传输装置，其特征在于，所述竖直移动组件包括：
    第一底座，所述第一底座可水平移动地设置在所述水平移动组件上；
    第一驱动件；
    第一活动杆，所述第一活动杆与所述第一驱动件相连且安装在所述第一底座上；
    第一活动件，所述第一活动件与所述晶圆夹持组件相连且设置在所述第一活动杆上以在所述第一驱动件驱动所述第一活动杆转动时沿竖直方向移动。
  3. 根据权利要求2所述的晶圆传输装置，其特征在于，所述第一活动杆为螺杆，所述第一活动杆为带有螺纹的滑块。
  4. 根据权利要求2所述的晶圆传输装置，其特征在于，所述第一活动件和所述晶圆夹持组件之间连接有第一水平连接臂。
  5. 根据权利要求2所述的晶圆传输装置，其特征在于，所述第一底座的至少一侧设置有所述第一活动杆，当所述第一底座的两侧分别设置有所述第一活动杆时，每个所述第一活动杆均对应设置有所述第一驱动件和所述第一活动件。
  6. 根据权利要求2所述的晶圆传输装置，其特征在于，所述水平移动组件包括：
    第二底座；
    第二驱动件；
    第二活动杆，所述第二活动杆安装在所述第二底座上且与所述第二驱动件相连；
    第二活动件，所述第二活动件与所述第一底座相连以在所述第二驱动件驱动所述第二活动杆转动时带动所述第一底座水平移动。
  7. 根据权利要求6所述的晶圆传输装置，其特征在于，所述第二活动杆为螺杆，所述第二活动杆为带有螺纹的滑块。
  8. 根据权利要求6所述的晶圆传输装置，其特征在于，所述第二活动杆上设置有至少一个所述第二活动件。
  9. 根据权利要求1所述的晶圆传输装置，其特征在于，所述晶圆夹持组件包括：
    第一夹持件，所述第一夹持件具有第一夹持端和第一活动端；
    第二夹持件，所述第二夹持件具有第二夹持端和第二活动端；
    第三驱动件，所述第三驱动件设置成同步驱动所述第一活动端和所述第二活动端相向 或相反运动，其中，
    所述第一夹持端与所述第二夹持端相对设置以用于夹持晶圆。
  10. 根据权利要求9所述的晶圆传输装置，其特征在于，所述第一夹持件和所述第二夹持件均包括：悬臂和夹爪，所述悬臂的一端构造为活动端且另一端安装有夹爪，所述夹爪构造为夹持端。
  11. 根据权利要求1所述的晶圆传输装置，其特征在于，所述晶圆夹持组件包括：
    第一夹持件，所述第一夹持件具有第一夹持端和第一固定端；
    第二夹持件，所述第二夹持件具有第二夹持端和第二活动端；
    第三驱动件，所述第三驱动件设置成驱动所述第二活动端移动，其中，
    所述第一夹持端与所述第二夹持端相对设置以用于夹持晶圆。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110170873A (zh) * 2019-06-24 2019-08-27 珠海格力智能装备有限公司 夹持机构
CN112967963A (zh) * 2021-02-26 2021-06-15 中国科学院合肥物质科学研究院 一种异形晶片上下片装置及其使用方法
WO2022193338A1 (zh) * 2021-03-19 2022-09-22 台湾积体电路制造股份有限公司 一种晶圆传送系统
WO2023035434A1 (zh) * 2021-09-10 2023-03-16 长鑫存储技术有限公司 晶圆传送位置的调整方法、调整装置及半导体设备

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CN106449510B (zh) * 2016-09-26 2020-05-22 华海清科股份有限公司 晶圆传输装置
CN108198770B (zh) * 2017-12-27 2020-04-28 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 传输晶圆方法及装置
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CN110153874A (zh) * 2019-06-25 2019-08-23 吉姆西半导体科技（无锡）有限公司 晶圆平坦化设备晶圆传送方法
CN112207655B (zh) * 2020-10-12 2022-07-15 华海清科股份有限公司 一种具有移动机械手的晶圆磨削设备
CN113838781B (zh) * 2021-09-23 2024-06-11 苏州博康智能科技有限公司 晶圆取送装置
CN114769200A (zh) * 2022-04-26 2022-07-22 四川上特科技有限公司 一种晶圆片清洗组件、清洗装置及清洗方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003104545A (ja) * 2001-10-02 2003-04-09 Takehide Hayashi フラットパネルの方向転換装置及びエッジグリップ式ロボット
CN102709215A (zh) * 2012-05-16 2012-10-03 启东市罗源光伏设备有限公司 太阳能组件排版机
CN102800559A (zh) * 2011-05-24 2012-11-28 北京北方微电子基地设备工艺研究中心有限责任公司 从料盒中取晶片的装置、晶片上料设备和晶片上料系统
CN106449510A (zh) * 2016-09-26 2017-02-22 天津华海清科机电科技有限公司 晶圆传输装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101740438B (zh) * 2008-11-13 2011-11-02 上海华虹Nec电子有限公司 硅片传送手臂及其使用方法
CN102768972B (zh) * 2012-07-11 2015-02-18 清华大学 晶圆干燥装置
CN105870045B (zh) * 2016-05-04 2018-05-18 中国电子科技集团公司第四十五研究所 晶圆搬运装置及使用方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003104545A (ja) * 2001-10-02 2003-04-09 Takehide Hayashi フラットパネルの方向転換装置及びエッジグリップ式ロボット
CN102800559A (zh) * 2011-05-24 2012-11-28 北京北方微电子基地设备工艺研究中心有限责任公司 从料盒中取晶片的装置、晶片上料设备和晶片上料系统
CN102709215A (zh) * 2012-05-16 2012-10-03 启东市罗源光伏设备有限公司 太阳能组件排版机
CN106449510A (zh) * 2016-09-26 2017-02-22 天津华海清科机电科技有限公司 晶圆传输装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110170873A (zh) * 2019-06-24 2019-08-27 珠海格力智能装备有限公司 夹持机构
CN110170873B (zh) * 2019-06-24 2024-02-27 珠海格力智能装备有限公司 夹持机构
CN112967963A (zh) * 2021-02-26 2021-06-15 中国科学院合肥物质科学研究院 一种异形晶片上下片装置及其使用方法
WO2022193338A1 (zh) * 2021-03-19 2022-09-22 台湾积体电路制造股份有限公司 一种晶圆传送系统
WO2023035434A1 (zh) * 2021-09-10 2023-03-16 长鑫存储技术有限公司 晶圆传送位置的调整方法、调整装置及半导体设备

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